Abstract: A head-mounted display device includes an image display unit (300a, 300b) configured to emit image light, a light guide member (100a, 100b) configured to guide the image light and emit the image light to eyes of a wearer who wears the head-mounted display device, and a relay optical system (201a, 201b) arranged between the image display unit and the light guide member, and configured to relay the image light from the image display unit to the light guide member, and form an intermediate image at least once before the image light enters the light guide member.

Abstract: A first aspect of the present invention is carbon fiber wherein the surface of a monofilament has a center line average roughness Ra of 6.0 nm or more and 13 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. A second aspect of the present invention is carbon fiber precursor acrylic fiber wherein the surface of a monofilament has a center line average roughness Ra of 18 nm or more and 27 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. The carbon fiber according to the first aspect is obtained by stabilizing and carbonizing under specific conditions the carbon fiber precursor acrylic fiber according to the second aspect.

Abstract: A diverting agent and method for temporarily filling fractures. The diverting agent contains a powder-like polyvinyl alcohol-based resin (P1) and a pellet-like polyvinyl alcohol-based resin (P2), and has an adsorption coefficient kc of 0.01 or more and 1 or less.

Abstract: A film-like graphite that satisfies the following condition (1) or condition (2) described below. Condition (1): a graphite crystal orientation degree P is 96% or more with respect to a film plane. Condition (2): a graphite crystal orientation degree P is 94% or more with respect to a film plane and a thickness is 42 ?m or more.

Abstract: A method for manufacturing a semiconductor device includes the steps of: preparing a semiconductor substrate including a first semiconductor layer and a second semiconductor layer; and irradiating the semiconductor substrate with laser light from the first semiconductor layer side to divide the semiconductor substrate into individual semiconductor chips. The first semiconductor layer includes a semiconductor material transparent to the laser light. The second semiconductor layer includes a semiconductor material opaque to the laser light. In the step of irradiating with the laser light, laser light having intensity that makes the semiconductor material of the first semiconductor layer opaque to the laser light is irradiated.

Abstract: A semiconductor element manufacturing method according to the invention is such that a focal spot form of a laser light is an ellipse, and irradiation with the laser light is concentrated on a projected division line of an interface between a semiconductor substrate and a fixing sheet, which is a vaporizing pressure confining sheet, and vaporizing pressure generated by the irradiation is confined between the semiconductor substrate and the fixing sheet, and caused to act as a bending force on the semiconductor substrate, and an initial crack is extended. Because of this, energy of the laser light can be reduced, heat damage to an element region of the semiconductor substrate and debris can be reduced, and a division face with good flatness can be stably obtained.

Abstract: A first aspect of the present invention is carbon fiber wherein the surface of a monofilament has a center line average roughness Ra of 6.0 nm or more and 13 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. A second aspect of the present invention is carbon fiber precursor acrylic fiber wherein the surface of a monofilament has a center line average roughness Ra of 18 nm or more and 27 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. The carbon fiber according to the first aspect is obtained by stabilizing and carbonizing under specific conditions the carbon fiber precursor acrylic fiber according to the second aspect.

Abstract: A method for manufacturing a semiconductor device includes the steps of: preparing a semiconductor substrate including a first semiconductor layer and a second semiconductor layer; and irradiating the semiconductor substrate with laser light from the first semiconductor layer side to divide the semiconductor substrate into individual semiconductor chips. The first semiconductor layer includes a semiconductor material transparent to the laser light. The second semiconductor layer includes a semiconductor material opaque to the laser light. In the step of irradiating with the laser light, laser light having intensity that makes the semiconductor material of the first semiconductor layer opaque to the laser light is irradiated.

Abstract: A semiconductor element manufacturing method according to the invention is such that a focal spot form of a laser light is an ellipse, and irradiation with the laser light is concentrated on a projected division line of an interface between a semiconductor substrate and a fixing sheet, which is a vaporizing pressure confining sheet, and vaporizing pressure generated by the irradiation is confined between the semiconductor substrate and the fixing sheet, and caused to act as a bending force on the semiconductor substrate, and an initial crack is extended. Because of this, energy of the laser light can be reduced, heat damage to an element region of the semiconductor substrate and debris can be reduced, and a division face with good flatness can be stably obtained.

Abstract: An annealing method according to the present invention is an annealing method of annealing a molded body (1) which is molded from a molding material in a molding step, and the method includes the steps of: (I) releasing stress from the molded body (1) by heating the molded body (1); and (II) correcting a warp of the molded body (1), by simultaneously heating the molded body (1) and applying a load to the molded body (1). This achieves an annealing method which makes it possible to obtain a molded body that is free from residual stress and distortion.

Abstract: Provided are a memory device and waveform data editing method and editing program thereof. Waveform data obtained by sampling a musical sound is acquired, and a difference between a harmonic frequency of an nth harmonic of the waveform data and a resonance sound frequency of the nth harmonic sound of a resonance sound generation circuit is calculated, and if the difference is 1 Hz or more, a waveform of a frequency component of 20 Hz centered on a central of the frequency of the nth harmonic of a frequency spectrum is clipped. The difference calculated in regard to the clipped waveform is reduced. The waveform and the clipped original waveform are combined to edit the waveform data. Thus, in the waveform data, the difference between the harmonic frequencies of the resonance characteristic is eliminated, and resonance is facilitated and occurrence of beat of the sound is prevented.

Abstract: A molding device (1) includes a temperature control section (4) and a temperature control sequence determining section (3) that corrects a temperature control sequence for instructing the temperature control section (4) to operate, the temperature control sequence determining section (3) including predicting means (31) for predicting a temporal shift of a thermosetting material (H) and correcting means (32) for correcting a temperature control sequence on the basis of the temporal shift. This arrangement prevents thermal runaway during a process of molding a thermosetting material.

Abstract: A process for producing a flame-resistant fiber bundle, the process comprising a step in which a flame-resistant fiber bundle (1) having a single-fiber density ?F1 of 1.26 g/cm3 to 1.36 g/cm3 is brought into contact sequentially with a heater group having a surface temperature TH of 240° C. to 400° C. under the following conditions (A), (B), and (C) to obtain a flame-resistant fiber bundle (2) having a single-fiber density ?F2 of 1.33 g/cm3 to 1.43 g/cm3: (A) the heater Hn+1 with which the fiber bundle is brought into contact “n+1”-thly has a highter temperature than the heater Hn with which the fiber bundle is brought into contact “n”-thly; (B) the total contact time between the fiber bundle and the heater group is 10 seconds to 360 seconds; and (C) the contact time between the fiber bundle and each heater is 2 seconds to 20 seconds.

Abstract: An annealing method according to the present invention is an annealing method of annealing a molded body (1) which is molded from a molding material in a molding step, and the method includes the steps of: (I) releasing stress from the molded body (1) by heating the molded body (1); and (II) correcting a warp of the molded body (1), by simultaneously heating the molded body (1) and applying a load to the molded body (1). This achieves an annealing method which makes it possible to obtain a molded body that is free from residual stress and distortion.

Abstract: A molding device (1) includes a temperature control section (4) and a temperature control sequence determining section (3) that corrects a temperature control sequence for instructing the temperature control section (4) to operate, the temperature control sequence determining section (3) including predicting means (31) for predicting a temporal shift of a thermosetting material (H) and correcting means (32) for correcting a temperature control sequence on the basis of the temporal shift. This arrangement prevents thermal runaway during a process of molding a thermosetting material.

Abstract: In order to realize a device and a method each capable of forming a lens with high accuracy and low costs, a lens forming device of the present invention includes a metal mold, an insulating substrate, a stage, a power source, a switch, and a UV radiating device. Dielectric resin is supplied onto the insulating substrate and a transfer surface of the metal mold is pressed to the dielectric resin so as to transfer a lens shape to the dielectric resin. At that time, the power source applies a voltage on the metal mold to generate an electric field between the metal mold and the insulating substrate so that an electrostatic attraction causes the dielectric resin to be attracted toward the transfer surface of the metal mold while the top of the dielectric resin has a sharp cuspate shape. Consequently, bubbles are less likely to be invade between the transfer surface and the dielectric resin, allowing transferring a highly accurate lens shape to the dielectric resin.

Abstract: An acceleration and angular velocity detection device includes a first oscillation element and a second oscillation element that are movable in a direction along a first axis and a direction along a second axis, an oscillating portion oscillating the first and second oscillation elements in opposite directions along the first axis, a first detection capacitance element and a second detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the first oscillation element, a third detection capacitance element and a fourth detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the second oscillation element, a charge amplifier having a fully differential structure, and a detecting portion detecting an acceleration and an angular velocity of a rotation.

Abstract: An optical element according to the present invention includes: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein a bottom portion for positioning an adhesive is provided on a further outer circumference side of the spacer section with a tapered portion interposed therebetween.

Abstract: To realize an image pickup lens that can be applied to an image pickup module in which a solid-state image sensing device is used, that allows a reduction in manufacturing cost, and that easily maintains its desired resolving power, etc., the second lens has a surface facing the subject, and the surface includes a central portion sticking out toward the subject and a peripheral portion surrounding the central portion and sinking in toward the image surface. Further, the image pickup lens satisfies the mathematical expression 0.30<d1/d<0.45, where d1 is the length of a segment between the center of that surface of the first lens which faces the subject and the center of that surface of the first lens which faces the image surface and d is the whole optical length of the image pickup lens.

Abstract: An acceleration and angular velocity detection device includes a first oscillation element and a second oscillation element that are movable in a direction along a first axis and a direction along a second axis, an oscillating portion oscillating the first and second oscillation elements in opposite directions along the first axis, a first detection capacitance element and a second detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the first oscillation element, a third detection capacitance element and a fourth detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the second oscillation element, a charge amplifier having a fully differential structure, and a detecting portion detecting an acceleration and an angular velocity of a rotation.