Abstract: An anisotropic conductive film (14) and circuit elements (16) are superimposed and disposed on a substrate (10). An isotropic pressing operation is performed by a pressing mold having a flexible layer (22) on the surface to be brought into contact with the circuit elements, and simultaneously heating is performed to bond the circuit elements onto the substrate. Since the flexible layer absorbs differences in thickness of the circuit elements, the plurality of circuit elements can be pressed simultaneously. Further, since the plurality of circuit elements are simultaneously heated, it is unnecessary to consider an influence of heat on unheated adjacent circuit elements in a case where the elements are heated one by one. The isotropic pressing makes it possible to prevent the anisotropic conductive film from protruding sideways. As a result, spaces between the circuit elements can be reduced.