Patents by Inventor Kenji Suetaki

Kenji Suetaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same
    Patent number: 5594274
    Abstract: A distance between each two sides adjacent to a first portion X of the outer peripheral portion of an island portion 3 and the inner end of an inner lead portion 4 is set to d.sub.1 while the distance between each two sides adjacent to a second portion Y, which is diagonal to the first portion X, and the inner end of the inner lead portion 4 is set to d.sub.2 (<d.sub.1). The island portion 3 has a portion 2a for placing the semiconductor chip thereon and an overhang portion 3a attached to that portion. A semiconductor chip 2 is adhered on the island portion 3 of the lead frame 10, which is then attached in position within a mold. From a gate 21 a molten resin is injected into the cavity 23 in a diagonal direction of the square island portion, i.e. a direction from the first portion X toward the second portion Y.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: January 14, 1997
    Assignee: NEC Corporation
    Inventor: Kenji Suetaki