Abstract: An improved socket assembly is disclosed which is especially suited for use with printed circuitry. The socket is mounted on an associated printed circuit board and is adapted to receive and retain guide pins of electronic circuit modules or the like. The socket assembly further includes a non-metallic insert, such as Teflon or equivalent material, which is introduced into the socket before soldering. The insert is unaffected by the molten solder or flux and prevents entry of contaminating material into the interior of the socket during the soldering process. The insert is removable by the insertion of a module guide pin during assembly of the component mounting board.

Abstract: An improved, weather-sealed switch actuator arrangement especially suited for use in electrical or electronic apparatus that may be exposed to hostile ambient conditions. The switch actuator is fabricated of plastic, non-metallic materials wherein a base actuator member is overfitted with a pliant, weather-resistant material, which actuator may be snap-fitted into a recess in the housing of the associated apparatus. A plurality of hook-like tab members on the base actuator cooperate with a plurality of associated apertures in the bottom surface of the housing recess for captivation purposes. A peripheral ridge in the bottom surface of the recess makes a press fit into the material of the overfitted cover to provide a tight, weather-proof seal against water, sand and other dirt particulate. A center portion of the base actuator member is suspended in cantilever fashion with an operating tab or actuator extending laterally inwardly from the free end thereof.