Abstract: A method and apparatus for use in forming pre-positioned solder bumps (104) on a pad arrangement (100) of a substrate (101) include placing a predetermined pattern (306) of solder preforms (304) in contact with a meltable adhesive fluxing agent (302) on a carrier tape (402), and then heating the fluxing agent (302) to melt it. Next, the fluxing agent (302) is cooled to resolidify it, thereby securing the solder preforms (304) to the carrier tape (402). The carrier tape (402) is then aligned over the pad arrangement (100) and the solder preforms (304) are transferred to the pad arrangement (100) by heating the solder preforms (304) to form the solder bumps (104) in the predetermined pattern (306).

Abstract: A non-hardening, solvent removable hydrophobic conformal coating is provided for electronic devices, such as printed circuit boards. The coating material comprises a metal alkyl benzyl sulfonate, together with a carrier and a solvent. The metal alkyl benzyl sulfonate may include compounds such as calcium eicosanylbenzyl sulfonate. The carrier may be any oxidized hydrocarbon, such as lauryl ethanoxylate, for example, and the solvent may be any low boiling aliphatic hydrocarbon. Though the coating is impervious to water, it may be readily and selectively removed using a small quantity of a non-polar organic solvent, such as mineral spirits or terpenes. Thus, although the electronic device is protected from corrosion, electromigration and physical harm by the coating, the coating may be easily, quickly and selectively removed in the event a component needs replacement, repair or adjustment.

Abstract: A single purpose robot arm end effector having a ring shaped frame positioned around the periphery thereof with a plurality of extendable drivers mounted in the frame for movement between a nonfunctioning position and an operative position. Each of said drivers can be tooled up for unique or dedicated applications so that the arm will be performing many different functions during most of a manufacturing cycle, instead of only performing one function for a short period of time during the manufacturing cycle.

Abstract: An electrical interconnect pin, particularly suitable for attachment to the edge of a flexible printed circuit board or "flex circuit", has an edge clip with an opening that can be temporarily enlarged to facilitate the attachment of the pin to the edge of a circuit board. The pin includes an elongated shank with a rectangular cross section and two substantially identical clips attached to opposite sides of the shank. To attach the pin to a printed circuit board, the pin is placed on a flat surface with the shank parallel to the surface. A force is then applied to the shank just below the clips and perpendicular to the surface. This force opens up the edge clip and the edge of the printed circuit board is then inserted into the opening of the edge clip. After the force is removed, the edge clip clamps down on the circuit board, temporarily attaching the pin to the board. The pins can then be permanently affixed to the board by soldering.