Patents by Inventor Kenji Kogo

Kenji Kogo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230298045
    Abstract: Provided is a new technique that enables authentication of sources as well as storage and distribution conditions of food.
    Type: Application
    Filed: December 14, 2022
    Publication date: September 21, 2023
    Inventors: Kenji KOGO, Naohiro KOHMU, Akira KITAYAMA, Goichi ONO
  • Publication number: 20230202494
    Abstract: Cost is reduced when a duplication configuration including up to a power supply is adopted. An in-vehicle electronic control device that executes calculation processing of vehicle control using information acquired by an external sensor includes: a first calculation unit that executes the calculation processing; and a second calculation unit that is communicably connected to the first calculation unit, in which the first calculation unit and the second calculation unit are supplied with power from different power supplies, and execute calculation processing of vehicle control that is different from each other in a normal state, the first calculation unit outputs an action plan of a vehicle, the second calculation unit outputs a signal to be input to an actuator for operating a vehicle, and when the first calculation unit or the second calculation unit fails, a calculation unit in a normal state executes calculation processing of degenerated vehicle control.
    Type: Application
    Filed: February 5, 2021
    Publication date: June 29, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Koji MAEDA, Kenji KOGO
  • Publication number: 20230166678
    Abstract: As the level of autonomous driving of an automobile is improved, traveling in a system without a driver is required, and high reliability of the system is essential. One method for achieving high reliability is redundancy of a power supply. To construct a redundant power supply network, a redundant power supply network is required in addition to a main power supply network, and the number of wires of the network increases. In addition, since a cable having a thick core wire is used as a power supply wiring in order to handle a large current, the weight of the cable becomes heavy, which leads to fuel consumption degradation of the vehicle. An electronic control device 11-B receives power fed from a power storage unit 12-A via another electronic control device 11-A, as a redundant power supply redundant to a power superimposition data wiring 16.
    Type: Application
    Filed: January 22, 2021
    Publication date: June 1, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Kenji KOGO, Koji MAEDA
  • Patent number: 10709013
    Abstract: A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second layer and electrically connects the first wire line and the second wire line arranged on one surface of the multilayer wiring board and the first wire line and the second wire line arranged on the other surface of the multilayer wiring board, respectively; and clearances and which insulate the ground conductor and the through-holes and, in which the pair of through-holes formed in the second layer is arranged so that a virtual line connecting centers of the pair of through-holes is inclined with respect to a line perpendicular to a signal propagation direction of the differential wire line.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 7, 2020
    Assignee: Hitachi Metals, Ltd.
    Inventors: Kenji Kogo, Kei Nishimura
  • Publication number: 20180279465
    Abstract: A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second layer and electrically connects the first wire line and the second wire line arranged on one surface of the multilayer wiring board and the first wire line and the second wire line arranged on the other surface of the multilayer wiring board, respectively; and clearances and which insulate the ground conductor and the through-holes and, in which the pair of through-holes formed in the second layer is arranged so that a virtual line connecting centers of the pair of through-holes is inclined with respect to a line perpendicular to a signal propagation direction of the differential wire line.
    Type: Application
    Filed: February 26, 2018
    Publication date: September 27, 2018
    Inventors: Kenji KOGO, Kei NISHIMURA
  • Patent number: 8902947
    Abstract: An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: December 2, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Shigeki Makino, Yasunobu Matsuoka, Kenji Kogo, Toshiki Sugawara, Tatemi Ido
  • Publication number: 20120328229
    Abstract: There is provided an optical module including photonic devices set in array, prepared by integrating a plurality of photonic devices with each other in such a state as arranged in such a array as to enable light beams to output in the common direction. The plural photonic devices each include a first electrode, and a second electrode, arranged in the same direction as the plural photonic devices are arranged, and the first and second electrodes of the photonic devices adjacent to each other are disposed such that respective electrode layouts are a mirror image of each other.
    Type: Application
    Filed: June 7, 2012
    Publication date: December 27, 2012
    Applicant: Hitachi, Ltd.
    Inventors: Kenji Kogo, Yasunobu Matsuoka, Shigeki Makino
  • Publication number: 20120250711
    Abstract: An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror.
    Type: Application
    Filed: January 9, 2012
    Publication date: October 4, 2012
    Applicant: Hitachi, Ltd.
    Inventors: Shigeki MAKINO, Yasunobu MATSUOKA, Kenji KOGO, Toshiki SUGAWARA, Tatemi IDO
  • Patent number: 6836492
    Abstract: An LD module capable of generating a good optical waveform at a high speed of about 10 Gbit/s or higher in which a damping resistor is disposed in parallel with a laser-diode device in the inside of a laser-diode module, the damping resistor being preferably disposed between the connection point of the high-frequency transmission line and the terminating resistor, and the ground.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: December 28, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tatemi Ido, Kenji Kogo, Kouji Yoshida
  • Publication number: 20030156608
    Abstract: An LD module capable of generating a good optical waveform at a high speed of about 10 Gbit/s or higher in which a damping resistor is disposed in parallel with a laser-diode device in the inside of a laser-diode module, the damping resistor being preferably disposed between the connection point of the high-frequency transmission line and the terminating resistor, and the ground.
    Type: Application
    Filed: January 28, 2003
    Publication date: August 21, 2003
    Inventors: Tatemi Ido, Kenji Kogo, Kouji Yoshida