Patents by Inventor Kenneth Robert Rhyner

Kenneth Robert Rhyner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 10262957
    Abstract: An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: April 16, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20180301428
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 18, 2018
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 9941228
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 10, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20170229408
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Inventors: Rajen Manicon MURUGAN, Minhong MI, Gary Paul MORRISON, Jie CHEN, Kenneth Robert RHYNER, Stanley Craig BEDDINGFIELD, Chittranjan Mohan GUPTA, Django Earl TROMBLEY
  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 9666553
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: May 30, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20150364816
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: June 15, 2015
    Publication date: December 17, 2015
    Inventors: Rajen Manicon MURUGAN, Minhong MI, Gary Paul MORRISON, Jie CHEN, Kenneth Robert RHYNER, Stanley Craig BEDDINGFIELD, Chittranjan Mohan GUPTA, Django Earl TROMBLEY
  • Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
    Patent number: 8828799
    Abstract: A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: September 9, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Kenneth Robert Rhyner, Peter R. Harper
  • Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
    Patent number: 8598048
    Abstract: An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: December 3, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Kenneth Robert Rhyner, Peter R. Harper
  • Method of Forming an Integrated Circuit Package Including a Direct Connect Pad, A Blind Via, and a Bond Pad Electrically Coupled to the Direct Connect Pad
    Publication number: 20130295722
    Abstract: A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 7, 2013
    Inventors: Kenneth Robert Rhyner, Peter R. Harper
  • INTEGRATED CIRCUIT PACKAGE INCLUDING A DIRECT CONNECT PAD, A BLIND VIA, AND A BOND PAD ELECTRICALLY COUPLED TO THE DIRECT CONNECT PAD
    Publication number: 20130026642
    Abstract: An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other.
    Type: Application
    Filed: July 27, 2011
    Publication date: January 31, 2013
    Inventors: Kenneth Robert Rhyner, Peter R. Harper