Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A transparent heating element is disposed to face a sensor. The transparent heating element has a pair of bus bars spaced apart from each other in a first direction, and a plurality of coupling conductors coupling the pair of bus bars. The coupling conductors are arranged in a second direction not parallel to the first direction. The coupling conductor is folded back at least twice in the first direction.

Abstract: A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side.

Abstract: A suspension circuit board comprises a metal support board, a first insulation layer disposed on the metal support board a conductive layer disposed on the first insulation layer, the conductive layer forming a wire; and a second insulation layer disposed on the first insulation layer and the conductive layer. The suspension circuit board is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F1<F2, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress F1 and a stress generated in the conductive layer at a position corresponding to a periphery of the metal support board opening is represented as a second stress F2.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A suspension circuit board 1 comprises a metal support board 12, a first insulation layer 11 disposed on the metal support board 12, a conductive layer 10 disposed on the first insulation layer 11, the conductive layer 11 forming a wire; and a second insulation layer 13 disposed on the first insulation layer 11 and the conductive layer 10. The suspension circuit board 1 is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F1<F2, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress F1 and a stress generated in the conductive layer at a position corresponding to a periphery of a metal support board opening is represented as a second stress F2.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side.

Abstract: A signal generating unit is arranged to generate a filter changeover signal a, which indicates the changeover from a plurality of waveform reshaping units of a first group corresponding to the reception of the modulated signals to a plurality of waveform reshaping units of a second group, in cases where an electric power gain value of the transmission signal is changed, to send the changeover signal a to the filter selecting unit, to generate a new gain signal of which a new electric power gain value is changed from an electric power gain value of the gain signal to send the new gain signal to the multipliers corresponding to the waveform reshaping units of the second group, and to successively send the gain signal having the electric power gain value to the multipliers corresponding to the waveform reshaping units of the first group during a prescribed time period after the change of the gain signal to the new gain signal.

Abstract: In a frequency synthesizer, a variable frequency divider divides the oscillation signal of a VCO while switching the frequency dividing ratio in accordance with an integral frequency dividing ratio generated by a frequency dividing ratio generating circuit. The VCO is controlled with an output of a loop filter. The frequency dividing ratio generating circuit includes multiple integrators connected in cascade and differentiators which differentiate the carry-out signals of the integrators, so that a phase error generated at the variable frequency divider is obtained from an output of an adder included in the final stage integrator of the frequency dividing ratio generating circuit. A phase error compensation value is output, and further a pulse width of a signal to be used for compensating for phase error is varied in accordance with the phase error compensation value to perform compensation for the phase error.