Patents by Inventor Kenji Nakamizo
Kenji Nakamizo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084458Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
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Patent number: 11905603Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.Type: GrantFiled: December 17, 2021Date of Patent: February 20, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Takashi Nakazawa, Isamu Miyamoto, Keigo Satake, Kenji Nakamizo
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Publication number: 20220195609Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.Type: ApplicationFiled: December 17, 2021Publication date: June 23, 2022Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
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Patent number: 11135698Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.Type: GrantFiled: June 14, 2016Date of Patent: October 5, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki
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Patent number: 11118255Abstract: A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a?b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y? (3) is 85% or more.Type: GrantFiled: September 13, 2016Date of Patent: September 14, 2021Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD., TOHOKU UNIVERSITYInventors: Misato Fujii, Sumio Kise, Toyonobu Tanaka, Kenji Nakamizo, Koji Ishikawa, Toshihiro Omori, Ryosuke Kainuma
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Patent number: 11094568Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.Type: GrantFiled: April 24, 2018Date of Patent: August 17, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Kenji Nakamizo, Satoshi Morita, Akinori Tanaka, Hiroshi Komiya, Mikio Nakashima, Kousuke Fukuda, Youichi Masaki, Ryoji Ando, Ikuo Sunaka
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Patent number: 10400311Abstract: A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a ? value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a ? single phase; and the use thereof.Type: GrantFiled: January 15, 2016Date of Patent: September 3, 2019Assignees: FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD., TOHOKU UNIVERSITYInventors: Sumio Kise, Toyonobu Tanaka, Kenji Nakamizo, Koji Ishikawa, Misato Fujii, Toshihiro Omori, Ryosuke Kainuma
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Patent number: 10351939Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.Type: GrantFiled: March 16, 2015Date of Patent: July 16, 2019Assignees: TOHOKU UNIVERSITY, FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD.Inventors: Toshihiro Omori, Shingo Kawata, Ryosuke Kainuma, Kiyohito Ishida, Toyonobu Tanaka, Kenji Nakamizo, Sumio Kise, Koji Ishikawa, Misato Nakano, Satoshi Teshigawara
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Patent number: 10261521Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.Type: GrantFiled: June 14, 2016Date of Patent: April 16, 2019Assignee: Tokyo Electron LimitedInventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki, Takuro Masuzumi
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Publication number: 20180308730Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.Type: ApplicationFiled: April 24, 2018Publication date: October 25, 2018Inventors: Kenji NAKAMIZO, Satoshi MORITA, Akinori TANAKA, Hiroshi KOMIYA, Mikio NAKASHIMA, Kousuke FUKUDA, Youichi MASAKI, Ryoji ANDO, Ikuo SUNAKA
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Publication number: 20160376688Abstract: A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a?b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y? (3) is 85% or more.Type: ApplicationFiled: September 13, 2016Publication date: December 29, 2016Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD., Tohoku UniversityInventors: Misato FUJII, Sumio KISE, Toyonobu TANAKA, Kenji NAKAMIZO, Koji ISHIKAWA, Toshihiro OMORI, Ryosuke KAINUMA
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Publication number: 20160368114Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.Type: ApplicationFiled: June 14, 2016Publication date: December 22, 2016Inventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki
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Publication number: 20160370810Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.Type: ApplicationFiled: June 14, 2016Publication date: December 22, 2016Inventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki, Takuro Masuzumi
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Publication number: 20160130683Abstract: A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a ? value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a ? single phase; and the use thereof.Type: ApplicationFiled: January 15, 2016Publication date: May 12, 2016Applicants: FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD., Tohoku UniversityInventors: Sumio KISE, Toyonobu TANAKA, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Toshihiro OMORI, Ryosuke KAINUMA
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Publication number: 20160060740Abstract: A Cu—Al—Mn-based alloy rod having superelastic characteristics and having a recrystallized microstructure substantially formed of a ? single phase, wherein, for a longitudinal direction cross section of the rod, a region, in which a grain size of each of grains is a radius of the rod or more, is 90% or more of the longitudinal direction cross section at any location of the rod, and wherein an average grain size of the grains, in which the grain size is the radius of the rod or more, is 80% or more of a diameter of the rod; a Cu—Al—Mn-based alloy sheet; a production method thereof; a vibration damping material using thereof; a vibration damping structure constructed by using the vibration damping material.Type: ApplicationFiled: November 10, 2015Publication date: March 3, 2016Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD.Inventors: Toshihiro OMORI, Tomoe KUSAMA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Sumio KISE, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Satoshi TESHIGAWARA
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Publication number: 20150225826Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.Type: ApplicationFiled: March 16, 2015Publication date: August 13, 2015Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD, FURUKAWA TECHNO MATERIAL CO., LTD.Inventors: Toshihiro OMORI, Shingo KAWATA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Kenji NAKAMIZO, Sumio KISE, Koji ISHIKAWA, Misato NAKANO, Satoshi TESHIGAWARA
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Patent number: 9039863Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.Type: GrantFiled: November 15, 2012Date of Patent: May 26, 2015Assignee: Tokyo Electron LimitedInventors: Shuhei Matsumoto, Shuji Iwanaga, Hiroshi Tomita, Kenji Nakamizo, Satoshi Morita
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Patent number: 8654325Abstract: Provided is a substrate processing apparatus including a placement table on which a substrate is disposed; a light source configured to irradiate light on the surface of the substrate on the placement unit; a detector configured to detect the light amount reflected from the substrate; and a control unit configured to perform a determination process of determining whether a detection value of the light amount is smaller than a predetermined value at a plurality of positions, and to determine that a holding state of the substrate is abnormal when the total number of times of determination in which it is determined that the detection value is smaller than the predetermined value reaches a predetermined number of times.Type: GrantFiled: July 3, 2012Date of Patent: February 18, 2014Assignee: Tokyo Electron LimitedInventors: Kenji Nakamizo, Satoshi Morita
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Publication number: 20130334172Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.Type: ApplicationFiled: November 15, 2012Publication date: December 19, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Shuhei Matsumoto, Shuji Iwanaga, Hiroshi Tomita, Kenji Nakamizo, Satoshi Morita
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Publication number: 20130010289Abstract: Provided is a substrate processing apparatus including a placement table on which a substrate is disposed; a light source configured to irradiate light on the surface of the substrate on the placement unit; a detector configured to detect the light amount reflected from the substrate; and a control unit configured to perform a determination process of determining whether a detection value of the light amount is smaller than a predetermined value at a plurality of positions, and to determine that a holding state of the substrate is abnormal when the total number of times of determination in which it is determined that the detection value is smaller than the predetermined value reaches a predetermined number of times.Type: ApplicationFiled: July 3, 2012Publication date: January 10, 2013Inventors: Kenji Nakamizo, Satoshi Morita