Abstract: An image pickup device has a plurality of photoelectric converter substrates carring respective input/output terminals connected to the photoelectric converters. The device comprises leads connected to the input/output terminals and extending to the side opposite to the light recieving surfaces of the photoelectric converter substrates thorough the gaps separating the substrates.

Abstract: A radiation image pickup device comprises an image pickup element for converting radiation into an electric signal and picking up an image of an object, a circuit substrate electrically connected to the image pickup element and provided with at least either a circuit for controlling the input signal to the image pickup element or a circuit for processing the output signal from the image pickup element, active elements arranged on the circuit substrate and constituting the circuit and radiation shielding members for shielding the active elements from radiation, the radiation shielding members having a surface area smaller than that of the circuit substrate.

Abstract: An imaging apparatus includes a substrate, photoelectric transfer elements arranged on the substrate, a semiconductor device located in association with the photoelectric transfer elements and a thermal device for discharging heat coming from the semiconductor device to the outside. The thermal device additionally contacts the substrate and acts to cool the photoelectric transfer elements.

Abstract: A highly reliable solid-state image pickup device with one- or two-dimensionally arranged connecting portions, capable of avoiding corrosion of wirings resulting from chipping of the substrates and eliminating image defect, is achieved by arranging plural substrates, each bearing a plurality of image taking elements, in a planar manner on a supporting substrate and filling the connecting portions of thus arranged substrates with an organic or inorganic material, of which content in chlorine or in each of sodium and potassium does not exceed 200 ppm.