Abstract: A semiconductor package includes a substrate body made of an insulating material and having a frame shape with a through hole; and a heat-dissipating member made of a metallic material and having a top face serving as an element-mounting surface, the element-mounting surface being positioned in the through hole. A back face of the substrate body and a front face of the heat-dissipating member are joined to each other with a joining agent, the back face being oriented downward, the front face being oriented upward. The substrate body includes a first riser portion extending downward from the back face. The heat-dissipating member includes a second riser portion extending upward from the front face. The joining agent is placed in a space enclosed by the back face, the first riser portion, the front face, and the second riser portion.

Abstract: A primary radiator used for a parabolic antenna including: a radiator body having a horn part provided at one end of a waveguide; and a waterproof cover covering an open end of the horn part of the radiator body, wherein a step is formed on an inner surface of the horn part of the radiator body, and a position of the step is set so that radio waves reflected on the waterproof cover are cancelled out by radio waves reflected on the step to prevent multiple reflection in the radiator body.

Abstract: A primary radiator used for a parabolic antenna including: a radiator body having a horn part provided at one end of a waveguide; and a waterproof cover covering an open end of the horn part of the radiator body, wherein a step is formed on an inner surface of the horn part of the radiator body, and a position of the step is set so that radio waves reflected on the waterproof cover are cancelled out by radio waves reflected on the step to prevent multiple reflection in the radiator body.