Patents by Inventor Kenji Ohshima
Kenji Ohshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10903754Abstract: A problem to be solved by the present invention is to secure a creepage distance while maintaining miniaturization. A power converter according to the present invention includes a positive electrode side conductor, a negative electrode side conductor, and an insulating member disposed between the positive electrode side conductor and the negative electrode side conductor, in which the positive electrode side conductor or the negative electrode side conductor includes a main surface on a side opposite to a surface in contact with the insulating member, a side surface connected to the surface in contact with the insulating member, and an inclined surface forming an obtuse angle with respect to each of the main surface and the side surface, and the insulating member includes a protrusion formed so as to overlap with the side surface and the inclined surface as viewed in a direction perpendicular to the side surface.Type: GrantFiled: December 19, 2017Date of Patent: January 26, 2021Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Ayumu Hatanaka, Takeshi Seki, Kazushi Takahashi, Kenji Ohshima
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Publication number: 20190356238Abstract: A problem to be solved by the present invention is to secure a creepage distance while maintaining miniaturization. A power converter according to the present invention includes a positive electrode side conductor, a negative electrode side conductor, and an insulating member disposed between the positive electrode side conductor and the negative electrode side conductor, in which the positive electrode side conductor or the negative electrode side conductor includes a main surface on a side opposite to a surface in contact with the insulating member, a side surface connected to the surface in contact with the insulating member, and an inclined surface forming an obtuse angle with respect to each of the main surface and the side surface, and the insulating member includes a protrusion formed so as to overlap with the side surface and the inclined surface as viewed in a direction perpendicular to the side surface.Type: ApplicationFiled: December 19, 2017Publication date: November 21, 2019Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Ayumu HATANAKA, Takeshi SEKI, Kazushi TAKAHASHI, Kenji OHSHIMA
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Patent number: 9596782Abstract: In a power converter, cooling of the power converter is extremely important for improving a power conversion performance. Specifically, a DC smoothing capacitor module stored in a housing of the power converter is heat-sensitive, and in order to secure the performance, efficient cooling of the capacitor module is required. In addition, reducing the heat entering from the outside as much as possible is required. A conductor panel of the capacitor module and the housing are connected via a cooling panel, an AC connection bus bar and the housing is connected by the cooling panel to release heat from the capacitor module and the AC connection bus bar to the housing via the cooling panel.Type: GrantFiled: January 21, 2013Date of Patent: March 14, 2017Assignee: Hitachi Automotive Systems, Ltd.Inventors: Fusanori Nishikimi, Kenji Ohshima
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Patent number: 9350228Abstract: A power conversion device includes a capacitor for smoothing DC current; power semiconductor modules having power semiconductor devices stored in a module case and DC terminals, an AC terminal and signal terminals are extracted from an extracting part of the module case; a capacitor bus bar that connects the capacitor with the DC terminals; a first channel body having a first coolant channel formed to allow the power semiconductor modules to be inserted therein; a second channel body in which a second coolant channel for cooling the capacitor and the capacitor bus bar is formed; and a housing having a base on which the first and second channel bodies are arranged in parallel across a prescribed space and openings formed in areas of the base facing the prescribed space.Type: GrantFiled: July 25, 2012Date of Patent: May 24, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Masahiro Uetake, Kenji Ohshima
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Publication number: 20150049533Abstract: In a power converter, cooling of the power converter is extremely important for improving a power conversion performance. Specifically, a DC smoothing capacitor module stored in a housing of the power converter is heat-sensitive, and in order to secure the performance, efficient cooling of the capacitor module is required. In addition, reducing the heat entering from the outside as much as possible is required. A conductor panel of the capacitor module and the housing are connected via a cooling panel, an AC connection bus bar and the housing is connected by the cooling panel to release heat from the capacitor module and the AC connection bus bar to the housing via the cooling panel.Type: ApplicationFiled: January 21, 2013Publication date: February 19, 2015Inventors: Fusanori Nishikimi, Kenji Ohshima
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Publication number: 20140160823Abstract: A power conversion device includes a capacitor for smoothing DC current; power semiconductor modules having power semiconductor devices stored in a module case and DC terminals, an AC terminal and signal terminals are extracted from an extracting part of the module case; a capacitor bus bar that connects the capacitor with the DC terminals; a first channel body having a first coolant channel formed to allow the power semiconductor modules to be inserted therein; a second channel body in which a second coolant channel for cooling the capacitor and the capacitor bus bar is formed; and a housing having a base on which the first and second channel bodies are arranged in parallel across a prescribed space and openings formed in areas of the base facing the prescribed space.Type: ApplicationFiled: July 25, 2012Publication date: June 12, 2014Applicant: Hitachi Automotive Systems, LtdInventors: Masahiro Uetake, Kenji Ohshima
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Patent number: 7037298Abstract: The invention is directed to an improvement of performance for disposable absorbent articles to prevent a leakage of body discharges. A disposable absorbent article comprising: an absorbent body having an average width of from about 5 mm to about 30 mm. The first resilient material is disposed between the body facing surface and the garment facing surface of the absorbent article; and a first resilient material disposed between the body facing surface and the absorbent body in a circumferential manner such that at least a part of the body facing surface of the absorbent article forms a raised circumferential bank in the central region and a concave portion surrounded by the raised circumferential bank. The first resilient material is selected from the group consisting of a polymeric foam material, a fibrous material, an elastic material, a formed film material, an absorbent gelling material, and a mixture thereof.Type: GrantFiled: November 22, 2002Date of Patent: May 2, 2006Assignee: The Procter & Gamble CompanyInventors: Kenji Ohshima, Yuka Momotani, Kieko Imai
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Patent number: 6807904Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.Type: GrantFiled: May 29, 2003Date of Patent: October 26, 2004Assignee: Riso Kagaku CorporationInventors: Kenji Ohshima, Jun Nakamura
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Patent number: 6758138Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.Type: GrantFiled: May 30, 2003Date of Patent: July 6, 2004Assignee: Riso Kagaku CorporationInventors: Jun Nakamura, Kenji Ohshima
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Patent number: 6755126Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.Type: GrantFiled: May 30, 2003Date of Patent: June 29, 2004Assignee: Riso Kagaku CorporationInventors: Jun Nakamura, Kenji Ohshima
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Publication number: 20040089170Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.Type: ApplicationFiled: August 15, 2003Publication date: May 13, 2004Applicant: Riso Kagaku CorporationInventors: Jun Nakamura, Kenji Ohshima
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Publication number: 20040089172Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.Type: ApplicationFiled: August 15, 2003Publication date: May 13, 2004Applicant: Riso Kagaku CorporationInventors: Jun Nakamura, Kenji Ohshima
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Publication number: 20040035307Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.Type: ApplicationFiled: May 29, 2003Publication date: February 26, 2004Applicant: RISO KAGAKU CORPORATIONInventors: Kenji Ohshima, Jun Nakamura
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Publication number: 20040035308Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.Type: ApplicationFiled: September 24, 2003Publication date: February 26, 2004Applicant: RISO KAGAKU CORPORATIONInventors: Jun Nakamura, Kenji Ohshima
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Publication number: 20030213385Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.Type: ApplicationFiled: May 30, 2003Publication date: November 20, 2003Inventors: Jun Nakamura, Kenji Ohshima
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Patent number: 6629495Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.Type: GrantFiled: May 17, 2001Date of Patent: October 7, 2003Assignee: Riso Kagaku CorporationInventors: Jun Nakamura, Kenji Ohshima
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Publication number: 20030120233Abstract: The invention is directed to an improvement of performance for disposable absorbent articles to prevent a leakage of body discharges. A disposable absorbent article comprising: an absorbent body having an average width of from about 5 mm to about 30 mm. The first resilient material is disposed between the body facing surface and the garment facing surface of the absorbent article; and a first resilient material disposed between the body facing surface and the absorbent body in a circumferential manner such that at least a part of the body facing surface of the absorbent article forms a raised circumferential bank in the central region and a concave portion surrounded by the raised circumferential bank. The first resilient material is selected from the group consisting of a polymeric foam material, a fibrous material, an elastic material, a formed film material, an absorbent gelling material, and a mixture thereof.Type: ApplicationFiled: November 22, 2002Publication date: June 26, 2003Applicant: The Procter & Gamble CompanyInventors: Kenji Ohshima, Yuka Momotani, Kieko Imai
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Patent number: 6571699Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.Type: GrantFiled: May 17, 2001Date of Patent: June 3, 2003Assignee: Riso Kagaku CorporationInventors: Kenji Ohshima, Jun Nakamura
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Patent number: 6571700Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.Type: GrantFiled: May 17, 2001Date of Patent: June 3, 2003Assignee: Riso Kagaku CorporationInventors: Jun Nakamura, Kenji Ohshima
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Publication number: 20020018874Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.Type: ApplicationFiled: May 17, 2001Publication date: February 14, 2002Inventors: Jun Nakamura, Kenji Ohshima