Patents by Inventor Kenji Oogushi

Kenji Oogushi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9041243
    Abstract: A power control apparatus is mounted on an electrically driven vehicle which includes an electrical storage device configured by connecting a plurality of batteries in parallel, a voltage detection unit which detects a voltage of each battery, and a load, and the power control apparatus includes, a voltage deviation calculation unit which is connected to the electrical storage device, and calculates voltage deviation between the plurality of batteries based on the voltage detected by each voltage detection unit at the time of driving the load which is driven by power supply from the electrical storage device, a comparator which compares the voltage deviation calculated by the voltage deviation calculation unit and a first predetermined threshold, and a cutoff detection unit which detects a presence or absence of the battery, which comes into a cutoff state in the electrical storage device, when the voltage deviation is equal to or more than the first threshold in a comparison result by the comparator.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: May 26, 2015
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hideaki Iwashita, Kenji Oogushi, Masaya Deguchi, Eisuke Komazawa, Masatoshi Nakajima, Naoto Doi
  • Publication number: 20140300180
    Abstract: A power control apparatus is mounted on an electrically driven vehicle which includes an electrical storage device configured by connecting a plurality of batteries in parallel, a voltage detection unit which detects a voltage of each battery, and a load, and the power control apparatus includes, a voltage deviation calculation unit which is connected to the electrical storage device, and calculates voltage deviation between the plurality of batteries based on the voltage detected by each voltage detection unit at the time of driving the load which is driven by power supply from the electrical storage device, a comparator which compares the voltage deviation calculated by the voltage deviation calculation unit and a first predetermined threshold, and a cutoff detection unit which detects a presence or absence of the battery, which comes into a cutoff state in the electrical storage device, when the voltage deviation is equal to or more than the first threshold in a comparison result by the comparator.
    Type: Application
    Filed: November 12, 2012
    Publication date: October 9, 2014
    Applicant: Honda Motor Co., Ltd.
    Inventors: Hideaki Iwashita, Kenji Oogushi, Masaya Deguchi, Eisuke Komazawa, Masatoshi Nakajima, Naoto Doi
  • Patent number: 7671467
    Abstract: A power semiconductor module having an integral circuit board with a metal substrate electrode, an insulation substrate and a heat sink joined is disclosed. A SiC semiconductor power device is joined to a top of the metal substrate electrode of the circuit board. A difference in average coefficients of thermal expansion between constituent materials of the circuit board in a temperature range from room to joining time temperatures is 2.0 ppm/° C. or less, and a difference in expansion, produced by a difference between a lowest operating temperature and a joining temperature, of the circuit-board constituent materials is 2,000 ppm or less.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: March 2, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kenichi Nonaka, Takeshi Kato, Kenji Oogushi, Yoshihiko Higashidani, Yoshimitsu Saito, Kenji Okamoto
  • Publication number: 20070262387
    Abstract: A power semiconductor module having an integral circuit board with a metal substrate electrode, an insulation substrate and a heat sink joined is disclosed. A SiC semiconductor power device is joined to a top of the metal substrate electrode of the circuit board. A difference in average coefficients of thermal expansion between constituent materials of the circuit board in a temperature range from room to joining time temperatures is 2.0 ppm/° C. or less, and a difference in expansion, produced by a difference between a lowest operating temperature and a joining temperature, of the circuit-board constituent materials is 2,000 ppm or less.
    Type: Application
    Filed: May 10, 2007
    Publication date: November 15, 2007
    Inventors: Kenichi Nonaka, Takeshi Kato, Kenji Oogushi, Yoshihiko Higashidani, Yoshimitsu Saito, Kenji Okamoto