Patents by Inventor Kenji Suduo

Kenji Suduo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090304906
    Abstract: An evaporating apparatus 10 includes a vapor deposition source 210, a transport path 110e21, a blowing vessel 110 and a first processing chamber 100. The transport path 110e21 is connected with the vapor deposition source 210 via a connection path 220e and transports a film forming material vaporized from the vapor deposition source 210. A blowing port 110e11 is formed of a metal porous member and blows out the film forming material which has passed through a buffer space S via the transport path 110e21. The first processing chamber 100 performs the film formation on a target object G with the blown-out film forming material. A gap between the target object G and the blowing port 110e1 can be shortened by blowing out gas molecules having a high uniformity from the metal porous member.
    Type: Application
    Filed: October 1, 2007
    Publication date: December 10, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kenji Suduo, Hiroyuki Ikuta, Noriaki Fukiage