Abstract: A micro light-emitting element includes: a micro light-emitting diode (LED) element configured to emit excitation light; and a wavelength conversion portion containing a nano particle configured to absorb the excitation light to emit light having a longer wavelength than the excitation light. The wavelength conversion portion has, on at least a light emitting surface of the wavelength conversion portion, a stack of one or more layers including an oxygen absorption film.

Abstract: A semiconductor module comprises an underlayer substrate on which a drive circuit is formed; a light-emitting element electrically coupled to the drive circuit; and a color conversion layer formed on the light-emitting element and containing a color conversion material that absorbs light emitted from the light-emitting element and converts a luminescent color of the light-emitting element to another luminescent color, wherein the color conversion material contained in the color conversion layer is present more on a light-emitting element side of the color conversion layer than on a side opposite to the light-emitting element side of the color conversion layer.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

Abstract: An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: An object of the present invention is to provide a coated article having excellent finish and corrosion resistance unaffected by a chemical conversion coating solution even if water washing after a pretreatment step is omitted and a pretreatment solution is carried as a contaminant into an electrodeposition coating composition. The present invention provides a method for forming a multilayer coating film comprising a chemical conversion coating film (F1) and an electrodeposition coating film (F2); the method comprising the following steps. Step 1: immersing a metal substrate in a coating film forming agent (1) as a chemical conversion coating solution to form a chemical conversion coating film (F1); and Step 2: without water washing, subjecting the metal substrate to electrodeposition coating using a coating film forming agent (2) as a cationic electrodeposition coating composition (I) to form an electrodeposition coating film (F2).

Abstract: The object of the present invention is to provide a process for producing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process; and a surface treatment process that is capable of providing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process. Specifically, the present invention provides a process for producing a surface-treated metal substrate, comprising the steps of immersing a metal substrate for use as a cathode in a treatment composition (I) comprising water and metal component (A), and applying electric current thereto for 10 to 600 seconds by superposing an AC voltage (Va) with a frequency of 0.1 to 1,000 Hz and a peak-to-peak voltage of 1 to 40 V onto a 1 to 50 V DC voltage (Vd).

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: The object of the present invention is to provide a process for producing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process; and a surface treatment process that is capable of providing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process. Specifically, the present invention provides a process for producing a surface-treated metal substrate, comprising the steps of immersing a metal substrate for use as a cathode in a treatment composition (I) comprising water and metal component (A), and applying electric current thereto for 10 to 600 seconds by superposing an AC voltage (Va) with a frequency of 0.1 to 1,000 Hz and a peak-to-peak voltage of 1 to 40 V onto a 1 to 50 V DC voltage (Vd).

Abstract: The present invention provides a process for producing a metal substrate with a multilayer film that has excellent corrosion resistance. Specifically, the process comprising immersing a metal substrate in an aqueous bismuth compound solution (A) and applying an electric current between the metal substrate and an electrode to thereby form a coating film (F1) on the metal substrate; and then applying a coating composition (B) on the coating film (F1) to form a coating film (F2).

Abstract: An object of the present invention is to provide a coated article having excellent finish and corrosion resistance unaffected by a chemical conversion coating solution even if water washing after a pretreatment step is omitted and a pretreatment solution is carried as a contaminant into an electrodeposition coating composition. The present invention provides a method for forming a multilayer coating film comprising a chemical conversion coating film (F1) and an electrodeposition coating film (F2); the method comprising the following steps. Step 1: immersing a metal substrate in a coating film forming agent (1) as a chemical conversion coating solution to form a chemical conversion coating film (F1); and Step 2: without water washing, subjecting the metal substrate to electrodeposition coating using a coating film forming agent (2) as a cationic electrodeposition coating composition (I) to form an electrodeposition coating film (F2).

Abstract: Objects of the present invention is to provide a zinc-based alloy electroplated film having a high corrosion resistance comparable to Zn—Cr alloy plating without containing chromium which gives a heavy environmental load, and a plated metal material using the same. The present invention relates to a zinc-based alloy electroplated film excellent in corrosion resistance containing (A) 30 to 96% by weight of zinc, (B) 2 to 20% by weight of an iron-group metal, and (C) 2 to 50% by weight of tungsten.

Abstract: An object of the invention is to provide an electroplating solution composition capable of obtaining a plated film excellent in adhesiveness to a coated film and excellent in corrosion resistance without surface treatment. The present invention relates to an organic polymer composite zinc alloy electroplating solution composition containing: (A) 1 to 600 g/l of Zn ion, (B) 1 to 600 g/l of an iron-group-element ion, and (C) 0.1 to 200 g/l, in terms of W ion, of tungstic acid-based compound, and (D) 0.5 to 500 g/l of water-soluble or water-dispersible organic polymer compound having a number average molecular weight of 1,000 to 1,000,000.