Patents by Inventor Kento TAKAHASHI
Kento TAKAHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240158192Abstract: A recording apparatus includes a feed roller, a conveyance roller, a recording unit, a reverse path, and a control unit. The conveyance roller conveys a sheet fed by the feed roller. The recording unit performs recording on the conveyed sheet. The reverse path reverses, in the reverse path, a traveling direction of the sheet on which the recording is performed. The control unit performs control so that a leading edge of a second sheet overlaps a first sheet on which recording is being performed by the recording unit. Recording on the second sheet is to be performed by the recording unit following the recording on the first sheet. The control unit performs control to reverse the traveling direction of the first sheet and the traveling direction of the second sheet in the reverse path while maintaining an overlapping state of the first sheet and the second sheet.Type: ApplicationFiled: November 10, 2023Publication date: May 16, 2024Inventors: SHO TAKAHASHI, MASASHI ITO, MOTOYUKI TAGUCHI, KEISUKE ARITA, KENTO TAMARI, RYOTA KOMATSU
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Patent number: 11849538Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.Type: GrantFiled: August 24, 2021Date of Patent: December 19, 2023Assignees: NGK ELECTRONICS DEVICES, INC., NGK INSULATORS, LTD., Fujitsu Optical Components LimitedInventors: Noboru Kubo, Masato Ishizaki, Kento Takahashi
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Publication number: 20230073273Abstract: A rubber composition is prepared by mixing a specific hydrazide compound at a ratio of 0.5 to 3.0 parts by mass, zinc oxide at a ratio of 1 to 5 parts by mass, and carbon black having N2SA of 60 to 150 m2/g at a ratio of 30 to 60 parts by mass per 100 parts by mass of diene rubber containing 80 parts by mass or more of natural rubber. The rubber composition is prepared through (a) mixing the hydrazide compound and the carbon black to obtain a mixture, and (b) mixing the zinc oxide with the mixture obtained in step (a) to obtain a mixture. A maximum ultimate temperature during the mixture in step (a) is from 140 to 170° C. A storage modulus and elongation at break have a specific relationship.Type: ApplicationFiled: December 24, 2020Publication date: March 9, 2023Inventor: Kento TAKAHASHI
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Publication number: 20220416513Abstract: Disclosed are an element comprising a substrate and at least two different optoelectronic devices, wherein the at least two different optoelectronic devices are monolithically fabricated on the substrate; and a method for producing the same. Also disclosed is an organic semiconductor laser diode comprising a substrate, an insulating grating, a first electrode, an organic layer and a second electrode in this order.Type: ApplicationFiled: November 27, 2020Publication date: December 29, 2022Inventors: Fatima BENCHEIKH, Takashi FUJIHARA, Jean Charles Maurice RIBIERRE, Ryutaro KOMATSU, Chihaya ADACHI, Kento TAKAHASHI, Nobuhiro TAKEISHI
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Patent number: 11495589Abstract: An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.Type: GrantFiled: March 2, 2020Date of Patent: November 8, 2022Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventors: Kento Takahashi, Teruhiro Kubo, Hiroshi Kobayashi
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Publication number: 20220151060Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.Type: ApplicationFiled: August 24, 2021Publication date: May 12, 2022Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd., Fujitsu Optical Components LimitedInventors: Noboru KUBO, Masato ISHIZAKI, Kento TAKAHASHI
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Publication number: 20200286874Abstract: An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.Type: ApplicationFiled: March 2, 2020Publication date: September 10, 2020Applicant: FUJITSU OPTICAL COMPONENTS LIMITEDInventors: Kento TAKAHASHI, Teruhiro KUBO, Hiroshi KOBAYASHI
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Publication number: 20200235361Abstract: A method of producing a separator (20) of the present invention is a method of producing the separator (20) which includes a resin layer (21), and a ceramic layer (23) provided on one surface of the resin layer (21), the method including a step of cutting the separator into a predetermined size by irradiating the separator with a laser having a wavelength of greater than or equal to 300 nm and less than or equal to 600 nm from a side of the ceramic layer (23). Further, the separator (20) of the present invention includes the resin layer (21), the ceramic layer (23) which is provided on one surface of the resin layer (21), and a curled portion (27) which is formed by curling at least one end portion (25) of the separator (20) toward a surface on a side of the resin layer (21).Type: ApplicationFiled: January 30, 2018Publication date: July 23, 2020Applicant: Envision AESC Energy Devices Ltd.Inventors: Kento TAKAHASHI, Fumiaki OBONAI
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Publication number: 20190181414Abstract: This battery is provided with: an electrode assembly (20) resulting from stacking a positive electrode, a negative electrode, and a separator arranged between the positive electrode and the negative electrode, and an external sheathing film (12) composed of a pair of resin layers, of which outer peripheries are heat-welded together, and that sandwich the electrode assembly (20). At least one of the electrode assembly has a protruding part (24) that protrudes from the electrodes, and is interposed at a peripheral area by the welded portion of the external sheathing film (12), and that restrains movement of the separators.Type: ApplicationFiled: April 25, 2017Publication date: June 13, 2019Applicant: NEC ENERGY DEVICES, LTD.Inventor: Kento TAKAHASHI
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Patent number: D1019309Type: GrantFiled: April 14, 2022Date of Patent: March 26, 2024Assignee: MAKITA CORPORATIONInventors: Kento Nakamura, Satoshi Takahashi