Patents by Inventor Kenji Yanagisawa
Kenji Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9014520Abstract: A photoelectric mixed substrate includes a wiring substrate including a first ground wire, a signal wire arranged above the first ground wire and electrically connected to the photoelectric component and the electronic component, and a waveguide unit stacked on the wiring substrate to cover the signal wire. The waveguide unit includes a first clad layer formed on the wiring substrate, a second ground wire formed above the first clad layer, a core formed on the first clad layer and optically coupled to the photoelectric component, and a second clad layer formed on the first clad layer to cover the core.Type: GrantFiled: June 5, 2014Date of Patent: April 21, 2015Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa
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Patent number: 8923669Abstract: An optical wave guide includes an optical waveguide layer in which a core layer is surrounded by a cladding layer, a light path converting portion provided to a light entering side and a light emitting side of the optical waveguide layer respectively, a light entering portion demarcated in an outer surface of the cladding layer, in which a light is entered to the light path converting portion of the light entering side; and a light emitting portion demarcated in an outer surface of the cladding layer, in which a light from the light path converting portion of the light emitting side is emitted, wherein an outer surface of the cladding layer except the light entering portion and the light emitting portion is formed as a roughened surface.Type: GrantFiled: May 14, 2012Date of Patent: December 30, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hideki Yonekura, Kenji Yanagisawa, Kazunao Yamamoto, Mieko Yamamoto
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Publication number: 20140369642Abstract: A photoelectric mixed substrate includes a wiring substrate including a first ground wire, a signal wire arranged above the first ground wire and electrically connected to the photoelectric component and the electronic component, and a waveguide unit stacked on the wiring substrate to cover the signal wire. The waveguide unit includes a first clad layer formed on the wiring substrate, a second ground wire formed above the first clad layer, a core formed on the first clad layer and optically coupled to the photoelectric component, and a second clad layer formed on the first clad layer to cover the core.Type: ApplicationFiled: June 5, 2014Publication date: December 18, 2014Applicant: Shinko Electric Industries Co., LTD.Inventor: Kenji Yanagisawa
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Patent number: 8903203Abstract: An optical waveguide device includes a wiring substrate, an optical waveguide bonded on the wiring substrate and having a light path conversion inclined surface on both ends, and a light path conversion mirror formed to contact the light path conversion inclined surface of the optical waveguide and formed of a light reflective resin layer or a metal paste layer. In case the light reflective resin layer is used as the light path conversion mirror, the light reflective resin layer may be formed partially only on the side of the light path conversion inclined surface, or may be formed on the whole of the wiring substrate to coat the optical waveguide.Type: GrantFiled: November 15, 2010Date of Patent: December 2, 2014Assignee: Shinko Electric Industries Co.Inventors: Takanori Yamamoto, Kenji Yanagisawa, Kazunao Yamamoto, Hideki Yonekura
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Publication number: 20140177999Abstract: There is provided an optical waveguide device. The device includes: a wiring substrate having a first opening portion therein and including: a substrate having an upper surface and a lower surface opposite to the upper surface; an upper side wiring layer formed on the upper surface of the substrate, and a lower side wiring layer formed on the lower surface of the substrate, an optical waveguide formed on the lower side wiring layer; a first optical element connected to the upper side wiring layer; a first circuit element electrically connected to the first optical element through the upper side wiring layer; a second optical element connected to the lower side wiring layer through the first opening portion; and a second circuit element electrically connected to the second optical element through the lower side wiring layer.Type: ApplicationFiled: December 13, 2013Publication date: June 26, 2014Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Kenji Yanagisawa
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Publication number: 20140169731Abstract: An optical waveguide device includes, a substrate, an optical waveguide arranged on the substrate, an optical element arranged on the substrate and optically coupled to one end part of the optical waveguide, a flame retardant adhesive layer covering the optical waveguide, and a connector portion adhered to other end part of the optical waveguide by the flame retardant adhesive layer.Type: ApplicationFiled: November 19, 2013Publication date: June 19, 2014Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Kenji YANAGISAWA
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Patent number: 8737794Abstract: A two-layer optical waveguide includes a core layer having a first surface and a second surface opposite to the first surface, and a cladding layer laminated on the first surface of the core layer. The two-layer optical waveguide further includes a mirror structure provided at a plurality of positions on the first surface of the core layer, the mirror structure directing a light signal which travels in the core layer, toward the second surface of the core layer. Each mirror structure includes an inclined plane formed on the first surface of the core layer, and a metal film formed on the inclined plane.Type: GrantFiled: December 14, 2011Date of Patent: May 27, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazunao Yamamoto, Hideki Yonekura, Kenji Yanagisawa, Takanori Yamamoto
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Patent number: 8737781Abstract: A method of manufacturing an optical waveguide, includes preparing a light path conversion component including a structure in which a protruding portion having a light path conversion inclined surface is covered with a metal layer and the metal layer serves as a light path conversion mirror, and a structural body in which a core layer is formed on a first cladding layer and an opening portion is provided in an end side of a light path of the core layer, arranging the light path conversion mirror of the light path conversion component in the opening portion of the core layer, and forming a second cladding layer covering the core layer, wherein a light path of a light that propagates through the core layer is converted toward a first cladding layer side by the light path conversion mirror.Type: GrantFiled: December 1, 2011Date of Patent: May 27, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazunao Yamamoto, Hideki Yonekura, Kenji Yanagisawa, Takanori Yamamoto
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Patent number: 8644656Abstract: A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.Type: GrantFiled: September 13, 2012Date of Patent: February 4, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa
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Patent number: 8634683Abstract: A method of manufacturing an optical waveguide device, includes obtaining an optical waveguide by forming sequentially a first cladding layer, a core layer, and a second cladding layer on a substrate, forming a groove portion including a light path conversion inclined surface and a sidewall surface which intersects with it, and the groove portion dividing the second cladding layer and the core layer, on both end sides of the optical waveguide respectively, forming selectively a metal layer on the light path conversion inclined surface and the sidewall surface of the groove portion, forming a protection insulating layer sealing the metal layer on the optical waveguide, and obtaining a light path conversion mirror that the metal layer is formed on the light path conversion inclined surface, by forming a concave portion which penetrates the core layer from the protection insulating layer to remove the metal layer formed on the sidewall surface of the groove portion.Type: GrantFiled: April 27, 2011Date of Patent: January 21, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa
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Patent number: 8611715Abstract: A method of manufacturing an optical waveguide, includes forming a first cladding layer on a substrate, forming a core layer on the first cladding layer, forming a groove portion including a light path conversion inclined surface by processing the core layer in a thickness direction, and forming a second cladding layer in which a light path conversion hole is arranged on the light path conversion inclined surface on the first cladding layer and the core layer.Type: GrantFiled: November 22, 2011Date of Patent: December 17, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Takanori Yamamoto, Hideki Yonekura, Kenji Yanagisawa, Kazunao Yamamoto
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Publication number: 20130330049Abstract: An optical module is provided with a case, which includes an accommodation portion, optical elements, optical waveguide cores, a clad layer, and an optical path changing unit. The optical elements are accommodated in and fixed to the accommodation portion. The optical elements have optical axis centers. The optical waveguide cores are respectively formed at positions corresponding to the planar positions of the optical axis centers. The clad layer surrounds the optical waveguide cores. The clad layer and the optical waveguide cores form an optical waveguide. The optical waveguide is stacked on a wiring substrate including a wiring pattern to which electrode terminals of the optical elements are connected, and the case is mounted on the wiring substrate. The optical path changing unit is formed at a position corresponding to the planar positions of the optical axis centers and faces the optical waveguide at a predetermined angle.Type: ApplicationFiled: June 7, 2013Publication date: December 12, 2013Inventor: Kenji Yanagisawa
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Patent number: 8506175Abstract: An optical waveguide board includes: an optical waveguide configured to transmit an optical signal to and from a light receiving element and a light emitting element; wiring patterns that are electrically connected with the light receiving and emitting elements, respectively; and supporting members disposed on the wiring patterns on sides of end parts of the optical waveguide, the supporting members supporting the light receiving and emitting elements, respectively; wherein each of the supporting members includes: a conduction portion that electrically connects a corresponding one of the light receiving and emitting elements and the wiring pattern; and a smooth surface configured to reflect the optical signal appearing between the corresponding one of the light receiving and emitting elements and the optical waveguide.Type: GrantFiled: December 16, 2010Date of Patent: August 13, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa
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Optical waveguide, optical waveguide mounting substrate, and light transmitting and receiving device
Patent number: 8369675Abstract: An optical waveguide is provided. The optical waveguide includes: a layered structure including: a first cladding layer; a second cladding layer; and a core layer that is sandwiched between the first cladding layer and the second cladding layer, wherein an inclined surface is formed on at least one longitudinal end of the layered structure; and an outer cladding layer that seals at least a portion of the inclined surface corresponding to the core layer, wherein a refractive index of the outer cladding layer is smaller than that of the core layer.Type: GrantFiled: December 7, 2009Date of Patent: February 5, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa -
Publication number: 20130025086Abstract: A cyclonic separator and a vacuum cleaner which efficiently separates dust, collect the dust without re-scattering it and make low noise are provided. In a primary cyclone portion 10, a primary swirl chamber 12 swirls air containing dust sucked from a primary inlet 11, and thereby, separates a first dust and a second dust from the air containing dust to collect them respectively in a zero-order dust case 114 which is provided at a side of the primary swirl chamber 12 and communicates with a zero-order opening portion 113 provided at a side wall, and a primary dust case 14 provided at a lower side of the primary swirl chamber 12.Type: ApplicationFiled: February 3, 2011Publication date: January 31, 2013Applicant: Mitsubishi Electric CorporationInventors: Sota Komae, Tsuyoshi Maeda, Junichiro Hoshizaki, Tomoo Kobayashi, Akihiro Iwahara, Masayoshi Izuka, Tadashi Fukushima, Kenji Yanagisawa, Daisuke Kondo
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Publication number: 20130011096Abstract: A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.Type: ApplicationFiled: September 13, 2012Publication date: January 10, 2013Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Kenji YANAGISAWA
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Patent number: 8349119Abstract: A base plate (31) and an ultraviolet curing type waveguide material (32) are interposed between a pair of films (41, 42), a portion between the pair of films is decompressed or an external pressure is applied to the films, thereby laminating the ultraviolet curing type waveguide material on the base plate, and at the same time, ultraviolet rays are irradiated on the ultraviolet curing type waveguide material through the films to cure the waveguide material.Type: GrantFiled: September 4, 2008Date of Patent: January 8, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa
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Publication number: 20120318964Abstract: An optical wave guide includes an optical waveguide layer in which a core layer is surrounded by a cladding layer, a light path converting portion provided to a light entering side and a light emitting side of the optical waveguide layer respectively, a light entering portion demarcated in an outer surface of the cladding layer, in which a light is entered to the light path converting portion of the light entering side; and a light emitting portion demarcated in an outer surface of the cladding laver, in which a light from the light path converting portion of the light emitting side is emitted, wherein an outer surface of the cladding layer except the light entering portion and the light emitting portion is formed as a roughened. surface.Type: ApplicationFiled: May 14, 2012Publication date: December 20, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takanori YAMAMOTO, Mieko Yamamoto, Hideki Yonekura, Kenji Yanagisawa, Kazunao Yamamoto
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Patent number: 8323878Abstract: A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.Type: GrantFiled: June 14, 2010Date of Patent: December 4, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventor: Kenji Yanagisawa
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Publication number: 20120155822Abstract: A method of manufacturing an optical waveguide, includes forming a first light path core layer having a first light path length on a first cladding layer, forming a groove portion having an inclined surface in an end side of the first light path core layer, forming a second light path core layer having a second light path length which is longer than the first light path length, in a lateral area of the first light path core layer, forming a groove portion having an inclined surface, arranged to an outer side than the groove portion of the first light path core layer, in an end side of the second light path core layer, forming partially a metal layer on the respective inclined surfaces of the first and second light path core layer, and forming a second cladding layer covering the first and second light path core layer.Type: ApplicationFiled: December 12, 2011Publication date: June 21, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kenji YANAGISAWA, Hideki YONEKURA, Takanori YAMAMOTO, Kazunao YAMAMOTO