Patents by Inventor Kenneth Brian Wood

Kenneth Brian Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7731878
    Abstract: A process of forming a microperforated plastic film includes providing a post tool having multiple posts, bringing plastic into contact with the post tool such that the plastic conforms to the shape of the posts, and solidifying the plastic into a solidified plastic film having a plurality of microperforations in the shape of the posts. Another step in the process is displacing any skins formed over the holes after solidifying the plastic. The process may be used to form a film for sound absorption where the posts are shaped and arranged to provide microperforations that provide a particular sound absorption spectrum. In one embodiment, the microperforations each have a narrowest diameter of 20 mils, a narrowest diameter less than a film thickness, and a widest diameter greater than narrowest diameter. The widest diameter may be about 125% or more of the narrowest diameter in an embodiment.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: June 8, 2010
    Assignee: 3M Innovative Properties Company
    Inventor: Kenneth Brian Wood
  • Patent number: 6977109
    Abstract: Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: December 20, 2005
    Assignee: 3M Innovative Properties Company
    Inventor: Kenneth Brian Wood
  • Patent number: 6617002
    Abstract: Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: September 9, 2003
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Kenneth Brian Wood
  • Publication number: 20010050197
    Abstract: Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.
    Type: Application
    Filed: July 24, 1998
    Publication date: December 13, 2001
    Inventor: KENNETH BRIAN WOOD