Abstract: An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.

Abstract: Photon-conducting receiving and transmitting media (e.g., optical fibers) are aligned by coupling the receiving medium with a thermokinetic structure, which can include a shape memory alloy. A photon beam is directed from the transmitting medium onto the thermokinetic structure, thereby locally heating the thermokinetic structure. The heated portion of the thermokinetic structure contracts to displace other portions of the structure and the receiving medium, which is coupled therewith, toward the photon beam so as to align the media.

Abstract: A process for masking an electronic component substrate involving application of a temporary mask material to the substrate to form a removably adhered temporary mask over the surface. Exemplary mask materials include polymer films and aqueous hardenable liquid coatings. An electronic component substrate having a temporary mask for masking the substrate surface from interconnect fill material.

Abstract: An assembly of the present invention has a substrate and a first MEMS device adapted to be electrically and mechanically connected to the substrate. A first set of MEMS/substrate fluid transfer ports on the first MEMS device and on the substrate are adapted to mate with one another when the first MEMS device and substrate are connected to permit the transfer of fluid between the first MEMS device and the substrate.

Abstract: A package for protecting an integrated circuit device having an active side. The package includes a substrate for mounting the integrated circuit device and a plastic cap mounted on the substrate to form an enclosed space for the active side of the integrated circuit device. A thermal bond is formed between the substrate and the plastic cap to effectively seal the enclosed space so as to prevent the ingress of moisture or particulate.

Abstract: Photon-conducting receiving and transmitting media (e.g., optical fibers) are aligned by coupling the receiving medium with a thermokinetic structure, which can include a shape memory alloy. A photon beam is directed from the transmitting medium onto the thermokinetic structure, thereby locally heating the thermokinetic structure. The heated portion of the thermokinetic structure contracts to displace other portions of the structure and the receiving medium, which is coupled therewith, toward the photon beam so as to align the media.

Abstract: An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.

Abstract: A process for masking an electronic component substrate involving application of a temporary mask material to the substrate to form a removably adhered temporary mask over the surface. Exemplary mask materials include polymer films and aqueous hardenable liquid coatings. An electronic component substrate having a temporary mask for masking the substrate surface from interconnect fill material.

Abstract: A semiconductor chip package assembly is mounted to contact pads on a die. A compliant interposer layer is disposed between the die and a dielectric substrate wiring layer. The contacts on the die are connected to terminals on the compliant interposer layer by means of a compliant, conductive polymer extending through apertures in the interposer layer. Compliancy in the interposer layer and in the conductive polymer permits relative movement of the terminals on the dielectric substrate wiring layer to the contacts on the die and hence relieves the shear forces caused by differential thermal expansion. The arrangement provides a compact packaged structure similar to that achieved through flip-ship bonding, but with markedly increased resistance to thermal cycling damage.

Abstract: A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

Abstract: A semiconductor chip package assembly is mounted to contact pads on a die. A compliant interposer layer is disposed between the die and a dielectric substrate wiring layer. The contacts on the die are connected to terminals on the compliant interposer layer by means of a compliant, conductive polymer extending through apertures in the interposer layer. Compliancy in the interposer layer and in the conductive polymer permits relative movement of the terminals on the dielectric substrate wiring layer to the contacts on the die and hence relieves the shear forces caused by differential thermal expansion. The arrangement provides a compact packaged structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage.

Abstract: A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

Abstract: A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Abstract: Ordered Z-axis electroconductive sheet materials are produced by entrapping bodies of fusible, polymeric, electroconductive adhesive at predetermined spaced locations in a sheet-like carrier of fusible, polymeric, dielectric adhesive including a thermoplastic component. The materials are useful for mechanically joining and electrically connecting electronic circuit components.

Abstract: Electroconductive resin adhesive particles are incorporated in a dielectric-resin-adhesive-containing carrier to form a Z-axis adhesive. Particles are preferably produced by printing techniques or by in-fluid forming techniques, the latter being particularly suited for the formation of substantially spherical particle shapes. The particles also have use as discrete adhesive members.

Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Abstract: A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is hardened into a resilient layer after its introduction into the gap. In another preferred embodiment, the terminals on a chip carrier are planarized or otherwise vertically positioned by deforming the terminals into set vertical locations with a plate, and then hardening a liquid between the chip carrier and chip.

Abstract: An apparatus and method for preparing conductive bridges to electrically couple discrete electrical conductors arranged on opposed surfaces of a common substrate. The method and apparatus utilized includes subjecting the bore or opening in the substrate to the force of vacuum applied through a vacuum diffusion barrier. The substrate is exposed to the vacuum source through a plurality of spaced-apart bores of relatively small diameter, with the vacuum diffusion layer being in the form of a web of filter paper tracking and moving in synchronism with the substrate. Conventional silk screening techniques are utilized to form the conductors and bridges, with polymer thick conductive fluids being employed as the printing medium. Multiple layers of conductors may be formed, with dual-sided circuitry being applied to the substrate.

Abstract: An electrically conductive adherent film-forming adhesive which is rapidly curable thermally from a flowable liquid to an adherent and coherent solid at temperatures below about 120.degree. C. and with a specific resistivity of less than about 0.001 ohm-cm. when cured, and comprising a uniform mixture with a formulation containing a liquid epoxy base resin, a hardening component for the epoxy resin consisting essentially of B.multidot.CF.sub.3 SO.sub.3 H, and silver metallic powder in an amount ranging from about 75% to 85%, with the powder having a substantial uniform particle size of less than about 20 microns (0.8 mil) in diameter.