Patents by Inventor Kenro Hayashi

Kenro Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5788763
    Abstract: In a heat history initializing step, a heat treatment in performed in an atmosphere including at least one of hydrogen, helium, and argon while the temperature is increased in a range of 700.degree. C. to 1,000.degree. C. at a rate of 15.degree.-1,000.degree. C./min. In a controlled nuclei growing step, a heat treatment is performed in the above atmosphere while the temperature is kept constant in a range of 850.degree. C. to 980.degree. C. for 0.5-60 minutes.
    Type: Grant
    Filed: March 7, 1996
    Date of Patent: August 4, 1998
    Assignee: Toshiba Ceramics Co., Ltd.
    Inventors: Kenro Hayashi, Ryuji Takeda, Katsuhiro Chaki, Ping Xin, Jun Yoshikawa, Hiroyuki Saito
  • Patent number: 4836965
    Abstract: A method of producing a high density and high strength silicon carbide member for a heat treatment furnace to be used in the manufacture of a semiconductor device. In this method, SiC powder, carbon powder, deflocculating agent and water are mixed to form a slip. Then the slip is formed into a desired shape, cured under a nonoxidizing atmosphere, and removed of any impurity contained in the shaped body. Finally, the shaped body is immersed in a molten silicon to convert the carbon in the shaped body into silicon carbide.
    Type: Grant
    Filed: September 8, 1987
    Date of Patent: June 6, 1989
    Assignee: Toshiba Ceramics Co., Ltd.
    Inventors: Kenro Hayashi, Takashi Tanaka
  • Patent number: 4753763
    Abstract: A method of manufacturing heating furnace parts having high purity which comprises the steps of molding a raw powder mainly consisting of silicon carbide powder into a prescribed form, and subjecting the molded product to a purification treatment at a temperature ranging between 1,500.degree. and 2,100.degree. C. in an atmosphere containing a gas selected from the group consisting of halogen gas and hydrogen halide gas, and an inert gas applied as a carrier gas.
    Type: Grant
    Filed: December 24, 1984
    Date of Patent: June 28, 1988
    Assignee: Toshiba Ceramics Co., Ltd.
    Inventors: Takashi Tanaka, Kenro Hayashi
  • Patent number: 4619798
    Abstract: A method of manufacturing extremely high purity parts for use to the heating furnace comprising adding a sintering assistant of 0.5-2.0 weight % and a binder, to SiC powder which has an average particle diameter of 2 .mu.m or less, and molding it to a predetermined form; applying the purification treatment to this molded body by placing it in the 800.degree.-1,300.degree. C. atmosphere of a gas which is selected from a group consisting of halogen gas and hydrogen halide; degassing the purified molded body in vacuum under a temperature higher than that employed at the purification treatment; sintering the degassed molded body, and coating an SiC film on at least part of the sintered body according to the chemical vapor deposition.
    Type: Grant
    Filed: December 24, 1984
    Date of Patent: October 28, 1986
    Assignee: Toshiba Ceramics Co., Ltd.
    Inventors: Takashi Tanaka, Kenro Hayashi