Patents by Inventor Kenji Ohshima

Kenji Ohshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10903754
    Abstract: A problem to be solved by the present invention is to secure a creepage distance while maintaining miniaturization. A power converter according to the present invention includes a positive electrode side conductor, a negative electrode side conductor, and an insulating member disposed between the positive electrode side conductor and the negative electrode side conductor, in which the positive electrode side conductor or the negative electrode side conductor includes a main surface on a side opposite to a surface in contact with the insulating member, a side surface connected to the surface in contact with the insulating member, and an inclined surface forming an obtuse angle with respect to each of the main surface and the side surface, and the insulating member includes a protrusion formed so as to overlap with the side surface and the inclined surface as viewed in a direction perpendicular to the side surface.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: January 26, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Ayumu Hatanaka, Takeshi Seki, Kazushi Takahashi, Kenji Ohshima
  • Publication number: 20190356238
    Abstract: A problem to be solved by the present invention is to secure a creepage distance while maintaining miniaturization. A power converter according to the present invention includes a positive electrode side conductor, a negative electrode side conductor, and an insulating member disposed between the positive electrode side conductor and the negative electrode side conductor, in which the positive electrode side conductor or the negative electrode side conductor includes a main surface on a side opposite to a surface in contact with the insulating member, a side surface connected to the surface in contact with the insulating member, and an inclined surface forming an obtuse angle with respect to each of the main surface and the side surface, and the insulating member includes a protrusion formed so as to overlap with the side surface and the inclined surface as viewed in a direction perpendicular to the side surface.
    Type: Application
    Filed: December 19, 2017
    Publication date: November 21, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Ayumu HATANAKA, Takeshi SEKI, Kazushi TAKAHASHI, Kenji OHSHIMA
  • Patent number: 9596782
    Abstract: In a power converter, cooling of the power converter is extremely important for improving a power conversion performance. Specifically, a DC smoothing capacitor module stored in a housing of the power converter is heat-sensitive, and in order to secure the performance, efficient cooling of the capacitor module is required. In addition, reducing the heat entering from the outside as much as possible is required. A conductor panel of the capacitor module and the housing are connected via a cooling panel, an AC connection bus bar and the housing is connected by the cooling panel to release heat from the capacitor module and the AC connection bus bar to the housing via the cooling panel.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: March 14, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Fusanori Nishikimi, Kenji Ohshima
  • Patent number: 9350228
    Abstract: A power conversion device includes a capacitor for smoothing DC current; power semiconductor modules having power semiconductor devices stored in a module case and DC terminals, an AC terminal and signal terminals are extracted from an extracting part of the module case; a capacitor bus bar that connects the capacitor with the DC terminals; a first channel body having a first coolant channel formed to allow the power semiconductor modules to be inserted therein; a second channel body in which a second coolant channel for cooling the capacitor and the capacitor bus bar is formed; and a housing having a base on which the first and second channel bodies are arranged in parallel across a prescribed space and openings formed in areas of the base facing the prescribed space.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: May 24, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masahiro Uetake, Kenji Ohshima
  • Publication number: 20150049533
    Abstract: In a power converter, cooling of the power converter is extremely important for improving a power conversion performance. Specifically, a DC smoothing capacitor module stored in a housing of the power converter is heat-sensitive, and in order to secure the performance, efficient cooling of the capacitor module is required. In addition, reducing the heat entering from the outside as much as possible is required. A conductor panel of the capacitor module and the housing are connected via a cooling panel, an AC connection bus bar and the housing is connected by the cooling panel to release heat from the capacitor module and the AC connection bus bar to the housing via the cooling panel.
    Type: Application
    Filed: January 21, 2013
    Publication date: February 19, 2015
    Inventors: Fusanori Nishikimi, Kenji Ohshima
  • Publication number: 20140160823
    Abstract: A power conversion device includes a capacitor for smoothing DC current; power semiconductor modules having power semiconductor devices stored in a module case and DC terminals, an AC terminal and signal terminals are extracted from an extracting part of the module case; a capacitor bus bar that connects the capacitor with the DC terminals; a first channel body having a first coolant channel formed to allow the power semiconductor modules to be inserted therein; a second channel body in which a second coolant channel for cooling the capacitor and the capacitor bus bar is formed; and a housing having a base on which the first and second channel bodies are arranged in parallel across a prescribed space and openings formed in areas of the base facing the prescribed space.
    Type: Application
    Filed: July 25, 2012
    Publication date: June 12, 2014
    Applicant: Hitachi Automotive Systems, Ltd
    Inventors: Masahiro Uetake, Kenji Ohshima
  • Patent number: 7037298
    Abstract: The invention is directed to an improvement of performance for disposable absorbent articles to prevent a leakage of body discharges. A disposable absorbent article comprising: an absorbent body having an average width of from about 5 mm to about 30 mm. The first resilient material is disposed between the body facing surface and the garment facing surface of the absorbent article; and a first resilient material disposed between the body facing surface and the absorbent body in a circumferential manner such that at least a part of the body facing surface of the absorbent article forms a raised circumferential bank in the central region and a concave portion surrounded by the raised circumferential bank. The first resilient material is selected from the group consisting of a polymeric foam material, a fibrous material, an elastic material, a formed film material, an absorbent gelling material, and a mixture thereof.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: May 2, 2006
    Assignee: The Procter & Gamble Company
    Inventors: Kenji Ohshima, Yuka Momotani, Kieko Imai
  • Patent number: 6807904
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: October 26, 2004
    Assignee: Riso Kagaku Corporation
    Inventors: Kenji Ohshima, Jun Nakamura
  • Patent number: 6758138
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: July 6, 2004
    Assignee: Riso Kagaku Corporation
    Inventors: Jun Nakamura, Kenji Ohshima
  • Patent number: 6755126
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: June 29, 2004
    Assignee: Riso Kagaku Corporation
    Inventors: Jun Nakamura, Kenji Ohshima
  • Publication number: 20040089170
    Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
    Type: Application
    Filed: August 15, 2003
    Publication date: May 13, 2004
    Applicant: Riso Kagaku Corporation
    Inventors: Jun Nakamura, Kenji Ohshima
  • Publication number: 20040089172
    Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
    Type: Application
    Filed: August 15, 2003
    Publication date: May 13, 2004
    Applicant: Riso Kagaku Corporation
    Inventors: Jun Nakamura, Kenji Ohshima
  • Publication number: 20040035307
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.
    Type: Application
    Filed: May 29, 2003
    Publication date: February 26, 2004
    Applicant: RISO KAGAKU CORPORATION
    Inventors: Kenji Ohshima, Jun Nakamura
  • Publication number: 20040035308
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.
    Type: Application
    Filed: September 24, 2003
    Publication date: February 26, 2004
    Applicant: RISO KAGAKU CORPORATION
    Inventors: Jun Nakamura, Kenji Ohshima
  • Publication number: 20030213385
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.
    Type: Application
    Filed: May 30, 2003
    Publication date: November 20, 2003
    Inventors: Jun Nakamura, Kenji Ohshima
  • Patent number: 6629495
    Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: October 7, 2003
    Assignee: Riso Kagaku Corporation
    Inventors: Jun Nakamura, Kenji Ohshima
  • Publication number: 20030120233
    Abstract: The invention is directed to an improvement of performance for disposable absorbent articles to prevent a leakage of body discharges. A disposable absorbent article comprising: an absorbent body having an average width of from about 5 mm to about 30 mm. The first resilient material is disposed between the body facing surface and the garment facing surface of the absorbent article; and a first resilient material disposed between the body facing surface and the absorbent body in a circumferential manner such that at least a part of the body facing surface of the absorbent article forms a raised circumferential bank in the central region and a concave portion surrounded by the raised circumferential bank. The first resilient material is selected from the group consisting of a polymeric foam material, a fibrous material, an elastic material, a formed film material, an absorbent gelling material, and a mixture thereof.
    Type: Application
    Filed: November 22, 2002
    Publication date: June 26, 2003
    Applicant: The Procter & Gamble Company
    Inventors: Kenji Ohshima, Yuka Momotani, Kieko Imai
  • Patent number: 6571699
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: June 3, 2003
    Assignee: Riso Kagaku Corporation
    Inventors: Kenji Ohshima, Jun Nakamura
  • Patent number: 6571700
    Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: June 3, 2003
    Assignee: Riso Kagaku Corporation
    Inventors: Jun Nakamura, Kenji Ohshima
  • Publication number: 20020018874
    Abstract: When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
    Type: Application
    Filed: May 17, 2001
    Publication date: February 14, 2002
    Inventors: Jun Nakamura, Kenji Ohshima