Patents by Inventor Kenji Suemura

Kenji Suemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photocuring resin compositions, photocuring sheets and molded article using the same, and processes of production thereof
    Patent number: 6646022
    Abstract: A photocuring resin composition comprising a thermoplastic resin (a-1) having a radical polymerizing unsaturated group at its side chain and a photopolymerization initiator (a-2) and substantially not including a crosslinking compound other than (a-1), a photocuring sheet comprising a photocuring resin composition (A) laminated on a substrate sheet (B) and a process of production of the same, a photocuring decorative sheet and photocuring insert molding sheet using the same, and a process of production of a molded article using such a photocuring sheet and an insert molded article obtained by the same.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: November 11, 2003
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Shougo Okazaki, Yoko Kakuno, Kenji Suemura, Hiroyuki Watanabe
  • Photocuring resin compositions, photocuring sheets and molded article using the same, and processes of production thereof
    Publication number: 20020032250
    Abstract: A photocuring resin composition comprising a thermoplastic resin (a-1) having a radical polymerizing unsaturated group at its side chain and a photopolymerization initiator (a-2) and substantially not including a crosslinking compound other than (a-1), a photocuring sheet comprising a photocuring resin composition (A) laminated on a substrate sheet (B) and a process of production of the same, a photocuring decorative sheet and photocuring insert molding sheet using the same, and a process of production of a molded article using such a photocuring sheet and an insert molded article obtained by the same.
    Type: Application
    Filed: July 3, 2001
    Publication date: March 14, 2002
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Shougo Okazaki, Yoko Kakuno, Kenji Suemura, Hiroyuki Watanabe