Abstract: The present disclosure provides a foam molded product and a manufacturing method. The foam molded product is includes a foam body, an insert material having a display unit or a detection unit attached to the foam body, and a surface material affixed to a surface to which at least the insert material is attached. A manufacturing method includes: preparing a pair of molds including a first mold and a second mold; affixing an insert material and a surface material together such that the surface material is in contact with a molding surface of the first mold; closing the pair of molds; injecting a foam resin into a molding space formed by closing the molds; foaming the foam resin to form a foam body; opening the pair of molds; and removing a molded product in which the affixed part and the foam body are integrated.

Abstract: For example, the switching drive device 100 includes a driver 30 configured to drive an N-type semiconductor switch element, a current limiter 50 configured to limit a current fed to a boot capacitor BC1 included in a bootstrap circuit BTC, and a current controller 60 configured to control the operation of the current limiter 50. The current controller 60 is configured to drive the current limiter 50 to limit the current fed to the boot capacitor BC1 when the charge voltage across the boot capacitor BC1 is higher than a threshold value.

Abstract: A semiconductor device includes a substrate, a conductive portion, a sealing resin, a plurality of semiconductor chips, and a plurality of temperature detection elements. The substrate has a substrate obverse surface and a substrate reverse surface that face opposite sides in a thickness direction. The conductive portion is formed on the substrate obverse surface. The sealing resin covers at least a part of the substrate. The sealing resin also covers the entire conductive portion. The plurality of semiconductor chips are disposed on the substrate obverse surface. The plurality of temperature detection elements are disposed on the substrate obverse surface. The number of temperature detection elements is equal to or greater than the number of semiconductor chips.

Abstract: An electronic device includes: a substrate with obverse and reverse surfaces spaced apart in a thickness direction; an electronic element having an obverse surface formed with a first obverse surface electrode; a wiring portion on the substrate obverse surface and configured to transmit a control signal for the electronic element; a conduction member with obverse and reverse surfaces spaced apart in the thickness direction, where the reverse surface is joined to the wiring portion; a conductive first lead on the substrate obverse surface; and a first connecting member joined to the obverse surface of the conduction member and the first obverse surface electrode. The first lead includes a first pad portion spaced apart from the wiring portion and to which the electronic element is joined. The wiring portion and the first obverse surface electrode are electrically connected to each other via the conduction member and the first connecting member.

Abstract: An electronic device includes: an insulating substrate including an obverse surface facing a thickness direction; a wiring portion formed on the substrate obverse surface and made of a conductive material; a lead frame arranged on the substrate obverse surface; a first and a second semiconductor elements electrically connected to the lead frame; and a first control unit electrically connected to the wiring portion to operate the first semiconductor element as a first upper arm and operate the second semiconductor element as a first lower arm. The lead frame includes a first pad portion to which the first semiconductor element is joined and a second pad portion to which the second semiconductor element is joined. The first and second pad portions are spaced apart from the wiring portion and arranged in a first direction with a first separation region sandwiched therebetween, where the first direction is orthogonal to the thickness direction.

Abstract: An electronic device includes a first electronic component including a first main body, a second electronic component including a second main body, a mounting substrate having a mounting surface, and a heat dissipator having an attaching surface. The mounting surface and the attaching surface face each other in the z direction. The first main body and the second main body are disposed between the mounting substrate and the heat dissipator in the z direction and arranged side by side in the x direction. The first main body has a first front surface facing the attaching surface and a first back surface facing the mounting surface. The second main body has a second front surface facing the attaching surface and a second back surface facing the mounting surface. The dimension of the second main body in the z direction is smaller than the dimension of the first main body in the z direction. The first front surface and the second front surface overlap with each other as viewed in the x direction.

Abstract: A semiconductor device includes a substrate, a conductive part, a controller module and a sealing resin. The substrate has a substrate obverse surface and a substrate reverse surface facing away from each other in a z direction. The conductive part is made of an electrically conductive material on the substrate obverse surface. The controller module is disposed on the substrate obverse surface and electrically connected to the conductive part. The sealing resin covers the controller module and at least a portion of the substrate. The conductive part includes an overlapping wiring trace having an overlapping portion overlapping with the electronic component as viewed in the z direction. The overlapping portion of the overlapping wiring trace is not electrically bonded to the controller module.

Abstract: A switch driving device includes a gate driver, a bootstrap circuit, a current limiting portion, and a current control portion. The gate driver drives an N-type semiconductor switch element. The bootstrap circuit includes a boot capacitor and a boot diode and applies a voltage to the gate driver. The current limiting portion limits a current to be supplied to the boot capacitor. The current control portion controls operations of the current limiting portion. The current limiting portion is provided on a path that electrically connects the boot capacitor and the boot diode to each other.

Abstract: A switch driving device includes a gate driver, a bootstrap circuit, a current limiting portion, and a current control portion. The gate driver drives an N-type semiconductor switch element. The bootstrap circuit includes a boot capacitor and a boot diode and applies a voltage to the gate driver. The current limiting portion limits a current to be supplied to the boot capacitor. The current control portion controls operations of the current limiting portion. The current limiting portion is provided on a path that electrically connects the boot capacitor and the boot diode to each other.

Abstract: For example, the switching drive device 100 includes a driver 30 configured to drive an N-type semiconductor switch element, a current limiter 50 configured to limit a current fed to a boot capacitor BC1 included in a bootstrap circuit BTC, and a current controller 60 configured to control the operation of the current limiter 50. The current controller 60 is configured to drive the current limiter 50 to limit the current fed to the boot capacitor BC1 when the charge voltage across the boot capacitor BC1 is higher than a threshold value.

Abstract: A vehicle includes a fuel tank disposed adjacent to a propeller shaft in a widthwise direction of the vehicle, and a differential unit coupled to a rear end of the propeller shaft. The differential unit includes a differential gear coupled to the rear end of the propeller shaft, a housing positioned rearward of the fuel tank to accommodate the differential gear, a bracket member fixed to the rear sub-frame, a plurality of bolts that fasten the housing and a first bracket together, and a stay member provided separate from the bolts to couple the housing and the first bracket together.

Abstract: A motor drive device in which the torque vector of the motor is controlled so that the correlation between the number of pulses of a clock signal and the phase of the torque vector of the motor is held in common for multiple excitation methods. The excitation method having the greatest number of steps is used as a reference, and the torque vector of the motor is maintained in the same phase as before switching when the excitation method is switched. The torque vector is in the closest phase in the rotation direction of the motor when there is no phase that is the same as the phase prior to switching.

Abstract: A vehicle includes a fuel tank disposed adjacent to a propeller shaft in a widthwise direction of the vehicle, and a differential unit coupled to a rear end of the propeller shaft. The differential unit includes a differential gear coupled to the rear end of the propeller shaft, a housing positioned rearward of the fuel tank to accommodate the differential gear, a bracket member fixed to the rear sub-frame, a plurality of bolts that fasten the housing and a first bracket together, and a stay member provided separate from the bolts to couple the housing and the first bracket together.

Abstract: In the motor drive device (1) of the present invention, a signal generator (2) for generating control signals DVS of a parallel input method from control signals INS of a clock input method is configured so as to generate control signals DVS of the second input method from the control signals INS of the first input method and to control the torque vector of the motor (4) so that the correlation between the number of pulses of the clock signal CLK and the phase of the torque vector of the motor (4) is held in common for all the excitation methods, with the excitation method having the greatest number of steps being used as a reference, that the torque vector of the motor (4) as a rule is maintained in the same phase as before switching when the excitation method is switched, and that the torque vector is in the closest phase in the rotation direction of the motor (4) in a case in which there is no phase that is the same as the phase prior to switching.

Abstract: The present invention relates to base fabrics for ink ribbons used in impact printers, not allowing the graphic spots to occur.They are woven fabrics composed of synthetic multi-filament yarns, the warp of which are 30 to 50 D in yarn thickness and 330 T/M to 600 T/M in the number of twist.