Patents by Inventor Kenji Ohama

Kenji Ohama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6780940
    Abstract: The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: August 24, 2004
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Nori Yoshihara, Kenji Ohama, Satoshi Sakai, Hitoshi Kosugi, Koji Nakanishi
  • Publication number: 20020061968
    Abstract: The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.
    Type: Application
    Filed: September 25, 2001
    Publication date: May 23, 2002
    Applicant: TOYO BOSEKI KABUSHIKI KAISHA
    Inventors: Nori Yoshihara, Kenji Ohama, Satoshi Sakai, Hitoshi Kosugi, Koji Nakanishi
  • Patent number: 5563223
    Abstract: A coat resin composition comprising a polyester (A) comprising an acid component comprising an aromatic dicarboxylic acid in a proportion of 50-100% by mole relative to the entire acid component and other carboxylic acid(s) in a proportion of 50-0% by mole relative to the entire acid component, and a glycol component comprising 2-methyl-1,3-propanediol and/or 1,3-propanediol in a proportion of 1-25% by mole relative to the entire glycol component and an alkylene glycol having 5 to 10 carbon atoms in a proportion of 75-99% by mole relative to the entire glycol component, or an alicyclic glycol in a proportion of 20-85% by mole relative to the entire glycol component, an addition product of bisphenol A with alkylene oxide in a proportion of 80-15% by mole relative to the entire glycol component and other glycol(s) in a proportion of 0-50% by mole relative to the entire glycol component, wherein the total of the glycols is 100% by mole, the polyester (A) having a reduced viscosity of not less than 0.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: October 8, 1996
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hiroshi Tachika, Kenji Ohama, Keiichiro Togawa, Masami Oka