Abstract: A human-machine interface device includes a touch receiver having a plurality of touch surfaces in distinctly different planes, an elastic strain sensing element having a base and a plurality of legs extending from the base and contacting an associated touch surface, a first linear strain gauge mounted on each leg to detect strain along a first direction and a second strain gauge mounted on each leg to detect strain along a second direction that is different from the first direction, and a processor configured to receive the signals from the strain gauges and determines a command operation intended by a user of the human-machine interface device.

Abstract: A haptic controller includes a conventional user interface having a plurality of touch surfaces, a shaped strain plate having a plurality of strain surfaces, each strain surface corresponding with one of the plurality of touch surfaces, a strain gauge mounted on each of the plurality of strain surfaces and a microcontroller electrically connected with the strain gauges.

Abstract: A power electronic module having reduced mass and/or reduced package size as compared with conventional modules employing die cast materials, secondary machining, and/or welding operations includes a housing, a discrete cooling channel positioned in the housing and having opposing cooling surfaces, and first and second printed circuit board assemblies disposed on opposite sides of the cooling channel.

Abstract: A power electronic module having reduced mass and/or reduced package size as compared with conventional modules employing die cast materials, secondary machining, and/or welding operations includes a housing, a discrete cooling channel positioned in the housing and having opposing cooling surfaces, and first and second printed circuit board assemblies disposed on opposite sides of the cooling channel.

Abstract: A liquid cooled power electronic device includes a unitary cooling body defining a fluid passageway; a separately fabricated main housing having a recess for receiving the cooling body; and a circuit substrate having an electronic component in conductive thermal contact with the cooling body, wherein the cooling body is retained within the recess between the main housing and the circuit substrate. This arrangement has one or more advantages relating to improved leak testing, improved thermal performance, and reduced scrap.