Abstract: According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.

Abstract: A method includes raising a pickup area of a pickup member including one or more arms extending between the pickup area and one or more sidewalls of a frame of a board level shield (BLS), such that the pickup area is raised relative to and above an upper surface of the one or more sidewalls of the frame, and such that the pickup area rotates in place as the pickup area is raised relative to and above the upper surface of the one or more sidewalls.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield generally includes a cover (or lid) and a fence (or frame or base). The cover is attachable to the fence in a plurality of different positions.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.

Abstract: According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is solderable to a printed circuit board (PCB). The BLS includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a locking mechanism in a first position and a compressed second position, where the locking mechanism provides resistance against internal upward forces when the BLS has been compressed into a second position. The BLS may be soldered to the PCB while in the first position, and subsequently compressed into the second position after the solder has hardened.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield generally includes a cover (or lid) and a fence (or frame or base). The cover is attachable to the fence in a plurality of different positions.

Abstract: According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is solderable to a printed circuit board (PCB). The BLS includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a locking mechanism in a first position and a compressed second position, where the locking mechanism provides resistance against internal upward forces when the BLS has been compressed into a second position. The BLS may be soldered to the PCB while in the first position, and subsequently compressed into the second position after the solder has hardened.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: According to various aspects, exemplary embodiments are disclosed of mid-plates and EMI shields for electronic devices. In an exemplary embodiment, a mid-plate generally includes one or more recessed portions along a surface of the mid-plate. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader. The dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components. In another exemplary embodiment, a board level shield (BLS) generally includes a cover having one or more recessed portions along an inner surface of the cover. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader, whereby the dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components when the one or more components are under the BLS.

Abstract: A molded connector gasket of indefinite length or circumference that provides electromagnetic interference shielding of electronic components is disclosed. The disclosed gasket may have a cross-sectional profile comprising three protruding members including a first member being generally vertical, a second member being generally forty-five degrees from the first member via a curve, and a third member protruding from the second member near the curve, the third member being at an angle generally less than vertical but more than forty five degrees with respect to the second member.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: Flashlights are provided herein that can be removable attached to a magnetic surface. A flashlight can include a body having a bulb end and a clip end, a light source connected to the bulb end, and one or more magnets attached to the body flashlight. In one example, a flashlight includes a pocket clip attached to the clip end, and the one or more magnets can be attached to the pocket clip.

Abstract: Flashlights are provided herein that can be removable attached to a magnetic surface. A flashlight can include a body having a bulb end and a clip end, a light source connected to the bulb end, and one or more magnets attached to the body flashlight. In one example, a flashlight includes a pocket clip attached to the clip end, and the one or more magnets can be attached to the pocket clip.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are provided of low-profile apparatus capable of providing board level shielding for one or more electrical components while also providing dissipation of heat generated by the one or more electrical components. In one particular embodiment, an apparatus generally includes a resiliently compressible EMI gasket, a heat sink, and a spring clip. The spring clip has resilient legs with feet. The feet are configured to engage the board. When the feet are engaged with the board, a clamping force is generated that compressively biases the heat sink and the resiliently compressive EMI gasket generally towards the board.

Abstract: An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical components of a board. The heat sink includes resilient fingers connected to a lid portion, and configured to engage openings of the fence and/or the board. The lid portion is configured to substantially entirely cover the at least one opening of the fence for cooperatively shielding the one or more electrical components within the interior defined by the lid portion and the fence's walls. The thermal interface is configured such that engagement of the resilient fingers with the openings compresses the thermal interface between the lid portion and the one or more electrical components, thereby forming a thermally-conducting heat path from the one or more electrical components to the heat sink.

Abstract: A gasket includes an elongated strip including a first resilient gasket component and a second resilient gasket component having shielding properties, the first and second gasket components being joined together. A method for making a gasket is also disclosed.