Patents by Inventor Kenji Sawazaki

Kenji Sawazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
    Patent number: 4943516
    Abstract: A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life.By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.
    Type: Grant
    Filed: November 22, 1988
    Date of Patent: July 24, 1990
    Assignee: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Yuichi Kamayachi, Kenji Sawazaki, Morio Suzuki, Shoji Inagaki