Abstract: When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.

Abstract: A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (?/Ra) of 0.2 or less, and the rough surface of the film has (?/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (?) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.

Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T die 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.5 to 6 times or less as large as an average thickness of the film.

Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T dice 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.

Abstract: The present invention provides a method for manufacturing a film for a film capacitor making it possible to produce a film for a film capacitor which has a thickness of 10 ?m or less and which is excellent in a heat resistance and a voltage resistance at a high thickness accuracy by using a polyetherimide resin and provides as well a film for a film capacitor.

Abstract: A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (?/Ra) of 0.2 or less, and the rough surface of the film has (?/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (?) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.

Abstract: A film for film capacitors having a thickness of 10 microns or less, wherein the film has surface properties of (Ra) of 0.2 microns or less, (Rz/Ra) of 10 or less and a dynamic friction coefficient of 1.5 or less, where (Ra) is an arithmetic average roughness and (Rz) is a maximum height defined both by the method specified in JIS B 0601 2001. The film can be manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film; and rolling up the cooled film onto a winding tube in a winding unit.

Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T dice 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.

Abstract: When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.

Abstract: The present invention provides a method for manufacturing a film for a film capacitor making it possible to produce a film for a film capacitor which has a thickness of 10 ?m or less and which is excellent in a heat resistance and a voltage resistance at a high thickness accuracy by using a polyetherimide resin and provides as well a film for a film capacitor.