Abstract: A microorganism-concentrating apparatus according to one embodiment includes a mixing device, a filtering device, and a magnetic separation device. The mixing device is configured to mix an aqueous suspension of microorganisms with a particulate filter aid includes magnetic particles to prepare an aqueous slurry of the microorganisms and the particulate filter aid. The filtering device is configured to filter the aqueous slurry supplied from the mixing device to provide a filter cake includes the microorganisms and the particulate filter aid, and to provide a filtrate. The magnetic separation device is configured to magnetically separate the filter cake supplied from the filtering device into the microorganisms and the particulate filter aid.

Abstract: According to one embodiment, a copper recovery apparatus includes a precipitation tank configured to precipitate copper hydroxide grains in water, a filter aid supplyer, a mixing tank configured to mix the filter aid with a water to produce a suspension, a separator provided with a filter, a line configured to supply the suspension to the separator, thereby forming a precoat layer formed of the filter aid on the filter, a separation tank configured to receive the detached matter of the precoat layer discharged together with the detaching water from the separator to magnetically separate copper hydroxide grains and filter aid, a line configure to discharge and recover the detaching water from the separation tank, and a line configured to return the separated filter aid to the filter aid supplyer from the separation tank.

Abstract: A plug of a connector includes plug-side electrode terminals arranged therein, the plug having a first engagement part on one end side in a direction of arrangement of the plug-side electrode terminals and a second engagement part on the other end side. A jack of the connector includes jack-side electrode terminals arranged therein, the jack having a third engagement part on one end side in a direction of arrangement of the jack-side electrode terminals and a fourth engagement part on the other end side. A guide member has a fifth engagement part and a sixth engagement part, the fifth engagement part configured to engage with the first engagement part of the plug and the third engagement part of the jack, the sixth engagement part configured to engage with the second engagement part of the plug and the fourth engagement part of the jack.

Abstract: A storage control device includes an obtaining unit that obtains data; a recognition unit that recognizes an area among areas in a storage unit, as a recordable area, the area to be recognized being where the data obtained by the obtaining unit is stored and overwriting has been executed a predetermined number of times; a recording unit that records data obtained by the obtaining unit onto the recordable area recognized by the recognition unit; a first overwriting unit that executes the overwriting on an area where data has been recorded by the recording unit and the overwriting has not yet been executed the predetermined number of times; and a specifying unit that specifies a remaining count for each of the areas in the storage unit, the remaining count indicating a difference between the predetermined number of times and a number of times the overwriting has been executed.

Abstract: In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

Abstract: In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

Abstract: An instruction file execution device which includes a receiver, a comparison section and a job execution section. The receiver receives an instruction file and a usable money amount, which instruction file describes a job flow which defines linking of a number of jobs. The comparison section compares an execution charge of a job being handled of the jobs of the instruction file received by the receiver with the usable money amount received by the receiver. If the comparison section determines that the usable money amount is greater than or equal to the execution charge, the job execution section executes the job being handled.

Abstract: According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

Abstract: In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

Abstract: A coating film forming apparatus includes a process section including one or more coating units and one or more thermally processing units; a pre-coating cleaning unit configured to perform cleaning on a back surface and an edge portion of a substrate; and a pre-coating check unit configured to check a state of a back surface and an edge portion of the substrate. A control section is configured to realize a sequence of cleaning the substrate by the pre-coating cleaning unit, checking the substrate by the pre-coating check unit, making a judgment based on a check result thus obtained of whether or not a state of particles on a back surface and an edge portion of the substrate is within an acceptable range, and permitting transfer of the substrate into the process section where the state of particles is within the acceptable range.

Abstract: In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

Abstract: A wire accommodating apparatus includes a cylindrical portion around which a wire connected to a signal transmission part is wound; a number of wire holding portions which incline externally from the bottom of the cylindrical portion and are disposed pivotably; and a fixed portion formed in the cylindrical portion so as to project downward, passing through an attachment hole of a to-be-mounted member, and fixed therein.

Abstract: A wire accommodating apparatus includes a cylindrical portion around which a wire connected to a signal transmission part is wound; a number of wire holding portions which incline externally from the bottom of the cylindrical portion and are disposed pivotably; and a fixed portion formed in the cylindrical portion so as to project downward, passing through an attachment hole of a to-be-mounted member, and fixed therein.

Abstract: A storage control device includes an obtaining unit that obtains data; a recognition unit that recognizes an area among areas in a storage unit, as a recordable area, the area to be recognized being where the data obtained by the obtaining unit is stored and overwriting has been executed a predetermined number of times; a recording unit that records data obtained by the obtaining unit onto the recordable area recognized by the recognition unit; a first overwriting unit that executes the overwriting on an area where data has been recorded by the recording unit and the overwriting has not yet been executed the predetermined number of times; and a specifying unit that specifies a remaining count for each of the areas in the storage unit, the remaining count indicating a difference between the predetermined number of times and a number of times the overwriting has been executed.

Abstract: According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

Abstract: In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

Abstract: In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

Abstract: A coating film forming apparatus includes a process section including one or more coating units and one or more thermally processing units; a pre-coating cleaning unit configured to perform cleaning on a back surface and an edge portion of a substrate; and a pre-coating check unit configured to check a state of a back surface and an edge portion of the substrate. A control section is configured to realize a sequence of cleaning the substrate by the pre-coating cleaning unit, checking the substrate by the pre-coating check unit, making a judgment based on a check result thus obtained of whether or not a state of particles on a back surface and an edge portion of the substrate is within an acceptable range, and permitting transfer of the substrate into the process section where the state of particles is within the acceptable range.

Abstract: A microcomputer comprises a CPU; a nonvolatile memory; a plurality of volatile memories; a system bus; a program transfer bus; a program transfer section; an address conversion section; and a voltage detection section. The volatile memories include a plurality of memories switchable to be used as transfer and execution memories in accordance with a program execution state by the CPU. Where the voltage detected by the voltage detection section is lower than a first voltage, the program transfer section transfers the part of the program stored in the nonvolatile memory to the transfer memory, and the address conversion section converts an address in the nonvolatile memory output from the CPU into an address in the execution memory.

Abstract: An SFP module mounting structure whereby the region of a printed wiring board for mounting SFP modules is enlarged and thus the SFP modules can be mounted with high density. A swing mechanism constituted by the coupling between a holder and a base allows the holder to be swung in directions toward and away from the printed wiring board. Thus, when mounting an SFP module, the SFP module can be inserted into the holder with the holder kept in an obliquely raised state relative to the printed wiring board. Also, when detaching the SFP module, the SFP module can be pulled out of the holder with the holder obliquely raised from the printed wiring board.