Patents by Inventor Kenjiro Hata
Kenjiro Hata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9450171Abstract: A thin film piezoelectric element of the present invention includes a substrate and a piezoelectric thin film stack formed on the substrate. The piezoelectric thin film stack includes a top electrode layer, a bottom electrode layer and a piezoelectric layer sandwiched between the top electrode layer and the bottom electrode layer, wherein the piezoelectric layer includes a first piezoelectric layer and a second piezoelectric layer whose compositions have different phase structures. The present invention can obtain high piezoelectric constants, enhanced coercive field strength and good thermal stability, thereby enabling larger applied field strength without depolarization and achieving a large stroke for its applied device.Type: GrantFiled: March 29, 2013Date of Patent: September 20, 2016Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Wei Xiong, Panjalak Rokrakthong, Kenjiro Hata, Kazushi Nishiyama, Daisuke Iitsuka, Atsushi Iijima
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Publication number: 20130279042Abstract: A thin film piezoelectric element of the present invention includes a substrate and a piezoelectric thin film stack formed on the substrate. The piezoelectric thin film stack includes a top electrode layer, a bottom electrode layer and a piezoelectric layer sandwiched between the top electrode layer and the bottom electrode layer, wherein the piezoelectric layer includes a first piezoelectric layer and a second piezoelectric layer whose compositions have different phase structures. The present invention can obtain high piezoelectric constants, enhanced coercive field strength and good thermal stability, thereby enabling larger applied field strength without depolarization and achieving a large stroke for its applied device.Type: ApplicationFiled: March 29, 2013Publication date: October 24, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Wei XIONG, Panjalak ROKRAKTHONG, Kenjiro HATA, Kazushi NISHIYAMA, Daisuke IITSUKA, Atsushi IIJIMA
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Publication number: 20130279044Abstract: A thin film piezoelectric element of the present invention includes a substrate and a piezoelectric thin film stack formed on the substrate. The piezoelectric thin film stack includes a top electrode layer, a bottom electrode layer and a piezoelectric layer sandwiched between the top electrode layer and the bottom electrode layer, wherein the piezoelectric layer includes a first piezoelectric layer and a second piezoelectric layer whose compositions have different phase structures. The present invention can obtain high piezoelectric constants, enhanced coercive field strength, thereby enabling larger applied field strength without depolarization and achieving a large stroke for its applied device.Type: ApplicationFiled: April 19, 2012Publication date: October 24, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Wei XIONG, Panjalak Rokrakthong, Kenjiro Hata, Kazushi Nishiyama, Daisuke Iitsuka, Atsushi Iijima
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Patent number: 8330330Abstract: A piezoelectric actuator includes a supporting substrate, a main body having a first piezoelectric laminate, a second piezoelectric laminate, and a displacement portion, and a first elastic layer. The first elastic layer is fixed to the main body so as to connect a lower surface of the first piezoelectric laminate, a lower surface of the second piezoelectric laminate, a side surface of the first piezoelectric laminate, and a side surface of the second piezoelectric laminate. A first region to fourth region of the first elastic layer is fixed to the principal surface of the supporting substrate by a first to fourth bonding portions. A non-bonding surface is not fixed to the principal surface of the supporting substrate.Type: GrantFiled: June 1, 2010Date of Patent: December 11, 2012Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.Inventor: Kenjiro Hata
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Patent number: 8307538Abstract: A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step.Type: GrantFiled: March 1, 2010Date of Patent: November 13, 2012Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.Inventor: Kenjiro Hata
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Patent number: 8189296Abstract: A method includes a step of stacking a first electrode layer, a piezoelectric layer, and a second electrode layer on a first substrate to form a first laminate; a step of stacking a support layer on a second substrate to form a second laminate; a step of bonding the first and second laminates through an adhesive layer to form a third laminate; a step of removing the first substrate from the third laminate; a step of processing the third laminate in a desired shape; and a step of removing the second substrate. A Young's modulus of the adhesive layer is smaller than a Young's modulus of the piezoelectric layer. Respective Young's moduli of the second electrode layer and the support layer are larger than the Young's modulus of the adhesive layer. The third laminate has no other piezoelectric layer except for the aforementioned piezoelectric layer.Type: GrantFiled: October 15, 2009Date of Patent: May 29, 2012Assignees: TDK Corporation, SAE Magnetics (HK), Ltd.Inventors: Kenjiro Hata, Hirofumi Sasaki, Katsuyuki Kurachi
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Publication number: 20100301705Abstract: A piezoelectric actuator includes a supporting substrate, a main body having a first piezoelectric laminate, a second piezoelectric laminate, and a displacement portion, and a first elastic layer. The first elastic layer is fixed to the main body so as to connect a lower surface of the first piezoelectric laminate, a lower surface of the second piezoelectric laminate, a side surface of the first piezoelectric laminate, and a side surface of the second piezoelectric laminate. A first region to fourth region of the first elastic layer is fixed to the principal surface of the supporting substrate by a first to fourth bonding portions. A non-bonding surface is not fixed to the principal surface of the supporting substrate.Type: ApplicationFiled: June 1, 2010Publication date: December 2, 2010Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.Inventor: Kenjiro HATA
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Publication number: 20100232069Abstract: A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step.Type: ApplicationFiled: March 1, 2010Publication date: September 16, 2010Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.Inventor: Kenjiro HATA
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Publication number: 20100097723Abstract: A method includes a step of stacking a first electrode layer, a piezoelectric layer, and a second electrode layer on a first substrate to form a first laminate; a step of stacking a support layer on a second substrate to form a second laminate; a step of bonding the first and second laminates through an adhesive layer to form a third laminate; a step of removing the first substrate from the third laminate; a step of processing the third laminate in a desired shape; and a step of removing the second substrate. A Young's modulus of the adhesive layer is smaller than a Young's modulus of the piezoelectric layer. Respective Young's moduli of the second electrode layer and the support layer are larger than the Young's modulus of the adhesive layer. The third laminate has no other piezoelectric layer except for the aforementioned piezoelectric layer.Type: ApplicationFiled: October 15, 2009Publication date: April 22, 2010Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.Inventors: Kenjiro HATA, Hirofumi SASAKI, Katsuyuki KURACHI
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Patent number: 7403716Abstract: The optical module includes a main housing, a filter support component, which can affix an optical fiber, supported by a first attachment section, a light-emitting component supported by a second attachment section, a light-receiving component supported by a third attachment section, and first and second optical filters supported by a filter support component. The filter support component has a first surface and a second surface. The first optical filter is mounted on the first surface of the filter support component. The second optical filter is mounted on the second surface of the filter support component.Type: GrantFiled: July 7, 2004Date of Patent: July 22, 2008Assignee: TDK CorporationInventors: Adrian Lo, Makoto Sekijima, Kenjiro Hata, Tohru Kineri, Naoki Hanashima
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Patent number: 7394955Abstract: The invention relates to an optical component including an optical fiber with a lens constituted by a single-mode optical fiber and a graded index optical fiber and a method of manufacturing the same. The invention provides an optical component in which an optical fiber with a lens can be accurately mounted on a substrate and which has high performance and highly stable manufacturability. An optical component has three V-shaped grooves for disposing optical fibers. An optical fiber with a lens is disposed in each of the V-shaped grooves. The optical component has a positioning mark using for positioning optical fiber connecting surfaces. The positioning mark extending across the V-shaped grooves in an orthogonal relationship therewith is provided. The positioning mark is formed line a concave groove and is visually perceived as two parallel straight lines when viewed in a direction normal to the surface on which the V-shaped grooves are formed.Type: GrantFiled: September 22, 2005Date of Patent: July 1, 2008Assignee: TDK CorporationInventor: Kenjiro Hata
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Patent number: 7315673Abstract: An optical multiplexer/demultiplexer is provided, which is easy to assemble and which can be manufactured with high productivity and a low cost. An optical multiplexer/demultiplxer includes a substrate formed with V-shaped grooves, optical fibers with a lens provided in tight contact with the V-shaped grooves, optical fiber securing plates, a base groove formed across the V-shaped grooves and an optical filter provided in the groove. First and second optical fibers with a lens are provided on either side of the base groove, and a third optical fiber is provided on the other side of the base groove. The optical fibers are provided such that the positions of their ends coincide with edges of the base groove. The third optical fiber with a lens is provided coaxially with the first optical fiber with a lens that is located on the other side of the base groove.Type: GrantFiled: October 26, 2004Date of Patent: January 1, 2008Assignee: TDK CorporationInventor: Kenjiro Hata
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Publication number: 20060239621Abstract: The present invention relates to an optical module which can be produced by an easy process and at low cost and a method for fabricating the optical module. An optical module 100 includes a die pad 101, a plurality of leads 102, and a first platform 110 and a second platform 120 disposed on the die pad 101. At least an optical fiber 113 is fixed to a first platform body 111 and at least a light emitter 124 adapted for generating optical signals to be transmitted through the optical fiber 113 is mounted on a second platform body 121.Type: ApplicationFiled: November 4, 2003Publication date: October 26, 2006Inventors: Adrian Lo, Kenjiro Hata, Tohru Kineri, Naoki Hanashima
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Patent number: 7125174Abstract: The optical module includes a main housing, a light-emitting component supported by a second attachment section, a light-receiving component and a filter support member supported by a third attachment section, and first and second optical filters supported by the filter support member. The filter support member has a first surface and a second surface. The first optical filter is mounted on the first surface of the filter support member. The second optical filter is mounted on the second surface of the filter support member.Type: GrantFiled: July 7, 2004Date of Patent: October 24, 2006Assignee: TDK CorporationInventors: Adrian Lo, Makoto Sekijima, Kenjiro Hata, Tohru Kineri, Naoki Hanashima
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Patent number: 7068864Abstract: The present invention is to provide an arrayed waveguide-embedded optical circuit with reduced loss at a groove and an optical functional element using for the arrayed waveguide-embedded optical circuit. The arrayed waveguide-embedded optical circuit according to the present invention comprises a waveguide, a groove formed across the waveguide and two or more spot-size transformer pairs whose members face each other across the groove.Type: GrantFiled: November 5, 2003Date of Patent: June 27, 2006Assignee: TDK CorporationInventors: Naoki Hanashima, Tohru Kineri, Kenjiro Hata
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Patent number: 7048451Abstract: The optical module includes a main housing to which the optical fiber can be attached and a light-emitting component and a light-receiving component attached to the main housing. At least a part of a surface of the main housing has an irregular pattern to enhance a thermal dissipation. Because at least part of the main housing comprises a heat sink, so the optical module itself has a very high heat dissipation property, eliminating the type of problems that arise when adhesive or the like is used to attach to the main housing heat sinks constituted as separate parts, such as the increase in the number of parts and the degradation in thermal conductivity to the heat sink caused by the adhesive.Type: GrantFiled: July 7, 2004Date of Patent: May 23, 2006Assignee: TDK CorporationInventors: Adrian Lo, Makoto Sekijma, Kenjiro Hata, Tohru Kineri, Naoki Hanashima
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Patent number: 7039280Abstract: Optical isolator comprises a ferrule having a through-hole in which an optical fiber is inserted and a groove formed in the ferrule with the optical fiber inserted in the through-hole; and a composite assembly consisting of an optical isolator element composed of a Faraday rotator and a pair of polarizers fixed on opposite surfaces of the Faraday rotator in such manner that the angle between the directions of polarization of the polarizers is at about 45° and a structure reinforcing member having a thickness of filling the groove and surrounding the optical element, said composite assembly being inserted in the groove as a unit. The reinforcing member may be made of the same material as the outer support or formed by a magnet for applying a magnetic field to the Faraday rotator.Type: GrantFiled: September 12, 2002Date of Patent: May 2, 2006Assignee: TDK CorporationInventors: Kenjiro Hata, Yoshinori Sato
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Publication number: 20060067629Abstract: The invention relates to an optical component including an optical fiber with a lens constituted by a single-mode optical fiber and a graded index optical fiber and a method of manufacturing the same. The invention provides an optical component in which an optical fiber with a lens can be accurately mounted on a substrate and which has high performance and highly stable manufacturability. An optical component has three V-shaped grooves for disposing optical fibers. An optical fiber with a lens is disposed in each of the V-shaped grooves. The optical component has a positioning mark using for positioning optical fiber connecting surfaces. The positioning mark extending across the V-shaped grooves in an orthogonal relationship therewith is provided. The positioning mark is formed line a concave groove and is visually perceived as two parallel straight lines when viewed in a direction normal to the surface on which the V-shaped grooves are formed.Type: ApplicationFiled: September 22, 2005Publication date: March 30, 2006Applicant: TDK CorporationInventor: Kenjiro Hata
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Patent number: 7003182Abstract: An optical isolator having an optical element, comprised of an incoming side polarizer, a Faraday rotator, and an outgoing side polarizer superposed in the order of mention in the direction of an optical path, is embedded in the optical path of an optical fiber or optical waveguide having a light axis. The isolator has a slot extending across the light axis in a direction slanted with respect to the light axis. The optical element is inserted in the slot and the spaces between the optical element and the incoming and outgoing sides of the slot are filled with an optical adhesive portion. At least one of the interfaces is inclined at an angle reversely from the plane normal to the light axis as viewed from the slanted incoming side of the slot.Type: GrantFiled: June 30, 2003Date of Patent: February 21, 2006Assignee: TDK CorporationInventors: Kenjiro Hata, Yoshinori Sato
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Publication number: 20050185899Abstract: The optical module includes a main housing to which the optical fiber can be attached and a light-emitting component and a light-receiving component attached to the main housing. At least a part of a surface of the main housing has an irregular pattern to enhance a thermal dissipation. Because at least part of the main housing comprises a heat sink, so the optical module itself has a very high heat dissipation property, eliminating the type of problems that arise when adhesive or the like is used to attach to the main housing heat sinks constituted as separate parts, such as the increase in the number of parts and the degradation in thermal conductivity to the heat sink caused by the adhesive.Type: ApplicationFiled: July 7, 2004Publication date: August 25, 2005Inventors: Adrian Lo, Makoto Sekijima, Kenjiro Hata, Tohru Kineri, Naoki Hanashima