Patents by Inventor Kenneth Kindsfater
Kenneth Kindsfater has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8772915Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.Type: GrantFiled: June 30, 2011Date of Patent: July 8, 2014Assignee: Broadcom CorporationInventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
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Publication number: 20110254158Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.Type: ApplicationFiled: June 30, 2011Publication date: October 20, 2011Inventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
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Patent number: 7982294Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.Type: GrantFiled: March 14, 2007Date of Patent: July 19, 2011Assignee: Broadcom CorporationInventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
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Publication number: 20080224307Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.Type: ApplicationFiled: March 14, 2007Publication date: September 18, 2008Inventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
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Publication number: 20080036037Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.Type: ApplicationFiled: July 26, 2007Publication date: February 14, 2008Applicant: Broadcom CorporationInventors: Agnes Woo, Kenneth Kindsfater, Fang Lu
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Patent number: 7191279Abstract: Methods of setting numerically controlled delay lines using step sizes based on a delay locked loop lock value are presented herein. In one embodiment, a method may comprise, for example, one or more of the following: calculating an offset value for at least one NCDL; and interpolating a new offset value for the at least one NCDL, based on a change in a delay locked loop (DLL) output value from a previous DLL output value to a new DLL output value.Type: GrantFiled: December 16, 2003Date of Patent: March 13, 2007Assignee: Broadcom CorporationInventors: Sathish Kumar, Kenneth Kindsfater, Lionel D'Luna, Lakshmanan Ramakrishnan, Anand Pande
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Publication number: 20070007598Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programable attenuation and a programable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.Type: ApplicationFiled: September 15, 2006Publication date: January 11, 2007Applicant: Broadcom CorporationInventors: Agnes Woo, Kenneth Kindsfater, Fang Lu
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Publication number: 20050236673Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programable attenuation and a programable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.Type: ApplicationFiled: July 1, 2005Publication date: October 27, 2005Applicant: Broadcom CorporationInventors: Agnes Woo, Kenneth Kindsfater, Fang Lu
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Publication number: 20050010714Abstract: Methods of setting numerically controlled delay lines using step sizes based on a delay locked loop lock value are presented herein. In one embodiment, a method may comprise, for example, one or more of the following: calculating an offset value for at least one NCDL; and interpolating a new offset value for the at least one NCDL, based on a change in a delay locked loop (DLL) output value from a previous DLL output value to a new DLL output value.Type: ApplicationFiled: December 16, 2003Publication date: January 13, 2005Inventors: Sathish Kumar, Kenneth Kindsfater, Lionel D'Luna, Lakshmanan Ramakrishnan, Anand Pande