Abstract: Apparatus is provided for effecting removal of a semiconductive chip having an exteriorly-accessible surface and chip contacts depending therefrom from a chip carrier having an exteriorly-accessible surface and chip carrier contacts therein in retentive engagement with the chip contacts and with the chip carrier contacts being secured in a printed circuit board. The apparatus comprises a tool having mutually displaceable removal members adapted in a first tool state to bear respectively against an exteriorly-accessible surface of the chip and against an exteriorly-accessible surface of the chip carrier, neither of such removal members engaging the printed circuit board in such first state. The tool is operable from the first state to mutually displace the removal members for effecting removal of the chip from the carrier without either of the removal members engaging the printed circuit board.