Patents by Inventor Kenya Kawabata
Kenya Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10976112Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases.Type: GrantFiled: November 7, 2019Date of Patent: April 13, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Yoshikatsu Inagaki
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Publication number: 20210022265Abstract: The present disclosure provides a cooling device that can exhibit excellent cooling characteristics while avoiding increase in size of the device, and a cooling system using the cooling device. The cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant sealed in an inside of the container, and a condensation tube through which a secondary refrigerant flows, and which penetrates through a gaseous phase portion inside of the container.Type: ApplicationFiled: October 1, 2020Publication date: January 21, 2021Applicant: Furukawa Electric Co., Ltd.Inventors: Yoshikatsu INAGAKI, Hirofumi AOKI, Hiroshi OKADA, Kenya KAWABATA, Tomoaki TORATANI
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Publication number: 20210007246Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200400379Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.Type: ApplicationFiled: September 2, 2020Publication date: December 24, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200400381Abstract: The present disclosure provides a heatsink that includes a lightweight heat transport member having good pressure resistance against atmospheric pressure without impairing flowability of a gas-phase working fluid, and that can equalize a heat input in a heat receiving portion of the heat transport member.Type: ApplicationFiled: September 2, 2020Publication date: December 24, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200393201Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.Type: ApplicationFiled: September 1, 2020Publication date: December 17, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200390003Abstract: Example embodiments may provide a heat sink that cools a heating element. The heat sink may include a heat receiving unit thermally connected to a heating element, a plurality of heat pipes thermally connected to the heat receiving unit at a predetermined part, and a heat dissipation unit thermally connected to another part different from the predetermined part of the plurality of heat pipes.Type: ApplicationFiled: August 25, 2020Publication date: December 10, 2020Applicant: Furukawa Electric Co., Ltd.Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI
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Publication number: 20200355443Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: ApplicationFiled: July 21, 2020Publication date: November 12, 2020Applicant: Furukawa Electric Co., Ltd.Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
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Publication number: 20200326131Abstract: Example embodiments may provide a heat sink capable of cooling even when hot spots generate a large amount of heat that is unevenly distributed in some regions of a heating element package. The heat sink may include a plurality of heat pipes including one end portions thermally connected to a heating element package provided with a heating element in a package and other end portions thermally connected to a heat dissipation unit, in which the plurality of heat pipes includes at least a first heat pipe and a second heat pipe having greater heat transport capacity than heat transport capacity of the first heat pipe.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: Furukawa Electric Co., Ltd.Inventors: Shuta HIKICHI, Kenya KAWABATA, Masahiro MEGURO, Hiroshi SAKAI, Masato WATANABE, Yasuhiro UCHIMURA
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Patent number: 10760855Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: GrantFiled: January 31, 2020Date of Patent: September 1, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
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Patent number: 10718572Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: GrantFiled: January 31, 2020Date of Patent: July 21, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
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Publication number: 20200191494Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: ApplicationFiled: February 21, 2020Publication date: June 18, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA
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Patent number: 10677535Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.Type: GrantFiled: January 31, 2020Date of Patent: June 9, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Yasumi Sasaki, Yosuke Watanabe
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Patent number: 10677534Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: GrantFiled: January 31, 2020Date of Patent: June 9, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
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Publication number: 20200173730Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: ApplicationFiled: January 31, 2020Publication date: June 4, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Tatsuro MIURA, Toshiaki NAKAMURA, Kenya KAWABATA, Yoshikatsu INAGAKI
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Publication number: 20200173731Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.Type: ApplicationFiled: January 31, 2020Publication date: June 4, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya KAWABATA, Yasumi SASAKI, Yosuke WATANABE
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Patent number: 10667430Abstract: Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation.Type: GrantFiled: December 31, 2018Date of Patent: May 26, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Hirofumi Aoki
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Publication number: 20200149823Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases.Type: ApplicationFiled: November 7, 2019Publication date: May 14, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI
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Patent number: 10598441Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.Type: GrantFiled: November 14, 2017Date of Patent: March 24, 2020Assignee: Furukawa Electric Co., Ltd.Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
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Patent number: 10571199Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: GrantFiled: January 10, 2018Date of Patent: February 25, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata