Abstract: A mold part formed of a light transmitting material having a high refractive index is molded in a concave-shaped reflecting member, and a light emitting element such as an LED chip or the like is inserted in the center of the mold part. A circular direct emitting portion is provided at the center of a front face of the mold part, a ring-shaped total reflecting portion is provided around it, and a slanted total reflecting portion is provided between the direct emitting portion and total reflecting portion. Thereby, the uniformity of front face luminance with a simple structure in a light emitting device provided with a reflecting member on a back face of a mold part is improved.

Abstract: A light emission source includes a reflector, a first light reflecting surface disposed on the reflector, a light guide disposed on the side of the reflector with the first light reflection surface, and a light emitter for emitting light towards the light guide. The light guide includes a second light reflection surface disposed facing the first light reflection surface for reflecting some light and transmitting remaining light, and a light emission surface disposed on an opposite side of the second light reflection surface on the light guide for transmitting light emitted from the light emitter, light reflected by the first light reflection surface, and light reflected by the second light reflection surface. A light emission source includes a light guide.

Abstract: This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.

Abstract: On the rear surface of a transparent molded unit is provided a reflecting member. In a central part of the molded unit are encapsulated light emitting devices. In the vicinity of the central part of the reflecting member is formed a reflecting area that is angularly inclined to the rear surface as it moves to the outer circumferential direction. A toric channel is provided on a light irradiation surface of the molded unit, and a slope total reflection area is provided in its inner circumferential side. Light emanating from the light emitting devices is reflected at the slope total reflection area, and further reflected at the direct output area. Then, after being further reflected at the reflecting area of the reflecting member, the light is guided to the outer circumferential end of the reflecting member, and is outputted forward from the total reflection area by being reflected at the outer circumferential end of the reflecting member.

Abstract: On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).

Abstract: A film processing device using vaporized liquid source capable of confirming the flow control accuracy of flow control equipment such as a mass flow controller (15) controlling the flow of the liquid source without separating the flow control equipment from piping and disassembling the piping, comprising a bypass passage (41) for bypassing a part of a washing fluid feed passage (32) for feeding washing fluid to a liquid source feed passage (12) and a flowmeter such as an MFM (42), wherein the washing fluid is allowed to flow to the mass flow controller (15) through the MFM (42), and the flow of the washing fluid detected by the MFM (42) is compared with a target flow set in the mass flow controller (15) to check whether the mass flow controller (15) operates normally or not.

Abstract: A mold part formed of a light transmitting material having a high refractive index is molded in a concave-shaped reflecting member, and a light emitting element such as an LED chip or the like is inserted in the center of the mold part. A circular direct emitting portion is provided at the center of a front face of the mold part, a ring-shaped total reflecting portion is provided around it, and a slanted total reflecting portion is provided between the direct emitting portion and total reflecting portion. Thereby, the uniformity of front face luminance with a simple structure in a light emitting device provided with a reflecting member on a back face of a mold part is improved.

Abstract: A higher-temperature heating zone and lower-temperature heating zone are set in a process chamber for a single-substrate-heat-processing apparatus in order to subject a wafer to two processes with different process temperatures. In the higher-temperature heating zone, the wafer is heated as it is placed on a worktable. In the lower-temperature heating zone, the wafer is heated with a smaller heat quantity as it floats above the worktable. In the lower-temperature heating zone, a heat ray reflector for compensating for heat dissipated from the peripheral portion of the wafer is disposed to surround the wafer.

Abstract: This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.

Abstract: A higher-temperature heating zone and lower-temperature heating zone are set in a process chamber for a single-substrate-heat-processing apparatus in order to subject a wafer to two processes with different process temperatures. In the higher-temperature heating zone, the wafer is heated as it is placed on a worktable. In the lower-temperature heating zone, the wafer is heated with a smaller heat quantity as it floats above the worktable. In the lower-temperature heating zone, a heat ray reflector for compensating for heat dissipated from the peripheral portion of the wafer is disposed to surround the wafer.

Abstract: The present invention comprises a processing furnace for oxidizing object to be processed at a high temperature, pressure reducing means for evacuating the interior of the processing furnace, a burning apparatus disposed outside the processing furnace for burning hydrogen gas and oxygen gas to generate water vapor, a water vapor supply pipe interconnecting the burning apparatus and to the processing furnace, and a throttle disposed on the water vapor supply pipe for generating a pressure difference in the water vapor supply pipe between a side of the burning apparatus and a side of the processing furnace. Stable burning is ensured in the burning apparatus, which makes set oxidation under low pressures possible. It is possible that in place of the throttle, atomization means for atomizing pure water, or a boiling water vapor generating unit, or a microwave water vapor generating unit.

Abstract: The present invention relates to a heat treatment apparatus, specifically a valve device for use in an exhaust system of a low pressure heat treatment furnace, which comprises urging device for urging a valve body in a valve closing direction, and a drive unit for opening/closing the valve body against an urging force of the urging device. An interconnection releasing mechanism is provided between the driving unit and the valve rod of the valve body, the interconnection releasing mechanism connecting both with each other, and releasing their connection in an emergency. Thus, an exhaust system of the low pressure heat treatment furnace is instantaneously shut off in an emergency to prevent reverse flow of exhaust gas into the furnace. An evacuation fine adjustment gap is defined between the periphery of the valve body and that of the valve casing for facilitating evacuation control.