Abstract: The present invention relates to methods, devices and systems for associating consumable data with an assay consumable used in a biological assay. Provided are assay systems and associated consumables, wherein the assay system adjusts one or more steps of an assay protocol based on consumable data specific for that consumable. Various types of consumable data are described, as well as methods of using such data in the conduct of an assay by an assay system. The present invention also relates to consumables (e.g., kits and reagent containers), software, data deployable bundles, computer-readable media, loading carts, instruments, systems, and methods, for performing automated biological assays.

Abstract: A clock circuit configured to generate a falling edge independently of an input clock signal is disclosed. In one embodiment, a clock circuit includes an input circuit coupled to receive an input clock signal. A corresponding first clock signal is provided on a first clock node, while a second clock signal that is a delayed version of the first is provided on a second clock signal. The clock circuit may generate an output clock signal based on the first and second clock signals and a feedback signal received from a functional circuit coupled to receive the output clock signal. The rising edge of the output clock signal is generated dependent upon when the rising edge of the input clock signal is received. The falling edge of the output clock signal is generated by the clock circuit independently of when the falling edge of the input clock signal is received.

Abstract: A memory includes an I/O unit that is shared between multiple storage arrays. The shared I/O unit provides output data from the arrays. The memory includes an isolation unit connected between each storage array and the shared I/O unit. In addition, each of the storage arrays and the shared I/O unit may be connected to a separate switched voltage domain through for example, power gating circuits. If one or more of the storage arrays is placed in retention or low-voltage mode, the isolation units that are coupled to the affected storage arrays may be configured to isolate the bitlines of those storage arrays from the shared I/O data paths.

Abstract: A memory includes an I/O unit that is shared between multiple storage arrays. The shared I/O unit provides output data from the arrays. The memory includes an isolation unit connected between each storage array and the shared I/O unit. In addition, each of the storage arrays and the shared I/O unit may be connected to a separate switched voltage domain through for example, power gating circuits. If one or more of the storage arrays is placed in retention or low-voltage mode, the isolation units that are coupled to the affected storage arrays may be configured to isolate the bitlines of those storage arrays from the shared I/O data paths.

Abstract: A memory includes an I/O unit that is shared between multiple storage arrays. The shared I/O unit provides output data from the arrays. The memory includes an isolation unit connected between each storage array and the shared I/O unit. In addition, each of the storage arrays and the shared I/O unit may be connected to a separate switched voltage domain through for example, power gating circuits. If one or more of the storage arrays is placed in retention or low-voltage mode, the isolation units that are coupled to the affected storage arrays may be configured to isolate the bitlines of those storage arrays from the shared I/O data paths.

Abstract: A memory includes a shared I/O unit that is shared between multiple storage arrays provides output data from the arrays. The shared I/O includes an output latch with an integrated output clamp. The I/O unit may be configured to provide output data from the storage arrays via data output signal paths. The I/O unit includes an output latch configured to force a valid logic level on the data output signal paths in response to a power down condition.

Abstract: A memory includes an I/O unit that is shared between multiple storage arrays. The shared I/O unit provides output data from the arrays. The memory includes an isolation unit connected between each storage array and the shared I/O unit. In addition, each of the storage arrays and the shared I/O unit may be connected to a separate switched voltage domain through for example, power gating circuits. If one or more of the storage arrays is placed in retention or low-voltage mode, the isolation units that are coupled to the affected storage arrays may be configured to isolate the bitlines of those storage arrays from the shared I/O data paths.

Abstract: A memory includes a shared I/O unit that is shared between multiple storage arrays provides output data from the arrays. The shared I/O includes an output latch with an integrated output clamp. The I/O unit may be configured to provide output data from the storage arrays via data output signal paths. The I/O unit includes an output latch configured to force a valid logic level on the data output signal paths in response to a power down condition.

Abstract: A mechanism for providing retention mode voltage to a memory storage array includes a resistor coupled between a power supply and a power rail of the storage array. The power rail may distribute an operating current to the bit cells of the storage array. The resistor may provide a path for current to the power rail from the power supply during operation in a retention mode. In addition, a switching device coupled between the power supply and the power rail, in parallel with the resistor, may convey operational current to the power rail from the power supply during operation in a normal mode.

Abstract: A multiple-way, set associative cache memory (20) allows burst read and burst write operations to occur simultaneously on different columns within a memory block during a read-modify-write operation. This is accomplished by using a write column logic (47) and a read column logic (51) to delay write column decode signals by one clock cycle from the read column decode signals. When data is being burst into and out of the cache during the read-modify-write operation, the first read cycle from the cache array (40) occurs, and one clock cycle later, the first write cycle occurs. The first write cycle occurs during the same time interval as the second read cycle. This increases the speed of a read-modify-write operation, relaxes timing constraints on the read and write operations, while reducing the power consumption of the cache.

Abstract: An integrated circuit memory (140) includes programmable fuses (20) coupled to scannable flip-flops (25). The programmable fuses (20) and scannable flip-flops (25) are implemented in a scan chain, and are used to program specific information about the integrated circuit memory (140), such as for example, repair (redundancy) information, wafer lot number and wafer number, die position on the wafer, or any other information that would be useful during or after package testing.

Abstract: A delay locked loop (44) includes an arbiter circuit (86), a VCD circuit (85), and a collapse detector (88). The arbiter circuit (86) receives an input signal and provides a retard signal to adjust the amount of propagation delay of VCD circuit (85), in order to synchronize the phases of the input signal to an output signal of the VCD circuit (85). The collapse detector (88) detects if the output signal of the VCD circuit (85) has failed to change logic states within a predetermined length of time. The delay locked loop (44) can lock the phases of two signals having different frequencies.

Abstract: An ECL multiplexing circuit (20) includes two differential pairs (21 and 22) for receiving first and second ECL level input signals, emitter-follower output transistors (27 and 28), and a differential pair (31 and 32) for receiving differential clock signals. The differential clock signals control which of the two differential pairs (21 and 22) is coupled to the emitter-follower output transistors (27 and 28). The ECL level input signals that control a logic state of the output signals is determined by the logic state of the clock signals. The ECL multiplexing circuit (20) receives non-overlapping clock signals and is used in a quadrature frequency divide-by-two circuit (40) to divide a frequency of an input clock signal by two.

Abstract: A power-on reset circuit (30) for a memory (20) includes a DC model circuit (39), an N.sub.BIAS check circuit (64), and a NAND logic gate (71). A logic low power-on reset signal is provided at power-up of the memory (20) to establish initial conditions in a clock circuit (29) and in row and column predecoders/latches (24, 27). When the power supply voltage, a bandgap reference voltage, and a bias voltage all reach their predetermined voltages, the power-on reset circuit (30) provides a logic high power-on reset signal. In this manner, the power-on reset circuit (30) is assured of providing a logic low power-on reset signal until all of the proper voltage levels are reached. In addition, the power-on reset circuit models a DC circuit equivalent of an address buffer circuit (79) for compensating for process and temperature variations.

Abstract: A cache TAG RAM (25) includes a reduction circuit (39) for comparing match signals from a plurality of exclusive OR logic circuits (33, 34) and provides a hit signal when all of the TAG address bits of a stored TAG address is the same as input address bits. The reduction circuit (39) provides a miss signal when any one or more of the bits of the stored TAG address is not the same as the corresponding bits of the input address bits. In one embodiment, the reduction circuit (39) uses a plurality of transistors (77, 78) coupled to a conductor (75) for discharging the conductor (75) if one of the exclusive OR logic circuits (33, 34) indicates a miss. In another embodiment, the reduction circuit (39") charges the conductor. The comparison can be made using signals having small signal swing at high speed, and a reference voltage is not needed for the comparison.

Abstract: A delay locked loop (44) includes an arbiter circuit (86), a VCD circuit (85), and a collapse detector (88). The arbiter circuit (86) receives an input signal and provides a retard signal to adjust the amount of propagation delay of VCD circuit (85), in order to synchronize the phases of the input signal to an output signal of the VCD circuit (85). The collapse detector (88) detects if the output signal of the VCD circuit (85) has failed to change logic states within a predetermined length of time. The delay locked loop (44) can lock the phases of two signals having different frequencies.

Abstract: An ECL-to-CMOS buffer having a single-sided delay comprises an ECL logic gate, a level converter, a plurality of series connected inverters, and a NOR gate. The ECL logic gate receives an ECL level input signal, and provides complementary intermediate level logic signals. The level converter receives the intermediate level logic signals and provides a CMOS level output signal. The NOR gate receives the CMOS level output signal, via the series connected inverters, at an input terminal after a predetermined delay. One of the intermediate level logic signals is also received by the NOR gate at a second input terminal. The CMOS level output signal is delayed for a predetermined time in a low-to-high transition, with no unwanted delay in a high-to-low transition.

Abstract: A synchronous memory (20) has parallel data output registers (34) and a dummy path (46). The output data from a memory array (22) is provided to the parallel output registers (34). The output registers (34) provide two parallel, interleaved, output data paths. The data in each path changes every other cycle of a clock signal. Dummy path (46) contains delay elements that model a propagation delay for a data path of the memory (20) during a read cycle. Using parallel data output registers (34) increases a time in which data is valid during the read cycle. The dummy path (46) tracks the output data signal in terms of process, power supply and temperature variations to ensure that the correct data is acquired during the read cycle.

Abstract: A synchronous memory (50) having a looped global data line (80) reduces a difference between minimum and maximum propagation delays between different locations in a memory array (51) during a read cycle of the memory (50). The looped global data line (80) has a first portion (80') and a second portion (80"). The first portion (80') extends along an edge of the memory array (51) in a direction substantially parallel to a direction of the word lines of the array (51). Sense amplifiers (73-78) are coupled to the first portion (80') of the looped global data line (80). At one end of the array (51), the second portion (80") of the looped global data line extends back in an opposite direction to the first portion (80') and is coupled to output data circuits (84). Reducing the difference in propagation delays improves noise margins and allows increased operating speed.

Abstract: A pipelined memory (20) has a synchronous operating mode and an asynchronous operating mode. The memory (20) includes output registers (34) and output enable registers (48) which are used to electrically switch between the asynchronous operating mode and the synchronous operating mode. In addition, in the synchronous operating mode, the depth of pipelining can be changed between a three stage pipeline and a two stage pipeline. By changing the depth of pipelining, the memory (20) can operate using a greater range of clock frequencies. In addition, the operating frequency can be changed to facilitate testing and debugging of the memory (20).