Abstract: A semiconductor device having a molded package includes a semiconductor chip, a thick-film lead electrode to which the semiconductor chip is die-bonded, a thin-film lead electrode having a thickness smaller than that of the thick-film lead electrode, a wire which electrically connects the semiconductor chip to the thin-film lead wire, and a molding material in which the semiconductor chip and the wire are encapsulated. A portion of a lower surface of the thick-film lead electrode is exposed at a package lower surface as a heat dissipating electrode. A portion of an upper surface of the thin-film lead electrode is exposed at a package upper surface as an input/output electrode. A portion of an upper surface of the thick-film lead electrode is exposed at the package upper surface as a grounding electrode.

Abstract: There is provided a data processing device able to surely eject a recording medium out of a main body of the device even when the recording medium is received in a case while a locking member having adherence and elasticity of the case is locked with a center hole of the recording medium. A CD player includes: a main body of the device 3; a carrying unit 5 for ejecting and retracting a CD 2 from the main body of the device 3; a clamping and reading out unit 6 for reading out data recorded on the CD 2; and a microcomputer 4. The carrying unit 5 includes: a disc guide 17; and a roller arm 18 having a carrying roller 20. The microcomputer 4 makes the turntable 26 of the clamping and reading out unit 6 rotate while the CD 2 is held between the disc guide 17 and the carrying roller 20 when the carrying unit 5 fails to eject the CD 2 out of the main body of the device 3.

Abstract: A semiconductor device having a molded package includes a semiconductor chip, a thick-film lead electrode to which the semiconductor chip is die-bonded, a thin-film lead electrode having a thickness smaller than that of the thick-film lead electrode, a wire which electrically connects the semiconductor chip to the thin-film lead wire, and a molding material in which the semiconductor chip and the wire are encapsulated. A portion of a lower surface of the thick-film lead electrode is exposed at a package lower surface as a heat dissipating electrode. A portion of an upper surface of the thin-film lead electrode is exposed at a package upper surface as an input/output electrode. A portion of an upper surface of the thick-film lead electrode is exposed at the package upper surface as a grounding electrode.

Abstract: A shutter device includes a shutter member which rotates about a first rotational axis and a swinging arm for the shutter member by engaging the shutter member. The shutter member has an insertion preventing portion which, by being rotated by the swinging arm rotating about a second rotational axis, is positioned at a preventing position for preventing the insertion of a recording medium by covering at least a portion of an opening for inserting the recording medium and at an open position enabling the insertion and ejection of the recording medium by opening the opening. Engaging portions of the shutter member and the swinging arm are provided between the first rotational axis and the position of the insertion preventing portion in the shutter member.

Abstract: A shutter device includes a shutter member which rotates about a first rotational axis and a swinging arm for the shutter member by engaging the shutter member. The shutter member has an insertion preventing portion which, by being rotated by the swinging arm rotating about a second rotational axis, is positioned at a preventing position for preventing the insertion of a recording medium by covering at least a portion of an opening for inserting the recording medium and at an open position enabling the insertion and ejection of the recording medium by opening the opening. Engaging portions of the shutter member and the swinging arm are provided between the first rotational axis and the position of the insertion preventing portion in the shutter member.