Abstract: Locking lances (12) are formed at an outer wall (10B) of a housing (10) and are resiliently deformable between engaging positions to engage terminals (20) and disengaging positions outward from the engaging positions to permit the insertion and withdrawal of the terminals (20). Leading end surfaces (12B) of the locking lances (12) are inclined to project gradually forward toward an inner side of the housing (10). A facing surface (15A) of the outer wall (10B) of the housing 10 facing the leading end surfaces (12B) of the locking lances 12 is inclined to project gradually toward the locking lances (12) at more outward positions on the housing (10). The leading end surfaces (12B) of the locking lances (12) contact the facing surface (15A) when the locking lances (12) are deformed outward beyond the disengaging positions.

Abstract: A glass substrate obtained by a method including measuring flatness of a glass substrate surface and measuring concentration distribution of dopant in the substrate. Processing conditions of the surface are set up for each site of the substrate based on results from the measuring the flatness and the measuring the distribution, and the finishing is carried out while keeping an angle formed by normal line of the substrate and incident beam onto the surface at from 30 to 89°. The surface is subjected to second finishing for improving an RMS in a high spatial frequency region. The surface after the second finishing satisfies the requirements: an RMS slope in the region that 5 ?m<?(spatial wavelength)<1 mm is not more than 0.5 mRad and an RMS slope in the region that 250 nm<?(spatial wavelength)<5 ?m is not more than 0.6 mRad.

Abstract: A connector (10) has a terminal fitting (17) press-fit into a terminal holding portion (18). The terminal fitting (17) has a wide rectangular cross-sectional shape and includes a lower surface (17A), two side surfaces (17B) standing upward from the opposite lateral edges of the lower surface (17A) and an upper surface (17C) connecting the upper edges of the side surfaces (17B). The terminal holding portion (18) includes two side walls (18B) that interfere with the side surfaces (17B), a bottom wall (18A) formed with lower interfering portions (18E) that interfere with non-touching parts (17D) of the lower surface portion (17A) not to be held in contact with a mating terminal fitting (21) and a ceiling wall (18C) formed with upper interfering portions (18D) that interfere with non-touching parts (17D) of the upper surface (17C) not to be held in contact with the mating terminal fitting (21).

Abstract: A terminal (20) has a terminal main body (51) with a projection (55) to be engaged with a retainer (40). A wire barrel (21) to be crimped to a core (11) of a wire (10), an insulation barrel (23) to be crimped to an insulating coating (12) and a rubber plug barrel (24) to be crimped to a rubber plug (15) are successively arranged behind the main body (51). Bottom parts of the wire barrel (21) and the insulation barrel (23) are at low positions having substantially the same height. A front end of the wire barrel (23) is crimped flat to suppress bend-up of the core (11). The front end of the crimped wire barrel (21) is insertable to a position facing a projecting end of the retainer (40) when the terminal (20) is inserted to a proper position in a cavity (31) of a housing (30).

Abstract: A board connector (10) has a housing (20) with a terminal holding portion (40) for holding terminals (30) in forward and backward directions and a receptacle extends forward from the terminal holding portion (40). Mount grooves (60) are formed in side walls (52) of the receptacle (50). Board fixing portions (70) are held in the mount grooves (60) within the thickness range of the side walls and are soldered to the upper surface of a printed board (P). Mounting portions (54) are formed in the side walls (52) and have open front ends. Restricting members (80) are formed separately from the mating connector and mountable within the thickness range of the side walls (52) forward of the board fixing portions (70). One end of each restricting member (54) engages lower surfaces (54A) of the mounting portions (54) and the other end engages the lower surface of the printed board (P).

Abstract: The invention provides a method in which waviness generated on a glass substrate surface during pre-polishing is removed, thereby finishing the glass substrate to have a surface excellent in flatness. The method for finishing a pre-polished glass substrate uses ion beam etching, gas cluster ion beam etching or plasma etching, the method including: a step of measuring flatness of the glass substrate surface using a shape measurement unit, and a step of measuring a concentration distribution of the dopant contained in the glass substrate. Processing conditions of the glass substrate surface are set up for each site of the glass substrate based on the results obtained from the step of measuring flatness and the step of measuring a concentration distribution of the dopant. Finishing includes keeping an angle formed by a normal line of the glass substrate and an incident beam onto the glass substrate at from 30° to 89°.

Abstract: An object of the present invention is to provide a TiO2-containing quartz glass substrate which, when used as a mold base for nanoimprint lithography, can form a concavity and convexity pattern having a dimensional variation falling within ±10%. The invention relates to a TiO2-containing quartz glass substrate: in which a coefficient of thermal expansion in the range of from 15 to 35° C. is within ±200 ppb/° C.; a TiO2 concentration is from 4 to 9 wt %; and a TiO2 concentration distribution, in a substrate surface on the side where a transfer pattern is to be formed, is within ±1 wt %.

Abstract: Provided is an electrode (1) which has a double structure including Cu or a Cu alloy as an electrode body (2) and a core material (3) made of W, Mo, a W-based alloy, or a Mo-based alloy embedded in a surface of the electrode body (2) which is abutted against a material to be welded, the core material (3) being formed by using W, Mo, the W-based alloy, or the Mo-based alloy which is in the form of a fibrous structure extended by sintering, swaging, and annealing in an electrode axis direction, the fibrous structure having a horizontal cross-sectional average particle diameter of 50 ?m or more and an aspect ratio of 1.5 or more. The electrode (1) can be used as an inexpensive electrode obtained by suppressing particle dropping/attrition and defects in electrodes for spot welding, in which heat and pressure are applied repeatedly, stably enhancing durability.

Abstract: With the use of a tool (41), first cutting is applied to a work (W), and then second cutting is applied to the work (W) while the tool (41) is transferred in an X-axis direction. Then, an amount of deviation dy between the cutting edge height of the tool (41) and the center line of the work (W) is calculated based on a first diameter value (D1) and second diameter value (D2) measured after the first cutting and second cutting are applied, and the travel distance of the tool (41) between the first cutting and the second cutting. Machining to the work (W) is resumed after the amount of deviation is corrected.

Abstract: A board connector (10) has a housing (20) with a terminal holding portion (40) for holding terminals (30) in forward and backward directions and a receptacle extends forward from the terminal holding portion (40). Mount grooves (60) are formed in side walls (52) of the receptacle (50). Board fixing portions (70) are held in the mount grooves (60) within the thickness range of the side walls and are soldered to the upper surface of a printed board (P). Mounting portions (54) are formed in the side walls (52) and have open front ends. Restricting members (80) are formed separately from the mating connector and mountable within the thickness range of the side walls (52) forward of the board fixing portions (70). One end of each restricting member (54) engages lower surfaces (54A) of the mounting portions (54) and the other end engages the lower surface of the printed board (P).

Abstract: An object of the invention is to provide a method for removing foreign matter from a glass substrate surface to be finish-processed by a method accompanied with beam irradiation or laser light irradiation on the glass substrate surface. The present invention relates to a method for removing foreign matter from a glass substrate surface, which includes subjecting the glass substrate surface to gas cluster ion beam etching at an accelerating voltage of from 5 to 15 keV.

Abstract: A board connector (1) has a housing (10) and terminal fittings (20) penetrate through the back wall (11) of the housing (10). A board connecting portion (21) of each terminal fitting (20) penetrates through the back wall (11) and is solder-connected to a board (2). The housing (10) has a heat transfer inhibiting portion for inhibiting heat transfer to the back wall (11). The heat transfer inhibiting portion has a through-hole (13) or heat-insulating grooves (17) in the back wall (11). As a result, heat transfer to the back wall (11) is inhibited and deformation of the back wall (11) due to thermal expansion also is inhibited. Consequently, it is possible to prevent the terminal fittings (20) from separating from the board (2) and going into a state of being not solder-connected thereto.

Abstract: The present invention is to provide a method for processing the whole of a glass substrate surface so as to give a surface excellent in flatness and surface roughness. The present invention provides a method of processing a glass substrate surface using a processing technique selected from the group consisting of ion-beam etching, gas cluster ion-beam etching, plasma etching, and nano-ablation, wherein a frame element satisfying the following (1) and (2) is arranged along the periphery of the glass substrate before the glass substrate surface is processed: (1) the difference between the height of the frame element and the height of the glass substrate surface is 1 mm or smaller; and (2) the frame element has a width which is not smaller than one-half the beam diameter or laser light diameter to be used in the processing technique.

Abstract: A terminal fitting (10, 130, 510) has a connecting portion (11, 131, 511) to be connected with a mating connecting portion, and a crimping portion (12, 140) continuous with the rear end of the connecting portion (11, 131, 511) and including a bottom plate (21, 148, 515) and crimping pieces (22, 147, 516) standing up from the bottom plate (21, 148, 515). The crimping portion (12, 140) is crimped into connection with a wire (30, 120, 590) while surrounding an end portion of the wire (30, 120, 590) by the bottom plate (21, 148, 515) and the crimping pieces (22, 147, 516). The bottom plate (21, 148, 515) is formed with a reinforcing rib (24, 150, 250, 350, 450, 525) extending in forward and backward directions.

Abstract: A connector (10) has a terminal fitting (17) press-fit into a terminal holding portion (18). The terminal fitting (17) has a wide rectangular cross-sectional shape and includes a lower surface (17A), two side surfaces (17B) standing upward from the opposite lateral edges of the lower surface (17A) and an upper surface (17C) connecting the upper edges of the side surfaces (17B). The terminal holding portion (18) includes two side walls (18B) that interfere with the side surfaces (17B), a bottom wall (18A) formed with lower interfering portions (18E) that interfere with non-touching parts (17D) of the lower surface portion (17A) not to be held in contact with a mating terminal fitting (21) and a ceiling wall (18C) formed with upper interfering portions (18D) that interfere with non-touching parts (17D) of the upper surface (17C) not to be held in contact with the mating terminal fitting (21).

Abstract: Locking lances (12) are formed at an outer wall (10B) of a housing (10) and are resiliently deformable between engaging positions to engage terminals (20) and disengaging positions outward from the engaging positions to permit the insertion and withdrawal of the terminals (20). Leading end surfaces (12B) of the locking lances (12) are inclined to project gradually forward toward an inner side of the housing (10). A facing surface (15A) of the outer wall (10B) of the housing 10 facing the leading end surfaces (12B) of the locking lances 12 is inclined to project gradually toward the locking lances (12) at more outward positions on the housing (10). The leading end surfaces (12B) of the locking lances (12) contact the facing surface (15A) when the locking lances (12) are deformed outward beyond the disengaging positions.

Abstract: A controller for a work implement (10, 30) of a construction machine (1, 3) comprising: a manipulating signal input unit (21) including a target value computing section (25) for generating an operation target value (V1) for the work implement (10, 30) based on a manipulating signal (F, Fa) inputted from a manipulating unit (2) for manipulating the work implement (10, 30), a target value correcting unit (22, 37) for correcting the generated operation target value (V1), and an instruction signal output unit (23) for outputting an instruction signal to an actuator (19, 34) for driving the work implement (10, 30) according to the corrected target value (V2); wherein the target value correcting unit (22, 37) comprises a vibration suppressing unit (29) for correcting the operation target value (V1) to another target value to suppress vibrations of the construction machine (1, 3) according to the vibration characteristics, which vary according to a posture of and/or a load to the work implement (10, 30).

Abstract: The invention is to provide a method in which waviness generated on a glass substrate surface during pre-polishing is removed, thereby finishing the glass substrate so as to have a surface excellent in flatness.

Abstract: A joint connector (10) has sub-housings (S) (S1 to S6) that can be built up in plural levels. Projecting pieces (31) project on outer sides of the respective sub-housings (S) in directions intersecting a build-up direction (BUD) of the sub-housings (S) and define hand-push portions (13) by building up the sub-housings (S). The sub-housings (S) built up in levels are fit into the intermediate connector (20) by pushing the hand-push portions (13) towards the intermediate connector (20) so that terminal fittings (40) in the joint connector (10) are connected electrically with intermediate terminals (24) in the intermediate connector (20). Identifying projections (A) on the lower mating surfaces of the projecting pieces (31) enter identifying recesses (B) in the upper mating surfaces of adjacent projecting pieces (31) if the sub-housings (S) are built up properly.

Abstract: Disclosed is a fire-resistant lead-free shield material having high shielding ability against nuclear or electromagnetic radiation, and excellent bending workability and handling performance. The shield material comprises a composite material consisting of an organic material and a metal or metal compound having a nuclear or electromagnetic radiation-shielding ability. The composite material is formed into a given shape, such as a plate shape, and wrapped with a cloth-like sheet formed of glass fibers, metal fibers or carbon fibers. Alternatively, the shield material comprises a shielding element consisting of an elastic polymeric organic compound and a particle having a nuclear or electromagnetic radiation-shielding ability, such a heavy metal or ferrite.