Abstract: Apparatus and methods for filament crimping. The apparatus includes a filament crimp element. The filament crimp element includes a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Interlock features configured for cold welding are also included. Methods for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Interlock features configured for cold welding are also included. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for selectively providing or preventing access to areas, enclosed spaces or volumes, or for controlling the position of a pivot or hinge assembly. In one exemplary embodiment, the apparatus includes a selectively actuated or actuate-able hinge which is controlled at least in part by a shaped memory alloy (SMA) filament or filaments. Application of electrical current to the filament causes changes in the physical properties thereof, thereby allowing “ratcheted” rotation of a portion of the hinge relative to other portions. In one variant, the hinge can be remotely operated, such as via wireless or wireline communication with a remote entity such as a computer or smartphone.

Abstract: Apparatus and methods for selectively providing or preventing access to areas, enclosed spaces or volumes, or for controlling the position of a pivot or hinge assembly. In one exemplary embodiment, the apparatus includes a selectively actuated or actuate-able hinge which is controlled at least in part by a shaped memory alloy (SMA) filament or filaments. Application of electrical current to the filament causes changes in the physical properties thereof, thereby allowing “ratcheted” rotation of a portion of the hinge relative to other portions. In one variant, the hinge can be remotely operated, such as via wireless or wireline communication with a remote entity such as a computer or smartphone.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Abstract: A shield assembly useful in the attenuation of electronic noise or spurious electric signals. In one embodiment, the shielding assembly comprises a metallic component that is encapsulated with an electronic component to be shielded, such as an integrated circuit. A conductive coating is applied to an exterior surface of the encapsulated metallic and electronic components so that it is in contact with the metallic component. The metallic component is formed using a selective metal deposition process (e.g., electroforming) and a laser-cutting process that increase manufacturing efficiency and provide enhanced mechanical and structural features, including especially the ability to make the shield very thin, have a high degree of co planarity, and maintain a low profile for the shielded electronic component as a whole (i.e., add very little height to that of the electronic component). Methods of manufacturing and utilizing the shielding assembly in designs are also disclosed.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Abstract: A socket or clip adapted to provide an interconnect between an electronic component, such as an automotive blade fuse, and a printed circuit board or other device. The clip comprises a substantially unitary structure for attaching the electronic component to the printed circuit board substrate. In one embodiment, the clip also comprises a closed-entry structure receiving element to receive the electronic component; a terminating element for interfacing the clip to the printed circuit board; a spring clip element for receiving terminations from said electronic component; and an overstress feature for preventing the spring clip element from becoming overstressed.

Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially round configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.