Patents by Inventor Kenshiro Nakashima

Kenshiro Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6770508
    Abstract: An ohmic electrode for an SiC semiconductor includes a p-type Si layer formed on the surface of a p-type SiC semiconductor, and a metal silicide layer formed on the surface of the Si layer, the metal silicide layer being formed from a metal silicide such as PtSi. The p-type Si layer is preferably formed from p-type Si having a carrier concentration equal to or higher than that of the aforementioned p-type SiC. Preferably, the ohmic electrode is formed as follows: deposition of Si is performed; deposition of a metal silicide is performed by means of laser ablation; laser irradiation is performed to thereby improve ohmic properties and enhance adhesion between the result deposition layer and the p-type SiC semiconductor, and then further deposition of the metal silicide is performed by means of laser ablation.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: August 3, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kenshiro Nakashima, Yasuo Okuyama, Hitoshi Yokoi, Takafumi Oshima
  • Publication number: 20040099866
    Abstract: An ohmic electrode for an SiC semiconductor includes a p-type Si layer formed on the surface of a p-type SiC semiconductor, and a metal silicide layer formed on the surface of the Si layer, the metal silicide layer being formed from a metal silicide such as PtSi. The p-type Si layer is preferably formed from p-type Si having a carrier concentration equal to or higher than that of the aforementioned p-type SiC. Preferably, the ohmic electrode is formed as follows: deposition of Si is performed; deposition of a metal silicide is performed by means of laser ablation; laser irradiation is performed to thereby improve ohmic properties and enhance adhesion between the resultant deposition layer and the p-type SiC semiconductor; and then further deposition of the metal silicide is performed by means of laser ablation.
    Type: Application
    Filed: November 24, 2003
    Publication date: May 27, 2004
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Kenshiro Nakashima, Yasuo Okuyama, Hitoshi Yokoi, Takafumi Oshima
  • Patent number: 6627964
    Abstract: A gas sensor having a pn junction including two discrete electrical conductive-type layers, namely, a first semiconductor layer and a second semiconductor layer, disposed in contact with each other. Ohmic electrodes are formed on the respective surfaces of the semiconductor layers. A catalytic layer containing a metallic catalytic component which dissociates hydrogen atom from a molecule having hydrogen atom is formed on one of the ohmic electrodes. The pn junction diode-type gas sensor has a simple constitution, exhibits a small change in diode characteristics with time in long-term service and is capable of detecting a gas concentration of a molecule having a hydrogen atom, for example, H2, NH3, H2S, a hydrocarbon and the like, contained in a sample gas.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: September 30, 2003
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kenshiro Nakashima, Yasuo Okuyama, Hitoshi Yokoi, Takafumi Oshima
  • Publication number: 20020145145
    Abstract: An ohmic electrode for an SiC semiconductor includes a p-type Si layer formed on the surface of a p-type SiC semiconductor, and a metal silicide layer formed on the surface of the Si layer, the metal silicide layer being formed from a metal silicide such as PtSi. The p-type Si layer is preferably formed from p-type Si having a carrier concentration equal to or higher than that of the aforementioned p-type SiC. Preferably, the ohmic electrode is formed as follows: deposition of Si is performed; deposition of a metal silicide is performed by means of laser ablation; laser irradiation is performed to thereby improve ohmic properties and enhance adhesion between the resultant deposition layer and the p-type SiC semiconductor; and then further deposition of the metal silicide is performed by means of laser ablation.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 10, 2002
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Kenshiro Nakashima, Yasuo Okuyama, Hitoshi Yokoi, Takafumi Oshima
  • Publication number: 20020020853
    Abstract: A gas sensor having a pn junction including two discrete electrical conductive-type layers, namely, a first semiconductor layer and a second semiconductor layer, disposed in contact with each other. Ohmic electrodes are formed on the respective surfaces of the semiconductor layers. A catalytic layer containing a metallic catalytic component which dissociates hydrogen atom from a molecule having hydrogen atom is formed on one of the ohmic electrodes. The pn junction diode-type gas sensor has a simple constitution, exhibits a small change in diode characteristics with time in long-term service and is capable of detecting a gas concentration of a molecule having a hydrogen atom, for example, H2, NH3, H2S, a hydrocarbon and the like, contained in a sample gas.
    Type: Application
    Filed: August 9, 2001
    Publication date: February 21, 2002
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Kenshiro Nakashima, Yasuo Okuyama, Hitoshi Yokoi, Takafumi Oshima