Abstract: According to one embodiment, a first joint unit and a second joint unit are disposed with space on a heat radiation substrate. A joint area of the second joint unit is larger than that of the first joint unit. An insulated substrate is disposed on the first joint unit and the second joint unit. A corner region of the insulated substrate contacts the first joint unit. A first sensor to measure an acceleration of vibration applied to the insulated substrate is disposed thereon. The first sensor is more adjacent to the first joint unit than the second joint unit. A response spectrum of the acceleration is calculated. An extension status of joint failure of the first joint unit is decided by comparing a frequency of a maximum peak of the response spectrum with a reference frequency.

Abstract: A user evaluation apparatus includes a parameter determination module which determines parameters of a user evaluation model required to calculate a degree of usage influence so as to maximize a target function. The target function may be defined using weight values, measurement data, and a failure information counting result. The apparatus also includes a user evaluation module which calculates and displays the degree of usage influence using the measurement data and the parameters of the user evaluation model.

Abstract: According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.

Abstract: A first module calculates a failure occurrence risk index of each data storage area address. A second module calculates a power saving index of each data storage area address. A third module calculates an access speed index per unit data volume necessary to access each data storage area address. A fourth module generates a distribution table that represents the failure occurrence risk index, the power saving index, and the access speed index for each candidate address, with respect to data to be distributed. A fifth module selects a candidate address in the distribution table such that the power saving index and the access speed index meet restricting conditions and the failure occurrence risk index is minimized, and distributes the data to the candidate address.

Abstract: According to one embodiment, an apparatus for loading vibration is provided. The apparatus for loading vibration has a contacting unit, a first vibration unit, a storage unit and a control unit. The contacting unit is capable of coming into contact with a biological body which pulsates or beats in a contact state of a first contact condition. The first vibration unit provides a self-excited vibration to the biological body through the contacting unit. The storage unit stores a second contact condition which synchronizes the self-excited vibration with the pulses or the beats. The control unit controls the contact state of the contacting unit so as to make the first contact condition become closer to the second contact condition.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.

Abstract: A first module calculates a failure occurrence risk index of each data storage area address. A second module calculates a power saving index of each data storage area address. A third module calculates an access speed index per unit data volume necessary to access each data storage area address. A fourth module generates a distribution table that represents the failure occurrence risk index, the power saving index, and the access speed index for each candidate address, with respect to data to be distributed. A fifth module selects a candidate address in the distribution table such that the power saving index and the access speed index meet restricting conditions and the failure occurrence risk index is minimized, and distributes the data to the candidate address.

Abstract: There is provided with an electronic device including: a main board, a plurality of electronic substrates, a first chain, a measuring unit and a controller, in which the plurality of electronic substrates each are mounted on the main board via solder joints, the first chain connects the solder joints in series throughout all of the electronic substrates, comprising a plurality of second chains each being a part of the first chain and connecting the solder joints in each corresponding one of the electronic substrates, the measuring unit measures an electrical resistance of the first chain and electrical resistances of the second chains, and the controller detects, if the electrical resistance of the first chain is equal to or higher than a first threshold value, the second chain having an electrical resistance equal to or higher than a corresponding second threshold value from among the second chains.

Abstract: A dummy junction which will break earlier than a target junction is arranged on a board. A history of load applied to the dummy junction until the dummy junction actually breaks is recorded, and an estimated lifetime of the target junction is calibrated when a lifetime of the dummy junction estimated by the history of the load is largely different from an actual lifetime of the dummy junction. The calibration is performed by subtracting a value of an unmeasurable load from the estimated lifetime of the target junction based on load ever applied to the target junction, and the unmeasurable load is calculated based on the difference of the actual lifetime and estimated lifetime of the dummy junction.

Abstract: According to one embodiment, each monitoring device acquires monitoring variables from an observation target, generates an individual multidimensional distribution of the monitoring variables, and transmits the individual multidimensional distribution to a server. The server generates sampling data using the individual multidimensional distribution received from each monitoring device, generates an overall multidimensional distribution of the monitoring variables using the sampling data, determines a statistical model of each index using the overall multidimensional distribution, generates an overall index multidimensional distribution of indexes using the statistical model and the overall multidimensional distribution, and transmits the overall index multidimensional distribution and statistical models to each monitoring device.

Abstract: A first module calculates a failure occurrence risk index of each data storage area address. A second module calculates a power saving index of each data storage area address. A third module calculates an access speed index per unit data volume necessary to access each data storage area address. A fourth module generates a distribution table that represents the failure occurrence risk index, the power saving index, and the access speed index for each candidate address, with respect to data to be distributed. A fifth module selects a candidate address in the distribution table such that the power saving index and the access speed index meet restricting conditions and the failure occurrence risk index is minimized, and distributes the data to the candidate address.

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: There is provided with an electronic device including: an electronic board having at least one electronic component mounted via both of a target joint and a dummy joint; a vibration source to apply vibrations to the electronic board; a database configured to contain correlation between an electrical characteristic of the dummy joint and a damage value of the target joint, the damage value indicating a degree of crack growth of the target joint; a controller to drive the vibration source; an electrical characteristic measuring unit configured to measure an electrical characteristic of the dummy joint during the vibration source is driven; and a damage calculating unit configured to calculate a damage value of the target joint based on the electrical characteristic of the dummy joint measured by the electrical characteristic measuring unit and the correlation stored in the database.

Abstract: A substrate includes a join-structure including a semiconductor package, first electrode pad, bump, second electrode pad, and circuit substrate joined in the order named. The substrate also includes a first wire and a second wire formed in a region bellow a corner of the semiconductor package. The first and second wires are configured to detect a change in electrical resistance value when the first wire or the second wire is disconnected. One of the first and second wires is connected to the first electrode pad or the second electrode pad. A break strength of each of the first wire and the second wire is lower than a break strength of the join-structure.

Abstract: According to one embodiment, each monitoring device acquires monitoring variables from an observation target, generates an individual multidimensional distribution of the monitoring variables, and transmits the individual multidimensional distribution to a server. The server generates sampling data using the individual multidimensional distribution received from each monitoring device, generates an overall multidimensional distribution of the monitoring variables using the sampling data, determines a statistical model of each index using the overall multidimensional distribution, generates an overall index multidimensional distribution of indexes using the statistical model and the overall multidimensional distribution, and transmits the overall index multidimensional distribution and statistical models to each monitoring device.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.

Abstract: An electronic device includes a deviation value calculation unit which calculates a deviation value from the normal boundary of the relationship between a power index associated with the driving power and the measured rotational speed of the fan, a clogging detection unit which detects, based on the deviation value, clogging in an air duct through which the fan takes in air outside the case and sends it to the radiator, and a deviation value correction unit which corrects the deviation value in accordance with aging of performance of the fan to compensate for deterioration of the clogging detection capability of the clogging detection unit caused by the aging.