Abstract: A gas distribution structure for supplying reactant gases and purge gases to independent process cells to deposit thin films on separate regions of a substrate is described. Each process cell has an associated ring purge and exhaust manifold to prevent reactive gases from forming deposits on the surface of the wafer between the isolated regions. Each process cell has an associated showerhead for conveying the reactive gases to the substrate. The showerheads can be independently rotated to simulate the rotation parameter for the deposition process.

Abstract: A combinatorial processing chamber having an integrated magnetic confinement system is described herein. The chamber comprises source magnetic confinement assemblies that are configured to shape ion beams produced by associated sputter sources. The chamber further comprises magnetic confinement assemblies that are configured to drive a combined ion beam onto an exposed surface of the substrate to combinatorial process regions of the substrate.

Abstract: A gas distribution structure for supplying reactant gases and purge gases to independent process cells to deposit thin films on separate regions of a substrate is described. Each process cell has an associated ring purge and exhaust manifold to prevent reactive gases from forming deposits on the surface of the wafer between the isolated regions. Each process cell has an associated showerhead for conveying the reactive gases to the substrate. The showerheads can be independently rotated to simulate the rotation parameter for the deposition process.

Abstract: An apparatus for cleaning a wafer has a first chamber and a component coupled to the first chamber. The first chamber has a first input to form de-ionized water droplets. The component is coupled to the first chamber to further atomize and apply the atomized de-ionized water droplets on the wafer.

Abstract: A single-substrate apparatus for wet chemical processing of one or multiple sides of a substrate is described. Embodiments of the present invention enable multiple chemicals to be applied to the substrate in succession and reclaimed substantially free of cross contamination between chemicals. In an embodiment of the present invention, a rotatable fluid diverter is positioned between a rotatable pedestal and a nonrotatable multi-level catch cup to funnel fluid shed from a substrate to a predetermined level of the catch cup. The rotatable fluid diverter is designed to expel fluid over a narrow spray angle and thereby enable the pitch of the levels in the catch cup to be reduced so that the chamber volume of the single-substrate apparatus is reduced. In another embodiment of the present invention, the rotatable pedestal is moveable so that the fluid shed from the substrate can be directed to away from the multi-level catch cup.

Abstract: A novel orbital welder includes a body defining a tube passage, a weld tip, a light source disposed to emit light toward the tube passage such that the emitted light will impinge upon one or more tubes placed in the tube passage, a detector to detect the light emitted by the light source from the tube passage, a clamp adjacent the tube passage, and a control unit operative to close the clamp responsive to a signal from the detector. A method is also disclosed for automatically clamping tubes in an orbital welder when they are properly aligned. The method includes the steps of emitting light from the light source into the tube passage, monitoring the light from the tube passage with the detector, receiving a signal indicative of the position of the tube(s) based on the intensity of the detected light, and automatically closing a clamp depending on the signal from the detector.

Abstract: A novel orbital welder includes a body defining a tube passage, a weld tip, a rotor, a light source disposed to emit light toward the tube passage such that the emitted light will impinge upon one or more tubes placed in the tube passage, and a detector to detect the light emitted by the light source from the tube passage. The intensity of the detected light depends on the position of the tube. The detector can either be disposed to detect light reflected by the tube(s) or light transmitted past the tube(s). A method is also disclosed for aligning tubes in an orbital welder including the steps of emitting light from the light source into the tube passage, monitoring the light from the tube passage with the detector, and providing a signal indicative of the position of the tube(s) based on the intensity of the detected light.

Abstract: A system and method for wet cleaning a semiconductor wafer utilizes a nozzle assembly to combine two or more input fluids to form a cleaning fluid at the point-of-use. The input fluids are received at the nozzle assembly and combined in a chamber of the nozzle assembly to form the cleaning fluid. The nozzle assembly may include an acoustic transducer to generate an acoustic energy, one or more valves, e.g., three-way valves, to control the receipt of input fluids and/or a flow control mechanism, e.g., a pressure spring valve, to control dispensing of the cleaning fluid onto a surface of the semiconductor wafer.