Patents by Inventor Kenji Miharu

Kenji Miharu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8053086
    Abstract: An encapsulating material for solar cell containing a laminated adhesive and heat resistant layer (A) and a buffering layer (B), wherein a difference in flexural modulus between the heat resistant layer (A) and the buffering layer (B) is at least 30 MPa or more, is provided. The adhesive and heat resistant layer (A) is preferably an olefin polymer (a) having a melting point (according to JIS K7121) of 75° C. or higher and having a storage elastic modulus at 150° C. of 103 Pa or more and the buffering layer (B) is preferably an olefin polymer (d) having a stiffness of 100 MPa or less. The encapsulating material for solar cell can provide superior transparency, flexibility, heat resistance and adhesiveness and can remarkably improve production efficiency of a solar cell module even when no organic peroxide is used. The encapsulating material can also exhibit a performance capable of corresponding to the thickness reduction of the solar cell element even when an organic peroxide is used.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: November 8, 2011
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Kenji Miharu
  • Publication number: 20090120489
    Abstract: An encapsulating material for solar cell containing a laminated adhesive and heat resistant layer (A) and a buffering layer (B), wherein a difference in flexural modulus between the heat resistant layer (A) and the buffering layer (B) is at least 30 MPa or more, is provided. The adhesive and heat resistant layer (A) is preferably an olefin polymer (a) having a melting point (according to JIS K7121) of 75° C. or higher and having a storage elastic modulus at 150° C. of 103 Pa or more and the buffering layer (B) is preferably an olefin polymer (d) having a stiffness of 100 MPa or less. The encapsulating material for solar cell can provide superior transparency, flexibility, heat resistance and adhesiveness and can remarkably improve production efficiency of a solar cell module even when no organic peroxide is used. The encapsulating material can also exhibit a performance capable of corresponding to the thickness reduction of the solar cell element even when an organic peroxide is used.
    Type: Application
    Filed: March 8, 2006
    Publication date: May 14, 2009
    Applicant: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Kenji Miharu
  • Patent number: 6835269
    Abstract: A laminated film exhibiting excellent interlayer adhesiveness obtained by extrusion-laminating a resin directly on a polyester film without effecting anchor-coating or without treating the molten film of the extrusion-laminated resin with ozone. The laminated film is obtained by extrusion-laminating, onto the polyester film, an ethylene copolymer containing an unsaturated carboxylic acid and a (meth)acrylic acid ester, which may be further blended with a small amount of an ethylene/&agr;-olefin copolymer having a density of 840 to 900 kg/m3, the amount of the unsaturated carboxylic acid component being from 1 to 12% by weight and the amount of the (meth)acrylic acid ester component being from 2 to 25% by weight.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: December 28, 2004
    Assignee: DuPont-Mitsui Polychemicals Co., Ltd.
    Inventors: Kenji Miharu, Naozumi Suzuki
  • Patent number: 6011115
    Abstract: A thermoplastic resin composition comprising 50 to 85 parts by weight of an ethylene-vinyl alcohol copolymer, 10 to 40 parts by weight of an ionomer of ethylene-unsaturated carboxylic acid copolymer containing about 5 to 12 mole % of unsaturated carboxylic acid, and 1 to 25 parts by weight of a polyamide and a packaging material comprising said resin composition are provided. The resin composition is excellent in gas barrier property, impact resistance, pinhole resistance, stretchability, drawability and transparency and is preferably used for packaging material.
    Type: Grant
    Filed: September 2, 1997
    Date of Patent: January 4, 2000
    Assignee: DuPont-Mitsui Polychemicals Co. Ltd.
    Inventors: Kenji Miharu, Hitoshi Tachino
  • Patent number: 5912070
    Abstract: A laminated film superior in the heat resistance, shock resistance, moisture-barriering property and easy hand-tearability, which comprises one or more layers of a thermoplastic polyester resin (A), one or more layers of a resin based on cycloolefin (C) and one or more interposed layers of an adhesive (B) between layer (A) and layer (C), wherein the layer(s) of the thermoplastic polyester resin (A) and optionally the layer(s) of the resin based on cycloolefin (C) have been biaxially stretched and wherein the total thickness of the layer(s) of the thermoplastic polyester resin (A), the total thickness of the layer(s) of the adhesive (B) and the total thickness of the layer(s) based on cycloolefin (C) are 0.5-50 .mu.m, 0.5-20 .mu.m and 5-150 .mu.m, respectively.
    Type: Grant
    Filed: April 9, 1997
    Date of Patent: June 15, 1999
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Kenji Miharu, Masaru Kokuryou, Yohzoh Yamamoto, Yasushi Amada