Abstract: A binder composition contains an organic solvent and a binder that includes a particulate polymer A and a highly soluble polymer B. The particulate polymer A includes an ethylenically unsaturated acid monomer unit in a proportion of not less than 1.0 mass % and not more than 10.0 mass % and a (meth)acrylic acid ester monomer unit in a proportion of not less than 30.0 mass % and not more than 98.0 mass %. The particulate polymer A includes two particulate polymers A1 and A2 having different volume-average particle diameters. The volume-average particle diameters D50A1 and D50A2 of these particulate polymers A1 and A2 satisfy a formula: D50A2>D50A1?50 nm.

Abstract: The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.

Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

Abstract: To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract: A laminated film preferable as a PPF material. The laminated film is formed, in which a coating layer formed of a cured material of a photopolymerizable coating liquid, a base material layer formed of thermoplastic polyurethane, and an adhesive layer formed of a pressure sensitive adhesive are formed in contact with each other in the order, the photopolymerizable coating liquid is composed of component (a): urethane acrylate and component (b): photopolymerizable acrylic compounds having no urethane unit and containing a fluorine atom, and component (a) and component (b) are mixed at a proportion of (a): 20% by weight or more and less than 50% by weight and (b): 50% by weight or more and less than 80% by weight, based on 100 parts by weight of the photopolymerizable coating liquid.

Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract: The problem is to produce automotive interior and exterior parts that are excellent in performance and designability. The means for solving the problem is a surface-modified film for automotive interior and exterior parts, in which a surface protective layer is laminated on one side of a polycarbonate base material film, the surface protective layer is a cured product of a photopolymerizable urethane acrylate composition, the photopolymerizable urethane acrylate composition contains photopolymerizable urethane acrylate mixture (A), photopolymerization initiator (C), and further, when necessary, filler (B), and component (A) contains photopolymerizable urethane acrylic polymer (a1), polyfunctional acrylate compound (a2), fluorine-containing photopolymerizable acrylic compound (a3) and photopolymerizable acrylate oligomer having a fluorosilsesquioxane derivative unit (a4).

Abstract: The present invention aims to provide a sealant for sealing liquid crystal and a liquid crystal display device, which can sufficiently reduce image sticking and stains at the periphery of a liquid crystal display. The sealant for sealing liquid crystal of the present invention contains a curable resin and a radical polymerization initiator, wherein the radical polymerization initiator contains a silsesquioxane group. The silsesquioxane group is preferably a group represented by the following formula (I) or (II): wherein R1s are the same as or different from each other and each represent a monovalent organic group; R2 represents a divalent linking group; R3s are the same as or different from each other and each represent a monovalent organic group; and R4 represents a divalent linking group.

Abstract: A laminated film appropriate as a PPF material which has a three-layer structure in which a top coating layer including a urethane acrylate cured product, a substrate layer including polycarbonate thermoplastic polyurethane, and an adhesive layer including a pressure sensitive adhesive are in contact in that order. Preferably, the top coating layer includes a unit derived from ?-methacryloxypropylhepta(trifluoropropyl)-T8-silsesquioxane.

Abstract: Provided is a coating agent that can be formed into a surface layer having excellent self-restoring properties and stain-proof properties by applying the coating agent onto a surface of a base material (for example, thermoplastic polyurethane) and curing the resulting material. The coating agent according to the present application contains urethane (meth)acrylate-based resin (a), fluorine-based compound (b) and photopolymerization initiator (d). Urethane (meth)acrylate-based resin (a) has weight average molecular weight (Mw) of 10,000 to 800,000. Fluorine-based compound (b) has at least two polymerizable functional groups. The surface layer formed of the coating agent has excellent self-restoring properties of a scratch, stain-proof properties and stretchability.

Abstract: Provided is a coating agent that can be formed into a surface layer having excellent self-restoring properties and stain-proof properties by applying the coating agent onto a surface of a base material (for example, thermoplastic polyurethane) and curing the resulting material. The coating agent according to the present application contains urethane (meth)acrylate-based resin (a), fluorine-based compound (b) and photopolymerization initiator (d). Urethane (meth)acrylate-based resin (a) has weight average molecular weight (Mw) of 10,000 to 800,000. Fluorine-based compound (b) has at least two polymerizable functional groups. The surface layer formed of the coating agent has excellent self-restoring properties of a scratch, stain-proof properties and stretchability.

Abstract: To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.

Abstract: The transfer film for in-mold molding of the invention has transfer layer 11 being a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L0. Transfer layer 11 has topcoat layer L2 laminated on base L0 to be arranged on a surface of a molded product after in-mold molding; and conductor layer L4 laminated on a side opposite to a base L0 side of topcoat layer L2, and laminated on topcoat layer L2. Topcoat layer L2 is composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer L4 is formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer.

Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).