Patents by Inventor Kentarou MIYAJIMA
Kentarou MIYAJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10732062Abstract: To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.Type: GrantFiled: August 3, 2016Date of Patent: August 4, 2020Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Konno, Hiroshi Kikuchi, Kentarou Miyajima, Munenori Degawa
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Patent number: 10536141Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.Type: GrantFiled: September 18, 2015Date of Patent: January 14, 2020Assignee: Hitachi Automotive Systems, Ltd.Inventors: Shigenobu Komatsu, Kentarou Miyajima, Hiroshi Onuki, Junji Onozuka
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Patent number: 10481023Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.Type: GrantFiled: January 26, 2015Date of Patent: November 19, 2019Assignee: Hitachi Automotive Systems, Ltd.Inventors: Hanae Shimokawa, Hiroyuki Oota, Atsushi Kazama, Shohei Hata, Takuto Yamaguchi, Atsuo Soma, Kisho Ashida, Junji Onozuka, Kentarou Miyajima, Masayuki Hio
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Patent number: 10408692Abstract: Provided are a mechanical quantity measurement device having a higher signal-to-noise ratio and resolution than the prior art and a pressure sensor using the same. A mechanical quantity measurement device that is provided with a plurality of Wheatstone bridges on the main surface of a single semiconductor substrate that are composed from impurity-diffused resistors and detect the difference between the strain amount occurring in the x-axis direction and the strain amount occurring in the y-axis direction, which intersect at right angles on the main surface of the semiconductor substrate, said mechanical quantity measurement device being characterized in that the impurity-diffused resistors composing the plurality of Wheatstone bridges are disposed evenly in an area to be measured.Type: GrantFiled: July 29, 2016Date of Patent: September 10, 2019Assignee: Hitachi Automotive Systems, Ltd.Inventor: Kentarou Miyajima
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Patent number: 10197463Abstract: Provided are a dynamic quantity measuring device having higher accuracy and longer-term reliability than in the prior art, and a pressure sensor using the same. A dynamic quantity measuring device is provided with a first Wheatstone bridge configured by an impurity diffused resistor on a principal surface of one semiconductor substrate, and detects a difference between strain quantities respectively generated in an x-axis direction and a y-axis direction that are orthogonal to each other on the principal surface of the semiconductor substrate by the first Wheatstone bridge, the dynamic quantity measuring device being provided with, on the principal surface of the semiconductor substrate, a second Wheatstone bridge for detecting the strain quantity in the x-axis direction, and a third Wheatstone bridge for detecting the strain quantity in the y-axis direction.Type: GrantFiled: June 1, 2015Date of Patent: February 5, 2019Assignee: Hitachi Automotive Systems, Ltd.Inventor: Kentarou Miyajima
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Publication number: 20180274999Abstract: To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.Type: ApplicationFiled: August 3, 2016Publication date: September 27, 2018Inventors: Takeshi KONNO, Hiroshi KIKUCHI, Kentarou MIYAJIMA, Munenori DEGAWA
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Publication number: 20180241388Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.Type: ApplicationFiled: September 18, 2015Publication date: August 23, 2018Inventors: Shigenobu KOMATSU, Kentarou MIYAJIMA, Hiroshi ONUKI, Junji ONOZUKA
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Publication number: 20180164168Abstract: Provided are a mechanical quantity measurement device having a higher signal-to-noise ratio and resolution than the prior art and a pressure sensor using the same. A mechanical quantity measurement device that is provided with a plurality of Wheatstone bridges on the main surface of a single semiconductor substrate that are composed from impurity-diffused resistors and detect the difference between the strain amount occurring in the x-axis direction and the strain amount occurring in the y-axis direction, which intersect at right angles on the main surface of the semiconductor substrate, said mechanical quantity measurement device being characterized in that the impurity-diffused resistors composing the plurality of Wheatstone bridges are disposed evenly in an area to be measured.Type: ApplicationFiled: July 29, 2016Publication date: June 14, 2018Inventor: Kentarou MIYAJIMA
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Patent number: 9960641Abstract: A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.Type: GrantFiled: January 16, 2015Date of Patent: May 1, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Katsuei Ichikawa, Atsuo Soma, Kentarou Miyajima, Kisho Ashida, Makoto Ishii, Motohiro Sasaki, Keisuke Iwaishi, Yuuya Urushihata
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Patent number: 9958345Abstract: A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate back surface, a power receiving-side coil is formeType: GrantFiled: January 16, 2015Date of Patent: May 1, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Katsuei Ichikawa, Atsuo Soma, Kentarou Miyajima, Kisho Ashida, Makoto Ishii, Motohiro Sasaki, Keisuke Iwaishi, Yuuya Urushihata
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Publication number: 20170199096Abstract: Provided are a dynamic quantity measuring device having higher accuracy and longer-term reliability than in the prior art, and a pressure sensor using the same. A dynamic quantity measuring device is provided with a first Wheatstone bridge configured by an impurity diffused resistor on a principal surface of one semiconductor substrate, and detects a difference between strain quantities respectively generated in an x-axis direction and a y-axis direction that are orthogonal to each other on the principal surface of the semiconductor substrate by the first Wheatstone bridge, the dynamic quantity measuring device being provided with, on the principal surface of the semiconductor substrate, a second Wheatstone bridge for detecting the strain quantity in the x-axis direction, and a third Wheatstone bridge for detecting the strain quantity in the y-axis direction.Type: ApplicationFiled: June 1, 2015Publication date: July 13, 2017Applicant: Hitachi Automotive Systems, Ltd.Inventor: Kentarou MIYAJIMA
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Publication number: 20170108390Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.Type: ApplicationFiled: January 26, 2015Publication date: April 20, 2017Inventors: Hanae SHIMOKAWA, Hiroyuki OOTA, Atsushi KAZAMA, Shohei HATA, Takuto YAMAGUCHI, Atsuo SOMA, Kisho ASHIDA, Junji ONOZUKA, Kentarou MIYAJIMA, Masayuki HIO
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Publication number: 20160352148Abstract: A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.Type: ApplicationFiled: January 16, 2015Publication date: December 1, 2016Inventors: Katsuei ICHIKAWA, Atsuo SOMA, Kentarou MIYAJIMA, Kisho ASHIDA, Makoto ISHll, Motohiro SASAKI, Keisuke IWAISHI, Yuuya URUSHIHATA
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Publication number: 20160327444Abstract: A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate hack surface, a power receiving-side coil is formeType: ApplicationFiled: January 16, 2015Publication date: November 10, 2016Inventors: Katsuei ICHIKAWA, Atsuo SOMA, Kentarou MIYAJIMA, Kisho ASHIDA, Makoto ISHll, Motohiro SASAKI, Keisuke IWAISHI, Yuuya URUSHIHATA