Patents by Inventor Kenji Miyazaki

Kenji Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6399189
    Abstract: A sheet-form structure of expandable thermoplastic resin is provided which is capable of undergoing a pseudo-one-dimensional expansion in its thickness direction and which enables manufacture of thermoplastic resin foams having reduced variations in thickness and weight precisions, increased compressive strength, and excellent properties such as surface smoothness. A method of manufacturing the sheet-form structure, as well as such thermoplastic resin foams, are also provided. A sheet-form structure 1 of expandable thermoplastic resin including granules 2 of expandable thermoplastic resin arranged generally uniformly for integral connection thereof through a thin film 3 of expandable thermoplastic resin.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: June 4, 2002
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Tomoyuki Kobayashi, Kenji Miyazaki, Eiji Nagara, Michiaki Sasayama, Mitsuo Okubo
  • Publication number: 20020064641
    Abstract: A sheet-form structure of expandable thermoplastic resin is provided which is capable of undergoing a pseudo-one-dimensional expansion in its thickness direction and which enables manufacture of thermoplastic resin foams having reduced variations in thickness and weight precisions, increased compressive strength, and excellent properties such as surface smoothness. A method of manufacturing the sheet-form structure, as well as such thermoplastic resin foams, are also provided.
    Type: Application
    Filed: August 25, 1998
    Publication date: May 30, 2002
    Inventors: TOMOYUKI KOBAYASHI, KENJI MIYAZAKI, EIJI NAGARA, MICHIAKI SASAYAMA, MITSUO OKUBO
  • Patent number: 6300386
    Abstract: An expandable synthetic resin composition capable of providing a synthetic resin foam excellent in both heat distortion resistance and mechanical strength, as well as such a synthetic resin foam, are provided. An expandable synthetic resin composition incorporating a thermoplastic resin, a liquid crystal resin and a heat-decomposable foaming agent, as well as a synthetic resin foam which incorporates a thermoplastic resin and a liquid crystal resin dispersed in the thermoplastic resin and exhibits an expansion ratio of 1.1-50, are provided.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: October 9, 2001
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Koichi Karukaya, Kenji Miyazaki, Koshi Kawabata
  • Patent number: 6300587
    Abstract: A wire electrode for wire electro-discharge machining comprises a core, and a coating layer formed on an outer periphery of the core at least a surface layer of which contains copper. The coating layer comprises an alloy of copper and at least one element selected from the group consisting of Zn, Cs, Se, Te and Mg, with the copper content being about 55.5 wt % to about 75 wt %. The coating layer does not have an oxide film thereon other than a natural oxide film.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: October 9, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yoshihiro Nakai, Kouichi Yamada, Kenji Miyazaki, Shinji Inazawa, Shigeo Ezaki, Toshihiro Kume
  • Patent number: 6165627
    Abstract: An INVAR.RTM. or iron nickel alloy or iron nickel cobalt alloy wire has an area ratio of carbide existing at the grain boundaries of the wire in the finished wire of at most 4%, or an average grain size in the transverse direction within a range of 1 to 5 .mu.m. Such a wire has a superior twisting property.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: December 26, 2000
    Assignees: Sumitomo Electric Industries, Ltd., Daido Steel Co., Ltd.
    Inventors: Kenji Miyazaki, Shinichi Kitamura, Atsushi Yoshida, Shinichiro Yahagi, Takanobu Saito
  • Patent number: 6059953
    Abstract: A metal plate for electromagnetic heating is disclosed which includes a substrate comprising aluminum or aluminum alloys, an intermediate layer formed on at least a portion of one surface of the substrate and comprising zinc or zinc alloys and a conductive layer formed on the intermediate layer for serving as a heat generating body when eddy current induced by high-frequency magnetic flux flows therethrough. Methods of manufacturing a metal plate for electromagnetic heating and a metallic mold for electromagnetic heating are also disclosed.
    Type: Grant
    Filed: December 24, 1997
    Date of Patent: May 9, 2000
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toshiyuki Hatta, Fumio Matsuyama, Masaya Nishi, Taichiro Nishikawa, Shuzo Nagai, Kenji Miyazaki, Shinji Inazawa
  • Patent number: 5939180
    Abstract: A foam molding is disclosed which is light, excellent in bending strength, and excellent in balance between compressive strength and compression permanent strain. The foam molding comprises thermoplastic resin high expanded foams whose overall outer surfaces are covered with thermoplastic resin low-expanded-foam thin layers. The foams are thermally fused with each other through the aforementioned low-expanded-foam thin layers.
    Type: Grant
    Filed: September 23, 1996
    Date of Patent: August 17, 1999
    Assignee: Sekisui Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tomoyuki Kobayashi, Kenji Miyazaki, Michiaki Sasayama
  • Patent number: 5770837
    Abstract: A metal plate for electromagnetic heating is disclosed which includes a substrate comprising aluminum or aluminum alloys, an intermediate layer formed on at least a portion of one surface of the substrate and comprising zinc or zinc alloys and a conductive layer formed on the intermediate layer for serving as a heat generating body when eddy current induced by high-frequency magnetic flux flows therethrough. Methods of manufacturing a metal plate for electromagnetic heating and a metallic mold for electromagnetic heating are also disclosed.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: June 23, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toshiyuki Hatta, Fumio Matsuyama, Masaya Nishi, Taichiro Nishikawa, Shuzo Nagai, Kenji Miyazaki, Shinji Inazawa
  • Patent number: 5738922
    Abstract: A plastic foam material composed of a blended resin composition which includes at least two thermoplastic resins and a silane-modified based resin. The blended resin composition consists essentially of 100 parts by weight of at least two thermoplastic resins, from about 1 to about 50 parts by weight of a silane-modified, cross-linked, thermoplastic resin; from about 0.001 to about 2.5 parts by weight of a cross-linking catalyst for use in a silane compound and from about 1 to about 20 parts by weight of a foaming agent. According to one embodiment of the present invention, the thermoplastic resins include at least two substantially incompatible and substantially uncross-linked thermoplastic resins, while in another embodiment the two thermoplastic resins need not be substantially incompatible. The blended resin composition may further include reinforcers such as glass fibers and filler. The thermodecomposition foaming agent decomposes at sufficiently high temperatures to yield a plastic foam material.
    Type: Grant
    Filed: May 22, 1996
    Date of Patent: April 14, 1998
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Tomoyuki Kobayashi, Kenji Miyazaki, Masanori Nakamura
  • Patent number: 5646194
    Abstract: A plastic foam material composed of a blended resin composition which includes at least two thermoplastic resins and a silane-modified based resin. The blended resin composition consists essentially of 100 parts by weight of at least two thermoplastic resins, from about 1 to about 50 parts by weight of a silane-modified, cross-linked, thermoplastic resin; from about 0.001 to about 2.5 parts by weight of a cross-linking catalyst for use in a silane compound and from about 1 to about 20 parts by weight of a foaming agent. According to one embodiment of the present invention, the thermoplastic resins include at least two substantially incompatible and substantially uncross-linked thermoplastic resins, while in another embodiment the two thermoplastic resins need not be substantially incompatible. The blended resin composition may further include reinforcers such as glass fibers and filler. The thermodecomposition foaming agent decomposes at sufficiently high temperatures to yield a plastic foam material.
    Type: Grant
    Filed: May 22, 1996
    Date of Patent: July 8, 1997
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Tomoyuki Kobayashi, Kenji Miyazaki, Masanori Nakamura
  • Patent number: 5639317
    Abstract: In a high strength, low thermal expansion alloy wire, particularly used as the material for central section wire of low relaxation, overhead power transmission line, the number of rupture twisting is improved with retaining desired tensile strength (100 kgf/mm.sup.2), elongation (1.5% or more) and linear thermal expansion coefficient (average in the range of room temperature to 300.degree. C., .alpha.<5.times.10.sup.-6 /.degree. C.). The wire is made of an Fe-Ni-based alloy of specifically selected alloy composition. Process for preparing the wire comprises, hot rolling the alloy material, peeling the rolled wire, cold drawing, annealing and surface coating the drawn wire. The above improvement can be achieved by carrying the hot wire rolling under such conditions that the quantity of intergranular precipitations is up to 2% and/or that the averaged crystal grain size in the rolling direction is in the range of 5-70 .mu.m, at finishing the hot wire rolling.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: June 17, 1997
    Assignees: Daido Steel Co. Ltd., Sumitomo Electric Industries Ltd.
    Inventors: Shin-ichiro Yahagi, Kenji Takahashi, Hirotaka Yoshinaga, Kenji Miyazaki, Shinichi Kitamura, Atsushi Yoshida
  • Patent number: 5599633
    Abstract: Disclosed herein is a wire electrode for wire cutting electro-discharge machining which can improve the processing speed as well as productivity of the wire electrode. A core (2) is made of a copper alloy containing Ag. A coating layer (1) formed on the outer periphery of the core (2) is made of a copper alloy containing Zn and Al.
    Type: Grant
    Filed: February 17, 1995
    Date of Patent: February 4, 1997
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kenji Miyazaki, Shigeo Ezaki, Naoyuki Ohkubo
  • Patent number: 5594038
    Abstract: A plastic foam material composed of a blended resin composition which includes at least two thermoplastic resins and a silane-modified based resin. The blended resin composition consists essentially of 100 parts by weight of at least two thermoplastic resins, from about 1 to about 50 parts by weight of a silane-modified, cross-linked, thermoplastic resin; from about 0.001 to about 2.5 parts by weight of a cross-linking catalyst for use in a silane compound and from about 1 to about 20 parts by weight of a foaming agent. According to one embodiment of the present invention, the thermoplastic resins include at least two substantially incompatible and substantially uncross-linked thermoplastic resins, while in another embodiment the two thermoplastic resins need not be substantially incompatible. The blended resin composition may further include reinforcers such as glass fibers and filler. The thermodecomposition foaming agent decomposes at sufficiently high temperatures to yield a plastic foam material.
    Type: Grant
    Filed: May 22, 1996
    Date of Patent: January 14, 1997
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Tomoyuki Kobayashi, Kenji Miyazaki, Masanori Nakamura
  • Patent number: 5552448
    Abstract: A plastic foam material composed of a blended resin composition which includes at least two thermoplastic resins and a silane-modified based resin. The blended resin composition consists essentially of 100 parts by weight of at least two thermoplastic resins, from about 1 to about 50 parts by weight of a silane-modified, cross-linked, thermoplastic resin; from about 0.001 to about 2.5 parts by weight of a cross-linking catalyst for use in a silane compound and from about 1 to about 20 parts by weight of a foaming agent. According to one embodiment of the present invention, the thermoplastic resins include at least two substantially incompatible and substantially uncross-linked thermoplastic resins, while in another embodiment the two thermoplastic resins need not be substantially incompatible. The blended resin composition may further include reinforcers such as glass fibers and filler. The thermodecomposition foaming agent decomposes at sufficiently high temperatures to yield a plastic foam material.
    Type: Grant
    Filed: September 21, 1994
    Date of Patent: September 3, 1996
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Tomoyuki Kobayashi, Kenji Miyazaki, Masanori Nakamura
  • Patent number: 5443665
    Abstract: A method of manufacturing an improved conductor wire, especially for use as wiring in audio/video devices is disclosed. The conductor consists of copper having a high purity of at least 99.9 wt. %. High purity copper starting material is formed as a rod which is then heat treated at a temperature in the range of 400.degree. C. to 700.degree. C. for 1 minute to 24 hours. The heat treated rod is then cold worked with a reduction in area of at least 65%. This method provides an electrical conductor wire which avoids irregularities of electron density and thereby eliminates phase differences in a high frequency signal, such as an audio or video signal, passing through the wire to obtain clear transmission and reproduction of an audio sound or video image. The method of the invention increases the residual resistance ratio of the conductor wire to at least 179 or by at least 20% as compared to a conventional conductor which is not heat treated according to the invention.
    Type: Grant
    Filed: February 24, 1994
    Date of Patent: August 22, 1995
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tadanori Sano, Kazuo Sawada, Yoshihiro Nakai, Kenji Miyazaki
  • Patent number: 5273954
    Abstract: A method of manufacturing a superconducting ceramics elongated body by forming a longitudinally continuous superconducting layer on at least a part of the surface of a flexible ceramics elongated substrate by evaporation under the presence of oxygen ions.
    Type: Grant
    Filed: February 7, 1992
    Date of Patent: December 28, 1993
    Assignee: Fukami Patent Office
    Inventors: Satoshi Takano, Kenichi Takahashi, Kenji Miyazaki, Noriyuki Yoshida, Shinji Inazawa, Noriki Hayashi
  • Patent number: 5242898
    Abstract: A method of forming a superconducting circuit comprises the steps of preparing a ceramics body which is changed from a non-superconductive phase not superconducting at the working temperature into a superconducting phase superconducting at the working temperature by heat treatment and performing the heat treatment on a part of the ceramics body by applying a laser beam to the ceramics body to change the same into the superconductive phase, thereby to form a superconducting circuit consisting of the superconductive phase and the non-superconductive phase on the ceramics body.
    Type: Grant
    Filed: May 19, 1992
    Date of Patent: September 7, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kenichi Takahashi, Noriyuki Yoshida, Jun Shioya, Yoichi Yamaguchi, Akira Mizoguchi, Noriki Hayashi, Satoshi Takano, Kenji Miyazaki
  • Patent number: 5232909
    Abstract: A superconducting ceramics elongated body comprising a flexible ceramics elongated substrate and an oxide ceramics superconducting layer formed at least on a part of the surface of the ceramics elongated substrate to longitudinally extend along the ceramics elongated substrate. The superconducting ceramics elongated body further comprises a protective layer of ceramics containing a nitride, which is provided to at least cover the surface of the superconducting layer exposed on the ceramics elongated substrate. A method of manufacturing a superconducting ceramics elongated body by forming a longitudinally continuous superconducting layer on at least a part of the surface of a flexible ceramics elongated substrate. The superconducting layer is formed on the elongated substrate by a sol-gel method, a coating/sintering method, evaporation under oxygen ions, deposition from a fluoride solution or oxidation after application of corresponding fluorides.
    Type: Grant
    Filed: May 8, 1992
    Date of Patent: August 3, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Satoshi Takano, Kenichi Takahashi, Kenji Miyazaki, Noriyuki Yoshida, Shinji Inazawa, Noriki Hayashi
  • Patent number: 5169829
    Abstract: An improvement in a process for manufacturing a superconductor, characterized by irradiating a material composed of compound oxide by one of ion beams selected from oxygen ion beam, inert gas ion beams and an ion beam consisting of a mixture of oxygen gas and inert gas to convert said material into a superconductor. When a focused ion beam is directed onto desired areas on said film layer, the areas irradiated by the ion beam are converted to a superconductor in a form of a superconducting circuit.
    Type: Grant
    Filed: April 21, 1992
    Date of Patent: December 8, 1992
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Nobuhiko Fujita, Hideo Itozaki, Saburo Tanaka, Naoji Fujimori, Takahiro Imai, Keizo Harada, Shuji Yazu, Tetsuji Jodai, Noriyuki Yoshida, Satoshi Takano, Kenji Miyazaki, Noriki Hayashi
  • Patent number: 5151406
    Abstract: A laminated ceramic superconductor which comprises at least two layers of ceramic superconductor and a stabilizing metal layer interposed between said ceramic superconductor layers, which has improved flexibility and increased critical current density.
    Type: Grant
    Filed: February 25, 1988
    Date of Patent: September 29, 1992
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kazuo Sawada, Kengo Okura, Noriyuki Yoshida, Satoshi Takano, Kenji Miyazaki, Noriki Hayashi