Abstract: A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The impinging fluid stream is rapidly oscillated to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

Abstract: Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.195.degree. F.

Abstract: Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.-195.degree. F.

Abstract: A printed circuit board has a coating comprising a selected deformable material which is solder-compatible, and has a melting point below that of solder. Electrical and electronic components are then loaded in position on the board with their leads extending through holes in the board, and imbedded into or through the coating. The coating acts as a jig to steady or stabilize the components in position in the board so that the component leads may then be trimmed to finish length, and the components are then soldered in place. Alternatively the board may be placed in storage for future soldering operation. The coating is melted and displaced simultaneously with soldering. Preferred as coating material are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.-195.degree. F. In a preferred embodiment of the invention compatible flux active agents are intermixed with the coating material.

Abstract: Apparatus adapted for cleaning or degreasing work pieces by contacting with an organic degreasing agent such as a halogenated hydrocarbon. The work pieces are moved in and out of contact with the degreasing agent and are supported on an array of substantially parallel, spaced, elongate members, in fixed position. Means are included for moving the work pieces across the top surface of the array in the direction of elongation of the members.

Abstract: Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120-195.degree. F.

Abstract: Apparatus adapted for cleaning or degreasing work pieces by contacting with an organic degreasing agent such as a halogenated hydrocarbon. The work pieces are moved in and out of contact with the degreasing agent and are supported on an array of substantially parallel, spaced, elongate members, in fixed position. Means are included for moving the work pieces across the top surface of the array in the direction of elongation of the members.

Abstract: A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce a wave having increasing pressure along its flow path whereby a substantially uni-directional wave may be formed which is highest adjacent its rear.

Abstract: A mass wave soldering system is described in which a standing wave of molten solder is formed from a static head of solder. The system comprises a soldering apparatus which has a two-compartment solder reservoir. The first compartment is designed to hold a first portion of the solder supply at a first liquid level with a layer of oil floating on the solder therein. The second compartment is designed for holding a second portion of the solder supply at a second liquid level above the first liquid level with a layer of oil floating on the solder therein. A sump and nozzle are positioned in the first compartment so that the sump is partially submerged in the molten solder therein, with the nozzle above the solder and oil levels therein, but below the solder and oil levels in the second compartment.

Abstract: Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120-195.degree.F.

Abstract: Apparatus adapted for cleaning or degreasing work pieces by contacting with an organic degreasing agent such as a halogenated hydrocarbon. The work pieces are moved in and out of contact with the degreasing agent and are supported on an array of substantially parallel, spaced, elongate members, in fixed position. Means are included for moving the work pieces across the top surface of the array in the direction of elongation of the members.

Abstract: An ultrasonic soldering system is described. Electrical and electronic components are assembled in a circuit board with their leads extending through holes in the board. The components are temporarily held in position in the board by means of a solid, solder-compatible, stabilizer material having a melting point below that of solder, which material couples the board and leads to one another. The component leads are then trimmed to finish length, and after trimming, the components are soldered in place utilizing vibratory energy in a body of molten solder. The vibratory energy in the solder scrubs the board and leads removing oxides and allowing wetting, thus eliminating the need for application of fluxes and surface preparation prior to soldering. The stabilizing material is melted and displaced simultaneously with soldering.