Patents by Inventor Kenji Motai

Kenji Motai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11787207
    Abstract: An opening/closing mechanism for an opening/closing cover includes the opening/closing cover, a cover protrusion, a protrusion engagement lever, an elastic member, and a cover opening section having an operation section, the cover opening section being configured to rotate the opening/closing cover in the closed position to a second position. The cover protrusion includes a second engaging portion configured to be pushed by the protrusion engagement member when the opening/closing cover is in the second position such that the opening/closing cover remains in the second position and includes a third engaging portion configured to be pushed by the protrusion engagement member when the opening/closing cover is in a third position between the second position and the open position such that the opening/closing cover rotates from the third position to the open position.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: October 17, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hirosuke Yasuki, Kenji Motai, Keisuke Taruya, Keishin Sakamoto
  • Patent number: 11590769
    Abstract: A tape printing device includes a platen shaft that engages with a platen roller; a thermal head that prints on a tape sandwiched with the platen roller engaged with the platen shaft; a head holder that has a rotating shaft and rotatably holds the thermal head about the rotating shaft; and a pressing member that is provided to be rotatable about the rotating shaft together with the thermal head and presses the thermal head against the platen roller, in which the pressing member has a convex portion that protrudes toward the thermal head and presses the thermal head against the platen roller.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: February 28, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kenji Motai, Hirosuke Yasuki, Keisuke Taruya
  • Publication number: 20220297453
    Abstract: An opening/closing mechanism for an opening/closing cover includes the opening/closing cover, a cover protrusion, a protrusion engagement lever, an elastic member, and a cover opening section having an operation section, the cover opening section being configured to rotate the opening/closing cover in the closed position to a second position. The cover protrusion includes a second engaging portion configured to be pushed by the protrusion engagement member when the opening/closing cover is in the second position such that the opening/closing cover remains in the second position and includes a third engaging portion configured to be pushed by the protrusion engagement member when the opening/closing cover is in a third position between the second position and the open position such that the opening/closing cover rotates from the third position to the open position.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 22, 2022
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hirosuke YASUKI, Kenji MOTAI, Keisuke TARUYA, Keishin SAKAMOTO
  • Patent number: 11376874
    Abstract: A half cutter includes a cutting blade having a blade and a holder to which the blade is fixed, a blade receiving member having a blade receiving surface from and with which the blade is separated and comes into contact, and a spacer having at least one of a holder spacer arranged at the holder which is made of a material that is different from a material of the holder, is provided in the holder to protrude toward the blade receiving surface further than the blade, and generates a gap between the blade and the blade receiving surface and a blade receiving spacer arranged at the blade receiving surface which is made of a material different from a material of the blade receiving member, is provided to protrude from the blade receiving surface, and generates a gap between the blade and the blade receiving surface.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: July 5, 2022
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kenji Motai, Tadashi Inaba
  • Publication number: 20220097412
    Abstract: A tape printing device includes a platen shaft that engages with a platen roller; a thermal head that prints on a tape sandwiched with the platen roller engaged with the platen shaft; a head holder that has a rotating shaft and rotatably holds the thermal head about the rotating shaft; and a pressing member that is provided to be rotatable about the rotating shaft together with the thermal head and presses the thermal head against the platen roller, in which the pressing member has a convex portion that protrudes toward the thermal head and presses the thermal head against the platen roller.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 31, 2022
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kenji MOTAI, Hirosuke YASUKI, Keisuke TARUYA
  • Publication number: 20210331342
    Abstract: A half cutter includes a cutting blade having a blade and a holder to which the blade is fixed, a blade receiving member having a blade receiving surface from and with which the blade is separated and comes into contact, and a spacer having at least one of a holder spacer arranged at the holder which is made of a material that is different from a material of the holder, is provided in the holder to protrude toward the blade receiving surface further than the blade, and generates a gap between the blade and the blade receiving surface and a blade receiving spacer arranged at the blade receiving surface which is made of a material different from a material of the blade receiving member, is provided to protrude from the blade receiving surface, and generates a gap between the blade and the blade receiving surface.
    Type: Application
    Filed: June 11, 2018
    Publication date: October 28, 2021
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kenji MOTAI, Tadashi INABA
  • Patent number: 10807382
    Abstract: A tape printing device includes a cartridge mounting portion on which a tape cartridge is mounted, a detection unit that has a first detection member configured to be protruded from and retracted into a first detection opening provided on a bottom surface of the cartridge mounting portion, and detects a type of a printing tape accommodated in the tape cartridge, and a thermal head that performs printing on the printing tape. A portion of the first detection member, exposed from the first detection opening, is located outside the tape accommodating area and is provided at a position on a side of the tape accommodating area different from a side of a first area in a plan view when the tape cartridge is mounted on the cartridge mounting portion.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: October 20, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tomoyuki Kubota, Kenji Motai
  • Publication number: 20200001619
    Abstract: A tape printing device includes a cartridge mounting portion on which a tape cartridge is mounted, a detection unit that has a first detection member configured to be protruded from and retracted into a first detection opening provided on a bottom surface of the cartridge mounting portion, and detects a type of a printing tape accommodated in the tape cartridge, and a thermal head that performs printing on the printing tape. A portion of the first detection member, exposed from the first detection opening, is located outside the tape accommodating area and is provided at a position on a side of the tape accommodating area different from a side of a first area in a plan view when the tape cartridge is mounted on the cartridge mounting portion.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 2, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tomoyuki KUBOTA, Kenji MOTAI
  • Patent number: 5368805
    Abstract: An assembly is provided with a semiconductor chip mounted on the main surface side of a die pad of a lead frame. The semiconductor chip is connected with a lead via bonding wire. The assembly is inserted into a transfer molding die for resin sealing, wherein the die temperature of a lower die is set higher than the die temperature of an upper die, and the transfer molding is carried out. Specifically, the die surface temperature of the lower die disposed at the main surface side of the lead frame is set higher by +5.degree. to +15.degree. C. than the die surface temperature (170.degree. C.) of the upper die disposed at the rear surface side to carry out molding. This reduces the viscosity of the sealing resin flowing into the rear surface side to increase fluidity of the resin, and a thin resin layer can be positively molded without insufficient resin filling at the rear surface side where the flow path cross sectional area in the cavity is small.
    Type: Grant
    Filed: March 23, 1993
    Date of Patent: November 29, 1994
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Kenji Motai