Patents by Inventor Kenneth J. Lowery

Kenneth J. Lowery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6017437
    Abstract: A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: January 25, 2000
    Assignee: Cutek Research, Inc.
    Inventors: Chiu H. Ting, William H. Holtkamp, Wen C. Ko, Kenneth J. Lowery, Peter Cho
  • Patent number: 5670034
    Abstract: A plating system (10) for plating a substrate such as a semiconductor wafer (116) in an electrolytic tank (12). A fixture wheel (14) is mounted within the electrolytic tank to rotate about a first axis (140). The fixture wheel receives the semiconductor wafer and supplies electrical current to the perimeter edge of the wafer. A fixture wheel drive motor (90) drives rotation of the fixture wheel about the first axis. An anode assembly (18) is mounted in the tank spaced from and facing towards the fixture wheel and received semiconductor wafer. The anode assembly carries first and second anodes (72) which are supplied with electrical current. A second motor (142) causes reciprocation of the anode assembly transversely in front of the rotating fixture wheel for improved uniformity in plating thickness and composition.
    Type: Grant
    Filed: June 17, 1996
    Date of Patent: September 23, 1997
    Assignee: American Plating Systems
    Inventor: Kenneth J. Lowery
  • Patent number: 5472592
    Abstract: An apparatus (10) for electrolytic plating of a substrate (44) includes a tank (14) in which a shaft (30) is centrally mounted for rotation about a first axis (28). The shaft carries an arm (40), on the distal end (112) of which is rotatably mounted a fixture wheel (44). The substrate to be plated is carried on the fixture wheel, which rides on an annular track (50) formed on the bottom of the tank around the shaft. A plurality of spaced pins (52) projecting upwardly from the track engage with a plurality of spaced recesses (56) formed about the perimeter (54) of the wheel, so that the wheel rotates about a second axis (64) while revolving around the first axis. The fixture carries a plurality of electrical contact members (46) that contact the substrate. Each contact member is separately supplied with current from a multichannel power supply (22).
    Type: Grant
    Filed: July 19, 1994
    Date of Patent: December 5, 1995
    Assignee: American Plating Systems
    Inventor: Kenneth J. Lowery