Abstract: A fixture for securing a pin grid array (PGA) and grounding all circuits or pins in the PGA for electrolytic plating provides a series of parallel wires that are inserted between every other gap between the PGA pin rows. The cross section of each wire is constructed to provide a first cross sectional width at one location that is less than or equal to the PGA gap width for insertion into the PGA gap and a second cross sectional width, at an angle to the first cross sectional width, that is greater than the gap width. With this arrangement, the wire can be inserted in the gap with the first cross sectional width traversing the gap and then rotated to bring the wider, second cross sectional width into spreading engagement with the pins for a reliable mechanical and conductive contact.

Abstract: A method is provided for processing a number of "L"-shaped sections within a flat strip to form terminals extending from a component. In the strip, these sections are attached to a web by connecting portions. A number of such sections are simultaneously processed within various stations through which the strip is incrementally fed. These connecting portions are first twisted, so that each "L"-shaped section in the number of such sections extends in a plane perpendicular to the web. Next, these connecting portions are deflected so that outward extending legs of the sections extend in a direction needed for insertion into an electronic component structure. Then, these connecting portions are sheared, as each "L"-shaped section separated from the strip is placed in a slot within a receptacle block. Then, the receptacle block is slid to insert the "L"-shaped sections.

Abstract: An interferometer is used to locate and examine defects in a test surface of a test specimen. Defects are first located as the test surface is driven past the objective of the interferometer at a constant speed, with a darkfield interferogram being examined as it flows across a row of CCD elements. During this process, the location of each defect is stored. Next, the test specimen is sequentially moved into the locations at which static measurements are made using an area array of CCD elements. During these measurements, the phase angle relationship of the interferometer is varied so that heights of surface segments may be calculated. If some to these segments are located more than a quarter wave length of the interferometer light source from the surface at which the darkfield is established, a process is used to perform height corrections for segments within transition boundaries.