Patents by Inventor Kenji Iketaki

Kenji Iketaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7759613
    Abstract: A reflowing apparatus for mounting parts on a printed wiring board, has a fixed heating portion for blowing the hot air to the printed wiring board, and a moving heating portion for locally varying the temperature of the hot air blown by the fixed heating portion to the printed wiring board.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: July 20, 2010
    Assignee: Fujitsu Limited
    Inventor: Kenji Iketaki
  • Publication number: 20070267465
    Abstract: A reflowing apparatus for mounting parts on a printed wiring board, has a fixed heating portion for blowing the hot air to the printed wiring board, and a moving heating portion for locally varying the temperature of the hot air blown by the fixed heating portion to the printed wiring board.
    Type: Application
    Filed: July 25, 2007
    Publication date: November 22, 2007
    Inventor: Kenji Iketaki
  • Publication number: 20060007661
    Abstract: A circuit board includes a substrate having a pair of pads at mutually opposite positions of a front surface and a rear surface of the substrate; a circuit element having a heat dissipation part which is soldered to one of the pair of pads; and a heat transfer section which pierces through the substrate in a thickness direction, and both ends of which are soldered to the pair of pads respectively, wherein at least a part of the heat transfer section has a solid structure which prevents air from passing through between the front surface and the rear surface.
    Type: Application
    Filed: November 1, 2004
    Publication date: January 12, 2006
    Applicant: FUJITSU LIMITED
    Inventor: Kenji Iketaki
  • Patent number: 6787711
    Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: September 7, 2004
    Assignee: Fujitsu Limited
    Inventors: Shunichi Kikuchi, Mitsutaka Yamada, Kenji Iketaki
  • Patent number: 6744183
    Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: June 1, 2004
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayashi, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
  • Publication number: 20030137223
    Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 24, 2003
    Applicant: Fujitsu Limited
    Inventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayashi, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
  • Publication number: 20030111262
    Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.
    Type: Application
    Filed: July 16, 2002
    Publication date: June 19, 2003
    Inventors: Shunichi Kikuchi, Mitsutaka Yamada, Kenji Iketaki
  • Patent number: 6541898
    Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: April 1, 2003
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayashi, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
  • Patent number: 6467141
    Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: October 22, 2002
    Assignee: Fujitsu Limited
    Inventors: Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Masayuki Kitajima, Seiichi Shimoura, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka, Masanao Fujii
  • Publication number: 20020074902
    Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
    Type: Application
    Filed: March 30, 2001
    Publication date: June 20, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayaski, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
  • Publication number: 20020059717
    Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.
    Type: Application
    Filed: March 29, 2001
    Publication date: May 23, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Masayuki Kitajima, Seiichi Shimoura, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka, Masanao Fujii
  • Patent number: 5560534
    Abstract: A soldering apparatus wherein lead pins of a part inserted from above in through-holes of a printed circuit board are soldered to the through-holes from below. The soldering apparatus comprises a solder supplying nozzle, a preliminary heating nozzle and a flux nozzle. Each of the nozzles has an opening and a pair of slits formed to extend downwardly from the opening. The nozzles are moved upwardly and downwardly in a Z direction by respective elevators and are moved and positioned in X and Y directions by a moving table. A printed circuit board to which a lead part to be soldered is temporarily fastened is disposed on the nozzles.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: October 1, 1996
    Assignee: Fujitsu Limited
    Inventors: Toru Okada, Kenji Iketaki, Naoki Yamasaki