Patents by Inventor Kent E. Regnier

Kent E. Regnier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240061988
    Abstract: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to the chip package.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Brian Keith Lloyd, Gregory Walz, Ayman Isaac, Kent E. Regnier, Bruce Reed
  • Patent number: 11842138
    Abstract: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to the chip package.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: December 12, 2023
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory Walz, Ayman Isaac, Kent E. Regnier, Bruce Reed
  • Publication number: 20230253743
    Abstract: A connector system for a pluggable IO connector is disclosed that includes a plug with two rows of pads on two sides of a mating blade and a receptacle with two connection regions that is configured to engage the two rows of pads. In an embodiment the connector system can support double the data bandwidth of a typical connector, such as a QSFP connector, while allowing for backward compatibility with convention plug assemblies that have a single row of pads on each side the mating blade.
    Type: Application
    Filed: April 21, 2023
    Publication date: August 10, 2023
    Inventor: Kent E. Regnier
  • Patent number: 11641082
    Abstract: A connector system for a pluggable IO connector is disclosed that includes a plug with two rows of pads on two sides of a mating blade and a receptacle with two connection regions that is configured to engage the two rows of pads. In an embodiment the connector system can support double the data bandwidth of a typical connector, such as a QSFP connector, while allowing for backward compatibility with convention plug assemblies that have a single row of pads on each side the mating blade.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 2, 2023
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 11621530
    Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector defines a card-receiving slot and is position in a cage that defines the connector port. The cables exit from the rear of the connector and from the connector port. The connector includes a heat sink that is configured to cool a module inserted into the connector port.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 4, 2023
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory B. Walz, Bruce Reed, Gregory Fitzgerald, Ayman Isaac, Kent E. Regnier, Brandon Janowiak, Darian R. Schulz, Munawar Ahmad, Eran J. Jones, Javier Resendez, Michael Rost
  • Publication number: 20220247114
    Abstract: A receptacle is depicted. The receptacle can provide two rows of terminals to increase the density of the interface. If desired, a connector positioned in the receptacle can omit the use of a housing, even if the receptacle provides a stacked connector configuration. With the use of various airflow features it is possible to cool inserted plug modules that use more than 6 watts and potentially more than 8 watts of power.
    Type: Application
    Filed: April 18, 2022
    Publication date: August 4, 2022
    Applicant: Molex, LLC
    Inventors: Hazelton AVERY, Kent E. REGNIER
  • Patent number: 11309655
    Abstract: A receptacle is depicted. The receptacle can provide two rows of terminals to increase the density of the interface. If desired, a connector positioned in the receptacle can omit the use of a housing, even if the receptacle provides a stacked connector configuration. With the use of various airflow features it is possible to cool inserted plug modules that use more than 6 watts and potentially more than 8 watts of power.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: April 19, 2022
    Inventors: Hazelton Avery, Kent E. Regnier
  • Patent number: 11258214
    Abstract: A connector system includes a plug assembly that has a front connector mounted to a circuit board. The connecter has two wafers that each support a row of terminals and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. The wafers need not be directly contacting the circuit board and the terminals can have tails that can be positioned slightly above the circuit board and connector to pads on the circuit board via solder connections. The connector system is optimized so as to enable support of 25 Gbps data rates.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: February 22, 2022
    Assignee: Molex, LLC
    Inventors: Brandon Janowiak, Kent E. Regnier, Jerry Kachlic
  • Publication number: 20220004692
    Abstract: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to the chip package.
    Type: Application
    Filed: September 17, 2021
    Publication date: January 6, 2022
    Applicant: Molex, LLC
    Inventors: Brian Keith LLOYD, Gregory WALZ, Ayman ISAAC, Kent E. REGNIER, Bruce REED
  • Patent number: 11171443
    Abstract: A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector. A plurality of connectors can be supported and a heat spreader can be associated with each connector. One or more thermal plates can be thermally coupled to the corresponding heat spreader(s) so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreader to the corresponding thermal plates.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: November 9, 2021
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 11151300
    Abstract: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to third connectors that are connected to the chip package.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: October 19, 2021
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory Walz, Ayman Isaac, Kent E. Regnier, Bruce Reed
  • Patent number: 11114807
    Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector defines a card-receiving slot and is position in a cage that defines the connector port. The cables exit from the rear of the connector and from the connector port.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: September 7, 2021
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory B. Walz, Bruce Reed, Gregory Fitzgerald, Ayman Isaac, Kent E. Regnier, Brandon Janowiak, Darian R. Schulz, Munawar Ahmad, Eran J. Jones, Javier Resendez, Michael Rost
  • Publication number: 20210242643
    Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector defines a card-receiving slot and is position in a cage that defines the connector port. The cables exit from the rear of the connector and from the connector port. The connector includes a heat sink that is configured to cool a module inserted into the connector port.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Applicant: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory B. Walz, Bruce Reed, Gregory Fitzgerald, Ayman Isaac, Kent E. Regnier, Brandon Janowiak, Darian R. Schulz, Munawar Ahmad, Eran J. Jones, Javier Resendez, Michael Rost
  • Publication number: 20210209285
    Abstract: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to third connectors that are connected to the chip package.
    Type: Application
    Filed: January 19, 2017
    Publication date: July 8, 2021
    Applicant: Molex, LLC
    Inventors: Brian Keith LLOYD, Gregory WALZ, Ayman ISAAC, Kent E. REGNIER, Bruce REED
  • Patent number: 11051429
    Abstract: A connector system with improved thermal management is provided. Various receptacles are provided that include features which may enhance air flow, and therefore cooling. Thermal channel features in the receptacle cage and/or housing allow air passing through the receptacle to directly remove thermal energy from components within and carry the thermal energy out of the cage.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: June 29, 2021
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 10950982
    Abstract: A connector is provided that includes a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground wafers that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: March 16, 2021
    Assignee: Molex, LLC
    Inventors: Kent E. Regnier, Patrick R. Casher
  • Patent number: 10950997
    Abstract: A plug module is provided that includes a first mating end and a second mating end. The first mating end is configured to mate with a predefined port, such as a QSFP port. The second mating end can support two or more micro receptacles that allow the plug module to provide an octopus-like cable assembly without requiring the predetermination of a particular length of cable.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: March 16, 2021
    Assignee: Molex, LLC
    Inventors: Philip J. Dambach, Kent E. Regnier
  • Patent number: 10895703
    Abstract: A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted into such a receptacle and the plug module can include grooves to help allow for direct cooling of the plug module, even when inserted into the receptacle.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: January 19, 2021
    Assignee: Molex, LLC
    Inventors: Kent E. Regnier, Jerry D. Kachlic
  • Publication number: 20200403358
    Abstract: A connector system includes a plug assembly that has a front connector mounted to a circuit board. The connecter has two wafers that each support a row of terminals and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. The wafers need not be directly contacting the circuit board and the terminals can have tails that can be positioned slightly above the circuit board and connector to pads on the circuit board via solder connections. The connector system is optimized so as to enable support of 25 Gbps data rates.
    Type: Application
    Filed: September 4, 2020
    Publication date: December 24, 2020
    Applicant: Molex, LLC
    Inventors: Brandon JANOWIAK, Kent E. REGNIER, Jerry KACHLIC
  • Publication number: 20200367385
    Abstract: A connector system with improved thermal management is provided. Various receptacles are provided that include features which may enhance air flow, and therefore cooling. Thermal channel features in the receptacle cage and/or housing allow air passing through the receptacle to directly remove thermal energy from components within and carry the thermal energy out of the cage.
    Type: Application
    Filed: August 7, 2020
    Publication date: November 19, 2020
    Applicant: Molex, LLC
    Inventor: Kent E. Regnier